Substrate conveyance method

Patent metadata

Field	Value
Publication number	US-9805960-B2
Application number	US-201615202658-A
Country	US
Kind code	B2
Filing date	Jul 6, 2016
Priority date	Jul 7, 2015
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

When an edge of a wafer passes above a right sensor and a left sensor disposed in a conveyance route of the wafer to a substrate processing chamber, four edge intersecting points are acquired in a first wafer coordinate system, and a reference edge intersecting point set composed of two adjacent edge intersecting points is created from the four edge intersecting points. Between the two remaining edge intersecting points which do not constitute the reference edge intersecting point set, an edge intersecting point present within an area surrounded by two circles defined based on the two edge intersecting points constituting the reference edge intersecting point set is selected as an effective edge intersecting point, and a central position of a circle passing through the reference edge intersecting points and the effective edge intersecting point is acquired as a central position of the wafer.

First claim

What is claimed is:

1. A method for conveying a disk-shaped substrate to a substrate processing chamber by a conveyance unit, the method comprising:
acquiring, in advance, a reference substrate position as a reference of a position of the substrate when the substrate is conveyed;
acquiring a conveyance substrate position which is a position of the substrate conveyed to the substrate processing chamber;
calculating a positional deviation of the conveyance substrate position with respect to the reference substrate position;
correcting a pathway of the substrate to the substrate processing chamber to eliminate the calculated positional deviation; and
conveying the substrate to the substrate processing chamber based on the corrected pathway of the substrate,
wherein the acquiring the conveyance substrate position includes:
disposing two position sensors in a conveyance route of the substrate such that the two position sensors are spaced apart from each other at an interval smaller than a diameter of the substrate, and face the substrate;
acquiring four intersecting points where the two position sensors intersect with an outer edge of the substrate while the substrate is conveyed to the substrate processing chamber;
selecting two intersecting points among the four intersecting points as reference intersecting points;
defining two circles passing through the two reference intersecting points and having different diameters; and
selecting an intersecting point present within an area surrounded by the two circles, between two intersecting points unselected as the reference intersecting points from the four intersecting points, and acquiring the conveyance substrate position based on the selected intersecting points and the two reference intersecting points.

2. The method of claim 1 , wherein the acquiring the conveyance substrate position, the calculating the positional deviation, and the correcting the pathway of the substrate are performed when the substrate is conveyed.

3. The method of claim 1 , wherein the acquiring the conveyance substrate position, the calculating the positional deviation, and the correcting the pathway of the substrate are performed at a time when aged deterioration of the conveyance unit is expected.

4. The method of claim 1 , wherein at a time when the position sensors are exchanged, the acquiring the conveyance substrate position, the calculating the positional deviation, and the correcting the pathway of the substrate are performed.

5. A method for conveying a disk-shaped substrate to a substrate processing chamber by a conveyance unit, the method comprising:
acquiring, in advance, a reference substrate position as a reference of a position of the substrate when the substrate is conveyed;
acquiring a conveyance substrate position which is a position of the substrate conveyed to the substrate processing chamber;
calculating a positional deviation of the conveyance substrate position with respect to the reference substrate position;
correcting a pathway of the substrate to the substrate processing chamber to eliminate the calculated positional deviation; and
conveying the substrate to the substrate processing chamber based on the corrected pathway of the substrate,
wherein the acquiring the conveyance substrate position includes:
disposing two position sensors in a conveyance route of the substrate such that the two position sensors are spaced apart from each other at an interval smaller than a diameter of the substrate, and face the conveyed substrate;
acquiring four intersecting points where the two position sensors intersect with an outer edge of the substrate while the substrate is conveyed to the substrate processing chamber;
creating a plurality of combinations of intersecting points, each combination being composed of three intersecting points, from the four intersecting points;
defining circles each of which passes through the three intersecting points in each of the combinations; and
acquiring the conveyance substrate position based on a circle having a diameter most close to the diameter of the conveyed substrate among the defined circles.

6. A method for conveying a disk-shaped substrate to a substrate processing chamber by a conveyance unit, the method comprising:
acquiring, in advance, a reference substrate position as a reference of a position of the substrate when the substrate is conveyed;
acquiring a conveyance substrate position which is a position of the substrate conveyed to the substrate processing chamber;
calculating a positional deviation of the conveyance substrate position with respect to the reference substrate position;
correcting a pathway of the substrate to the substrate processing chamber to eliminate the calculated positional deviation; and
conveying the substrate to the substrate processing chamber based on the corrected pathway of the substrate,
wherein the acquiring the conveyance substrate position includes:
disposing a position sensor in a conveyance route of the substrate such that the position sensor faces the conveyed substrate;
acquiring two intersecting points among four intersecting points where the position sensor intersects with an outer edge of the substrate while the substrate is conveyed to the substrate processing chamber; and
geometrically acquiring the conveyance substrate position based on the two intersecting points and a radius of the conveyed substrate.

7. The method of claim 6 , wherein the acquiring the conveyance substrate position includes:
disposing a different position sensor in the conveyance route of the substrate such that the position sensor faces the conveyed substrate;
acquiring two other intersecting points where the position sensor intersects with the outer edge of the substrate;
geometrically acquiring a different conveyance substrate position which is a position of the substrate conveyed to the substrate processing chamber based on the two other intersecting points and the radius of the conveyed substrate;
calculating an average substrate position by averaging the conveyance substrate position and the different conveyance substrate position; and
calculating a positional deviation of the average substrate position with respect to the reference substrate position.

Assignees

• Tokyo Electron Ltd

Inventors

• Shindo Takehiro
• Shioneri Tadashi
• Dogome Masahiro

Classifications

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• H10P72/0454

  surrounding a central transfer chamber · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/33 Primary

  into and out of processing chamber · CPC title