Method for manufacturing an optoelectronic device
US-2024274747-A1 · Aug 15, 2024 · US
US9806224B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9806224-B2 |
| Application number | US-201414763464-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 28, 2014 |
| Priority date | Jan 31, 2013 |
| Publication date | Oct 31, 2017 |
| Grant date | Oct 31, 2017 |
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A semiconductor layer sequence includes a first nitridic compound semiconductor layer, a second nitridic compound semiconductor layer, and an intermediate layer arranged between the first and second nitridic compound semiconductor layers. Beginning with the first nitridic compound semiconductor layer, the intermediate layer and the second nitridic compound semiconductor layer are arranged one after the other in a direction of growth of the semiconductor layer sequence and are adjacent to each other in direct succession. The intermediate layer has a lattice constant different from the lattice constant of the first nitridic compound semiconductor layer at least at some points. The second nitridic compound semiconductor layer is lattice-adapted to the intermediate layer at least at some points.
Opening claim text (preview).
The invention claimed is: 1. A semiconductor layer sequence comprising: a first nitridic compound semiconductor layer; an intermediate layer overlying and directly adjoining the first nitridic compound semiconductor layer, wherein the intermediate layer at least in places has a different lattice constant than the first nitridic compound semiconductor layer; and a second nitridic compound semiconductor layer overlying and directly adjoining the intermediate layer, wherein the second nitridic compound semiconductor layer is lattice-matched to the intermediate layer at least in places, and wherein the intermediate layer has an aluminum content that is greater than an aluminum content of the first nitridic compound semiconductor layer and an aluminum content of the second nitridic compound semiconductor layer. 2. The semiconductor layer sequence according to claim 1 , wherein the first nitridic compound semiconductor layer comprises a nitride compound semiconductor material which comprises Al n In m Ga 1-n-m N, wherein 0≦n≦1, 0≦m≦1 and n+m≦1, the second nitridic compound semiconductor layer comprises a further nitride compound semiconductor material, which comprises Al x In y Ga 1-x-y N, and the intermediate layer comprises a nitride compound semiconductor material which comprises Al r In s Ga 1-r-s N, wherein 0≦r≦1, 0≦s≦1 and r+s≦1. 3. The semiconductor layer sequence according to claim 2 , wherein the nitride compound semiconductor material of the first nitridic compound semiconductor layer and the further nitride compound semiconductor material of the second nitridic compound semiconductor layer are identical. 4. The semiconductor layer sequence according to claim 1 , wherein the intermediate layer comprises microcracks and the second nitridic compound semiconductor layer is present in the microcracks at least in places. 5. The semiconductor layer sequence according to claim 4 , wherein the first nitridic compound semiconductor layer has cavities that overlap the microcracks of the intermediate layer in a plan view. 6. The semiconductor layer sequence according to claim 5 , wherein the cavities of the first nitridic compound semiconductor layer are free of the first nitridic compound semiconductor layer and electromagnetic radiation generated in an active layer passes through the cavities in such a way that the electromagnetic radiation is refracted upon the electromagnetic radiation entering and exiting at interfaces of the cavities. 7. The semiconductor layer sequence according to claim 1 , wherein the intermediate layer has a smaller lattice constant than the first nitridic compound semiconductor layer and second nitridic compound semiconductor layer. 8. The semiconductor layer sequence according to claim 1 , wherein the first nitridic compound semiconductor layer comprises a masking layer. 9. The semiconductor layer sequence according to claim 1 , wherein the intermediate layer has a layer thickness of between 5 nm and 100 nm. 10. The semiconductor layer sequence according to claim 1 , wherein the second nitridic compound semiconductor layer is compressively strained. 11. The semiconductor layer sequence according to claim 1 , further comprising an active layer overlying second nitridic compound semiconductor layer, the active layer being suitable for receiving and/or generating electromagnetic radiation during operation. 12. The semiconductor layer sequence according to claim 1 , wherein the intermediate layer has an aluminum concentration between 10% and 95%, and wherein the aluminum concentration is increased in a direction of the second nitridic compound semiconductor layer. 13. A semiconductor layer sequence comprising: a first nitridic compound semiconductor layer; an intermediate layer overlying and directly adjoining the first nitridic compound semiconductor layer, wherein the intermediate layer at least in places has a different lattice constant than the first nitridic compound semiconductor layer; and a second nitridic compound semiconductor layer overlying and directly adjoining the intermediate layer, wherein the second nitridic compound semiconductor layer is lattice-matched to the intermediate layer at least in places, wherein the intermediate layer comprises microcracks, and wherein the first nitridic compound semiconductor layer has cavities that overlap the microcracks of the intermediate layer in a plan view.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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