Pedestal surface for mosfet module

Patent metadata

Field	Value
Publication number	US-2016104658-A1
Application number	US-201514876674-A
Country	US
Kind code	A1
Filing date	Oct 6, 2015
Priority date	Oct 8, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

An electronic package connectable to an electric machine includes a cooling tower having a metallic wall with a radially outer wall surface. The radially outer wall surface includes discrete, radially outwardly projecting pedestals. The planar pedestal mounting surfaces are parallel with the central axis such that the radial distance between the axis and the radially outer wall surface is greater within the periphery than outside the periphery. Power modules are mounted to the pedestals. Each power module includes a base in thermal contact with a pedestal mounting surface and an opposing interior surface in thermal communication with a MOSFET power electronics device. A cover plate is spaced from the base interior surface. A dielectric housing member surrounds the MOSFET power electronics devices. An electrical connection terminal is disposed outside the periphery of each module. An electric machine including such an electronic package is also disclosed.

First claim

What is claimed is:

1 . An electronic package adapted for connection to a rear frame member of an electric machine, the electronic package comprising:
a cooling tower comprising a metallic wall extending about a cooling tower central axis to define a radially outer wall surface, the radially outer wall surface provided with a plurality of discrete, radially outwardly projecting pedestals at circumferentially distributed locations about the cooling tower central axis, each pedestal defining the periphery of a planar mounting surface, the respective mounting surface of each pedestal parallel with the cooling tower central axis, wherein the radial distance between the cooling tower central axis and the radially outer wall surface is greater within the periphery of each pedestal mounting surface than outside the periphery of the respective pedestal mounting surface; and a plurality of power modules mounted to the pedestal mounting surfaces, each power module comprising:
a planar metallic base defining a module mounting surface and an opposing base interior surface, the module mounting surface and the respective pedestal mounting surface in mutual surface-to-surface contact, whereby the power module base and the cooling tower are in conductive thermal communication with each other,
MOSFET power electronics devices attached to and in conductive thermal communication with the base interior surface;
a metallic cover plate in spaced superposition relative to the base interior surface and electrically isolated from the MOSFET power devices,
a dielectric housing member defining a module housing wall surrounding the MOSFET power electronics devices and disposed between the base and the cover plate, and
an electrical connection terminal communicating with the power electronics devices and disposed outside the periphery of the base module mounting surface.

2 . The electronic package of claim 1 , wherein the cover plate is coextensive with an imaginary plane that is substantially parallel with the base interior surface of the respective power module.

3 . The electronic package of claim 1 , wherein the module housing wall extends in a radial direction between the base and the cover plate of the respective power module.

4 . The electronic package of claim 1 , wherein the cooling tower is at ground potential.

5 . The electronic package of claim 1 , wherein the peripheries of the contacting module mounting surface and the pedestal mounting surface are of substantially identical shape and size.

6 . The electronic package of claim 1 , wherein each power module comprises an electrically insulating layer intermediate the MOSFET power devices and base interior surface thereof, the MOSFET power devices attached to and in conductive thermal communication with the base interior surface through the intermediate electrically insulating layer.

7 . The electronic package of claim 1 , wherein the module housing wall extends along the periphery of the base.

8 . The electronic package of claim 1 , wherein a portion of the module housing member is disposed outside the periphery of the pedestal mounting surface and is in spaced superposition relative to the radially outer wall surface, and wherein a gutter is defined between the superposed radially outer wall surface and the module housing member portion along which splash and splash-borne contaminants are guided away from the power module, whereby separation distances are provided across which conductive traces of the contaminants are less likely to build up and result in current leakage from the module.

9 . The electronic package of claim 8 , wherein the module housing member portion extends beyond the periphery of the pedestal mounting surface in a plane parallel with the base mounting surface.

10 . The electronic package of claim 8 , wherein the pedestal defines a plurality of ledges extending between the respective power module and the radially outer wall surface that surrounds the pedestal.

11 . The electronic package of claim 10 , wherein the gutter has a floor defined by a ledge.

12 . The electronic package of claim 1 , wherein the entirety of each pedestal mounting surface is radially distanced from the radially outer wall surface outside the periphery of the pedestal mounting surface, whereby radially projecting sides of the pedestal provide electrical clearance between the electrical connection terminals and the radially outer wall surface.

13 . The electronic package of claim 1 , wherein the pedestals are equiangularly distributed about the radially outer wall surface.

14 . The electronic package of claim 1 , wherein the pedestals are equidistance along the cooling tower central axis from an imaginary plane perpendicular to the cooling tower central axis.

15 . The electronic package of claim 1 , wherein the metallic wall defines a radially inner wall surface, and the mass per unit area of the metallic wall in a radial direction between the radially inner wall surface and the radially outer wall surface is greater within the periphery of a pedestal mounting surface than outside of the periphery of the pedestal mounting surface, whereby the thermal mass of the metallic wall is relatively greater in close proximity to the power modules.

16 . The electronic package of claim 1 , where the metallic wall defines a radially inner wall surface, and the thickness of the metallic wall between the radially inner wall surface and the radially outer wall surface is greater within the periphery of a pedestal mounting surface than outside the periphery of the pedestal mounting surface.

17 . The electronic package of claim 1 , wherein each pedestal mounting surface is oriented tangentially relative to an imaginary circle concentric with and oriented perpendicularly relative to the cooling tower central axis.

18 . The electronic package of claim 1 , wherein the radial distances from the cooling tower central axis to the radially outer wall surface are greatest at the pedestal locations, whereby machining to flatten the pedestal mounting surfaces of a cooling tower's entire plurality of pedestals at once is facilitated.

19 . The electronic package of claim 1 , wherein the radial distances from the cooling tower central axis to the radially outer wall surface are greatest along circumferentially opposite edges of the pedestal mounting surfaces.

20 . An electric machine comprising a stator defining the machine central axis, a rotor surrounded by and rotatable relative to the stator about the machine central axis, a rear frame member rotatably fixed relative to the stator and through which the machine central axis extends, and an electronic package according to claim 1 ,
wherein the machine central axis extends through the electronic package and the cooling tower is connected to the rear frame member.

21 . The electric machine of claim 20 , wherein the machine central axis and the cooling tower central axis coincide.

Assignees

• Remy Technologies Llc

Inventors

• Bradfield Michael D

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/43 Primary

  by flowing gases, e.g. forced air cooling · CPC title

• H02K11/05

  Rectifiers associated with casings, enclosures or brackets · CPC title

• H02K9/06 Primary

  with fans or impellers driven by the machine shaft · CPC title

• H02K9/04

  having means for generating a flow of cooling medium · CPC title