Aqueous cutting fluid composition

Patent metadata

Field	Value
Publication number	US-9803156-B2
Application number	US-201214647278-A
Country	US
Kind code	B2
Filing date	Dec 6, 2012
Priority date	Dec 6, 2012
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A water-based cutting fluid that comprises water and a water-soluble polyalkylene glycol (PAG) having cloud point from 30° C. to 80° C. The cutting fluid is water-based, i.e., it comprises at least 50 percent by weight (wt %) water. The cutting fluids are well suited for use with diamond wiresaws for the cutting of silicon ingots. The fluids exhibit one or more of low hydrogen generation, no wafer cleaning issues, good lubricity, good cooling efficiency, good swarf suspension and dispersion, low foaming, are generally non-sensitive to metal ions, and are nonflammable.

First claim

The invention claimed is:

1. A cutting fluid comprising:
Water-soluble polyalkylene glycol (PAG) with a cloud point from 30° C. to 80° C.,
a polyether grafted polycarboxylate dispersing agent;

Water, and at least one of:
a wetting agent;
a defoamer;
a corrosion inhibitor;
a chelant; and
a biocide,
wherein the PAG is present in an amount of 0.01 to 20 weight percent based on the weight of the cutting fluid; and
wherein the water is present in an amount of 90 to 98 weight percent based on the weight of the cutting fluid.

2. A process of cutting a hard, brittle material with a wiresaw used in conjunction with a water-based cutting fluid, the process comprising the step of contacting the material with the wiresaw and cutting fluid under cutting conditions at a working temperature for the cutting fluid, the cutting fluid comprising:
Water-soluble PAG with a cloud point from 30° C. to 80° C., where the cloud point of the water-soluble PAG is below the working temperature for the cutting fluid,
a polyether grafted polycarboxylate dispersing agent;

Water, and at least one of:
a wetting agent;
a defoamer;
a corrosion inhibitor;
a chelant; and
a biocide,
wherein the PAG is present in an amount of 0.01 to 20 weight percent based on the weight of the cutting fluid; and
wherein the water is present in an amount of 90 to 98 weight percent based on the weight of the cutting fluid.

3. The cutting fluid of claim 1 comprising at least two of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

4. The cutting fluid of claim 1 comprising at least three of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

5. The cutting fluid of claim 1 comprising at least four of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

6. The cutting fluid of claim 1 comprising at least five of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

7. The cutting fluid of claim 1 in which the wetting agent is present in an amount of 0.01 to 5 weight percent; the polyether grafted polycarboxylate dispersing agent is present in an amount of 0.01 to 20 weight percent; the defoamer is present in an amount of 0.01 to 5 weight percent; the corrosion inhibitor is present in an amount of 0.01 to 2 weight percent; the chelant is present in an amount of 0.01 to 2 weight percent; and biocide is present in an amount of 0.01 to 2 weight percent wherein said weight percent values are based on the weight of the cutting fluid.

8. The cutting fluid of claim 7 further comprising one or more of a polar solvent, a thickener, a dye, or a fragrance.

9. The process of claim 2 in which the hard, brittle material is a silicon ingot or wafer.

10. The process of claim 2 wherein the cutting fluid comprises at least two of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

11. The process of claim 2 wherein the cutting fluid comprises at least three of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

12. The process of claim 2 wherein the cutting fluid comprises at least four of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

13. The process of claim 2 wherein the cutting fluid comprises at least five of a wetting agent, a defoamer, a corrosion inhibitor, a chelant and a biocide.

14. The process of claim 2 wherein for the cutting fluid the wetting agent is present in an amount of 0.01 to 5 weight percent; the polyether grafted polycarboxylate dispersing agent is present in an amount of 0.01 to 20 weight percent; the defoamer is present in an amount of 0.01 to 5 weight percent; the corrosion inhibitor is present in an amount of 0.01 to 2 weight percent; the chelant is present in an amount of 0.01 to 2 weight percent; and biocide is present in an amount of 0.01 to 2 weight percent wherein said weight percent values are based on the weight of the cutting fluid.

15. The process of claim 14 wherein the cutting fluid further comprises one or more of a polar solvent, a thickener, a dye, or a fragrance.

Assignees

• Dow Global Technologies Llc

Inventors

• Zhu yi ping
• Liang Bing
• Liu Andong
• Yu Wanglin

Classifications

• B28D5/0076

  for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work · CPC title

• C10N2030/04

  Detergent property or dispersant property · CPC title

• C10M173/02 Primary

  not containing mineral or fatty oils · CPC title

• C10M2207/127

  polycarboxylic · CPC title

• C10N2040/22

  with essential removal of material {, e.g. cutting, grinding or drilling} · CPC title