Deposition mask production method and laser processing apparatus

Patent metadata

Field	Value
Publication number	US-9802221-B2
Application number	US-201514809086-A
Country	US
Kind code	B2
Filing date	Jul 24, 2015
Priority date	Jan 28, 2013
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A method including: a first step of forming a mask member having a structure in which a magnetic metal member provided with through-holes is in tight contact with one surface of a film; a second step of forming a plurality of preliminary opening patterns by subjecting the film to penetration processing by irradiating laser beams at predetermined regular positions in the plurality of through-holes; and a third step of performing laser processing so as to form each opening pattern over the corresponding preliminary opening pattern, is provided.

First claim

What is claimed is:

1. A production method of a deposition mask including: a resin film in which a plurality of penetrating opening patterns is formed; and a magnetic metal member disposed in tight contact with one surface of the resin film and in which a plurality of through-holes each having a size capable of enclosing therein at least one of the plurality of penetrating opening patterns is provided, the production method comprising the sequential steps of:
a first step of forming a mask member having a structure in which the magnetic metal member provided with the plurality of through-holes is in tight contact with the one surface of the resin film;
a second step of forming a plurality of preliminary opening patterns over an entire surface of the mask member, each of the plurality of preliminary opening patterns having a shape capable of being enclosed in a corresponding one of the plurality of penetrating opening patterns so as to release internal stress of the resin film, by subjecting the resin film to penetration processing by irradiating laser beams at predetermined regular positions in the plurality of through-hole using, among a first slit and a second slit which are included by a laser processing apparatus, the second slit, wherein the first slit has a similar shape to the plurality of penetrating opening patterns and wherein the second slit has a shape capable of being enclosed in each of the plurality of penetrating opening patterns and a similar shape to the plurality of preliminary opening patterns; and
a third step of performing laser processing using the first slit so as to form each of the plurality of penetrating opening patterns at a corresponding one of the predetermined regular positions over the entire surface of the mask member.

2. The production method according to claim 1 , wherein each of the plurality of preliminary opening patterns is formed at a predetermined position based on a mask alignment mark provided in advance to the mask member.

3. The production method according to claim 1 , wherein in the third step, positional deviation of the plurality of preliminary opening patterns, which has been caused after performing the second step, with respect to the predetermined regular positions is measured based on internal stress of the resin film caused by a difference in thermal expansion between the resin film and the magnetic metal member, and the positional deviation is corrected and then the plurality of penetrating opening patterns are formed.

4. The production method according to claim 1 , wherein each of the plurality of preliminary opening patterns is formed at a predetermined position of the predetermined regular positions based on a mask alignment mark provided in advance to the mask member.

5. The production method according to claim 1 , wherein between the first step and the second step, a peripheral portion of the magnetic metal member is joined to one end surface of a frame having an opening having a size capable of enclosing therein the plurality of through-holes.

Assignees

• V Tech Co Ltd

Inventors

• Mizumura Michinobu

Classifications

• B23K37/0408

  for planar work · CPC title

• B23K26/066

  by using masks · CPC title

• B05D3/06 Primary

  by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141}) · CPC title

• B23K26/40

  taking account of the properties of the material involved · CPC title

• B23K26/382

  by boring · CPC title