Plurality of stiffeners with thickness variation

Patent metadata

Field	Value
Publication number	US-9799610-B2
Application number	US-201514975360-A
Country	US
Kind code	B2
Filing date	Dec 18, 2015
Priority date	Dec 18, 2015
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

Creating surface variations on a stiffener in a stack reduces inter-stiffener sticking and stiffener stack tilt in pick and place media. The surface variations provide one or more airgaps that reduce inter-stiffener surface contact, provide space for contaminants and/or provide an averaged surface height due to surface roughness.

First claim

The invention claimed is:

1. A pick and place tool medium comprising:
a plurality of stiffeners in a stack, the stiffeners configured to be mounted on a substrate in proximity of a perimeter of a die and provide support for the substrate, the plurality of stiffeners comprising:
a stiffener body, comprising:
a top surface; and
a bottom surface comprising surface variations, the surface variations to cause an airgap between the bottom surface and an adjacent top surface of a stiffener in the pick and place tool media, the airgaps to reduce conformal contact between adjacent stiffeners.

2. The pick and place tool medium of claim 1 , further comprising a container around the plurality of stiffeners.

3. The pick and place tool medium of claim 2 , wherein the container is a tube.

4. The pick and place tool medium of claim 1 , wherein the surface variations average a raw material variation of a stack of stiffeners, avoiding an accumulated tilt.

5. The pick and place tool medium of claim 1 , wherein the surface variations support the stiffener body to reduce compression of contaminant between the bottom surface and the adjacent top surface.

6. The pick and place tool medium of claim 5 , wherein the contaminant causes sticking when compressed.

7. The pick and place tool medium of claim 5 , wherein the top surface further comprises additional surface variations.

8. An integrated (IC) package comprising:
a die;
a substrate supporting at least the die; and
a package stiffener mounted at a perimeter of the substrate, the stiffener comprising a textured surface facing and coupled to the substrate, the textured surface having a greater surface area than a non-textured surface, the textured surface to provide additional surface for adhesion of the stiffener to the substrate.

9. The IC of claim 8 , wherein the textured surface causes an airgap between the textured surface and a top surface of an adjacent stiffener in a transport medium.

10. The IC of claim 8 , wherein the die is a semiconductor device.

11. The IC of claim 10 , wherein the semiconductor device is a processing unit.

12. The IC of claim 8 , wherein the stiffener provides additional structural support for the substrate.

13. A stiffener, comprising:
a stiffener body configured to be mounted in proximity of a perimeter of a die on a substrate, the stiffener body comprising:
a first surface comprising surface variations, the surface variations to average raw material variation of a stack of more than two stiffeners, avoiding an accumulated tilt in the stack of stiffeners.

14. The stiffener of claim 13 , wherein the surface variations cause an airgap between the first surface and an adjacent top surface of a stiffener in a transport medium.

15. The stiffener of claim 13 , wherein the surface variations provide additional surface for adhesion of the stiffener to a substrate.

16. The stiffener of claim 13 , wherein the stiffener body further comprises a second surface comprising surface variations.

17. The stiffener of claim 16 , wherein the first surface is a bottom surface and the second surface is a top surface.

18. The stiffener of claim 13 , wherein the surface variations are a roughened surface.

19. The stiffener of claim 13 , wherein the surface variations are a set of protrusions.

20. The stiffener of claim 13 , wherein the surface variations are irregular.

21. The stiffener of claim 13 , wherein the surface variations are continuous across the first surface.

22. The stiffener of claim 13 , wherein the surface variations are discontinuous across the first surface.

Assignees

• Intel Corp

Inventors

• Xu Mingjie
• Prstic Suzana
• Dhane Kedar

Classifications

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W42/121 Primary

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H01L23/562 Primary

  Electricity · mapped topic

• H01L23/16

  Electricity · mapped topic