Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-9805938-B2
Application number	US-201514845554-A
Country	US
Kind code	B2
Filing date	Sep 4, 2015
Priority date	Sep 18, 2014
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A substrate processing apparatus includes a rotating holder for a substrate, a first nozzle used to eject a jet flow, a second nozzle used to discharge a continuous flow, and a nozzle moving unit integrally moving the first and second nozzles. A landing position of the continuous flow is located closer to a rotation center than a landing position of the jet flow is. At least movement paths of the landing positions of the jet flow and the continuous flow or flow directions of the continuous flow and the jet flow are different from each other. The movement paths are made to be different from each other by locating the landing position of the continuous flow downstream of the movement path of the landing position of the jet flow. The flow directions are made to be different from each other by tilting the continuous flow.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a rotating holder that rotates a substrate while holding the substrate horizontally;
a first nozzle that is used to mix a processing solution and pressurized gas to generate a jet flow of droplets of said processing solution, and to eject said jet flow of droplets onto an upper surface of said substrate in an approximately vertical direction;
a second nozzle that is used to discharge a continuous flow of said processing solution onto the upper surface of said substrate; and
a nozzle moving unit that integrally moves said first nozzle and said second nozzle above said substrate while maintaining a positional relationship between said first nozzle and said second nozzle, wherein
said nozzle moving unit moves said first nozzle and said second nozzle along respective arcuate paths, and moves said first nozzle so that a landing position, on said substrate, of said jet flow of droplets passes through a rotation center of said substrate, the arcuate paths having a common rotation axis and different lengths in a radial direction,
movement paths of the landing position of said jet flow of droplets and the landing position of said continuous flow on a rotation track of said substrate are different from each other, and
when said first nozzle is located above the peripheral portion of said substrate, a landing position, on said substrate, of said continuous flow is located closer to the rotation center of said substrate than the landing position of said jet flow of droplets and is also located downstream of the movement path of the landing position of said jet flow of droplets in a rotation direction of said substrate.

2. The substrate processing method according to claim 1 , wherein
a direction of said continuous flow is tilted with respect to a vertical direction so that a distance between said jet flow of droplets and said continuous flow increases toward said substrate.

3. A substrate processing apparatus comprising:
a rotating holder that rotates a substrate while holding the substrate horizontally;
a first nozzle that is used to mix a processing solution and pressurized gas to generate a jet flow of droplets of said processing solution, and to eject said jet flow of droplets onto an upper surface of said substrate in an approximately vertical direction;
a second nozzle that is used to discharge a continuous flow of said processing solution onto the upper surface of said substrate; and
a nozzle moving unit that integrally moves said first nozzle and said second nozzle above said substrate while maintaining a positional relationship between said first nozzle and said second nozzle, wherein
said nozzle moving unit moves said first nozzle and said second nozzle along respective arcuate paths, and moves said first nozzle so that a landing position, on said substrate, of said jet flow of droplets passes through a rotation center of said substrate, the arcuate paths having a common rotation axis and different lengths in a radial direction,
movement paths of the landing position of said jet flow of droplets and the landing position of said continuous flow on a rotation track of said substrate are different from each other, and
when said first nozzle is located above the peripheral portion of said substrate, a rotational speed vector of said substrate at the landing position, on said substrate, of the continuous flow and a rotational speed vector of said substrate at the landing position, on said substrate, of said jet flow of droplets are directed away from each other.

4. The substrate processing method according to claim 3 , wherein
a direction of said continuous flow is tilted with respect to a vertical direction so that a distance between said jet flow of droplets and said continuous flow increases toward said substrate.

Assignees

• Screen Holdings Co Ltd

Inventors

• Fujiwara Naozumi
• Edo Toru
• Sugahara Yuji
• Ano Seiji
• Sawashima Jun

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/0404 Primary

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title