Multilayer ceramic capacitor and board having the same mounted thereon

Patent metadata

Field	Value
Publication number	US-9257230-B2
Application number	US-201414243884-A
Country	US
Kind code	B2
Filing date	Apr 2, 2014
Priority date	Nov 8, 2013
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a capacitor part formed in the ceramic body and including first and second internal electrodes, the first internal electrode having a first lead exposed to the second main surface and the second internal electrode having a second lead exposed to the first main surface; resistor parts including first and second internal connection conductors formed on the same dielectric layers among the plurality of dielectric layers in the ceramic body; and first to fourth external electrodes, first and third connection terminals, and second and fourth connection terminals. The capacitor part and the resistor parts may be connected in series to one another.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;
a capacitor part disposed in the ceramic body and including first and second internal electrodes, the first internal electrode having a first lead exposed to the second main surface and the second internal electrode having a second lead exposed to the first main surface;
resistor parts including first internal connection conductors exposed to the first and second main surfaces and the first end surface and second internal connection conductors exposed to the first and second main surfaces and the second end surface, the first and second internal connection conductors being disposed on the same dielectric layers among the plurality of dielectric layers in the ceramic body; and
first to fourth external electrodes disposed on the first and second main surfaces of the ceramic body and electrically connected to the first and second internal electrodes and the first and second internal connection conductors, first and third connection terminals disposed on the first end surface of the ceramic body and connected to the first internal connection conductors, and second and fourth connection terminals disposed on the second end surface of the ceramic body and connected to the second internal connection conductors,
wherein the capacitor part and the resistor parts are connected in series to one another.

2. The multilayer ceramic capacitor of claim 1 , wherein the first lead of the first internal electrode is connected to the third external electrode and the second lead of the second internal electrode is connected to the second external electrode.

3. The multilayer ceramic capacitor of claim 1 , wherein one ends of the first internal connection conductors are connected to the first internal electrode through the third external electrode, and the other ends thereof are connected to the first external electrode.

4. The multilayer ceramic capacitor of claim 1 , wherein one ends of the second internal connection conductors are connected to the second internal electrode through the second external electrode, and the other ends thereof are connected to the fourth external electrode.

5. The multilayer ceramic capacitor of claim 1 , wherein one ends of the first and third connection terminals are connected to the first external electrode, and the other ends thereof are connected to the third external electrode.

6. The multilayer ceramic capacitor of claim 1 , wherein one ends of the second and fourth connection terminals are connected to the second external electrode, and the other ends thereof are connected to the fourth external electrode.

7. A multilayer ceramic capacitor comprising:
a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;
a capacitor part disposed in the ceramic body and including first and second internal electrodes, the first internal electrode having a third lead exposed to the second main surface and the second internal electrode having a fourth lead exposed to the first main surface;
resistor parts including first internal connection conductors exposed to the first and second main surfaces and the first end surface and second internal connection conductors exposed to the first and second main surfaces and the second end surface, the first and second internal connection conductors being disposed on the same dielectric layers among the plurality of dielectric layers in the ceramic body;
first and second dummy electrodes disposed in the ceramic body, the first dummy electrode being exposed to the first end surface of the ceramic body and the second dummy electrode being exposed to the second end surface of the ceramic body; and
first to fourth external electrodes disposed on the first and second main surfaces of the ceramic body and electrically connected to the first and second internal electrodes and the first and second internal connection conductors, first and third connection terminals disposed on the first end surface of the ceramic body and connected to the first internal connection conductors, second and fourth connection terminals disposed on the second end surface of the ceramic body and connected to the second internal connection conductors, and a fifth connection terminal disposed on the first end surface of the ceramic body and connected to the first dummy electrode and a sixth connection terminal disposed on the second end surface of the ceramic body and connected to the second dummy electrode,
wherein the capacitor part and the resistor parts are connected in series to one another.

8. The multilayer ceramic capacitor of claim 7 , wherein the third lead of the first internal electrode is connected to the third external electrode and the fourth lead of the second internal electrode is connected to the second external electrode.

9. The multilayer ceramic capacitor of claim 7 , wherein one ends of the first internal connection conductors are connected to the first internal electrode through the third external electrode, and the other ends thereof are connected to the first external electrode.

10. The multilayer ceramic capacitor of claim 7 , wherein one ends of the second internal connection conductors are connected to the second internal electrode through the second external electrode, and the other ends thereof are connected to the fourth external electrode.

11. The multilayer ceramic capacitor of claim 7 , wherein one ends of the first and third connection terminals are connected to the first external electrode, and the other ends thereof are connected to the third external electrode.

12. The multilayer ceramic capacitor of claim 7 , wherein one ends of the second and fourth connection terminals are connected to the second external electrode, and the other ends thereof are connected to the fourth external electrode.

13. The multilayer ceramic capacitor of claim 7 , wherein the fifth connection terminal is connected to the first and third connection terminals.

14. The multilayer ceramic capacitor of claim 7 , wherein the sixth connection terminal is connected to the second and fourth connection terminals.

15. A board having a multilayer ceramic capacitor mounted thereon, the board comprising:
a printed circuit board having first and second electrode pads disposed thereon; and
the multilayer ceramic capacitor of claim 1 mounted on the printed circuit board.

16. A board having a multilayer ceramic capacitor mounted thereon, the board comprising:
a printed circuit board having first and second electrode pads disposed thereon; and
the multilayer ceramic capacitor of claim 7 mounted on the printed circuit board.

Assignees

• Samsung Electro Mech

Inventors

• Park Min Cheol
• Park Sang Soo

Classifications

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/14 Primary

  Protection against electric or thermal overload (by cooling H01G2/08) · CPC title

• H01G2/065 Primary

  for surface mounting, e.g. chip capacitors · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title