Non-invasive thickness measurement using resonant frequency shift

US9797703B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9797703-B2
Application numberUS-201615062377-A
CountryUS
Kind codeB2
Filing dateMar 7, 2016
Priority dateMar 7, 2016
Publication dateOct 24, 2017
Grant dateOct 24, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of measuring thickness of a material generally includes transmitting an oscillating signal from a first pad, through the material, to a second pad, and measuring the signal reflected back to the first pad. The material may be homogenous or heterogeneous, and has dielectric properties. The signal has its frequency varied over time so that the frequency response of the system (the first pad, the material, and the second pad) may be analyzed. The resonant frequency of the system is determined. The thickness of the material is determined based on the resonant frequency shift caused by a change in thickness of the material. The present invention may be advantageously employed to measure the thickness of a vehicle tire or other material. Related apparatuses are also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of determining a thickness of a material, the method comprising: transmitting an oscillating signal from a first pad; wherein the signal is transmitted at a frequency that is varied over time so that the signal is transmitted at a plurality of frequencies in corresponding time intervals; passing the signal through the material, wherein the material is a heterogeneous material; reflecting the signal at a second pad after the signal has passed through the material, the second pad disposed in spaced relation to the first pad and electrically isolated therefrom; receiving the reflected signal at the first pad; determining a resonate frequency of a system based on the received signal; the system comprising the first pad, the second pad, and the material; determining the thickness of the material based on the resonate frequency. 2. The method of claim 1 , wherein the first pad and the second pad are disposed proximate to each other on a same side relative to the material. 3. The method of claim 2 , wherein the first pad and the second pad are disposed substantially parallel to each other. 4. The method of claim 1 , wherein the plurality of frequencies are all sub-microwave frequencies. 5. The method of claim 1 , wherein the first pad and the second pad are both disposed in spaced relation to the material. 6. The method of claim 1 , wherein the transmitting comprises sweeping a frequency band with the signal. 7. The method of claim 1 , wherein the material comprises metal embedded in a dielectric material. 8. The method of claim 7 , wherein the material comprises a portion of a vehicle tire. 9. The method of claim 8 , wherein the metal comprises a steel reinforcing mesh for the vehicle tire. 10. The method of claim 1 , wherein the material has a plurality of recesses on a surface thereof disposed opposite the first and second pads. 11. A method of determining a thickness of a material between first and second generally oppositely disposed surfaces, the method comprising: transmitting an oscillating signal from a first pad; wherein the signal is transmitted at a frequency that is varied over time so that the signal is transmitted at a plurality of frequencies in corresponding time intervals; passing the signal through the material, wherein the second surface of the material comprises a plurality of recesses therein; reflecting the signal at a second pad after the signal has passed through the material, the second pad disposed in spaced relation to the first pad and electrically isolated therefrom; receiving the reflected signal at the first pad; determining a resonate frequency of a system based on the received signal; the system comprising the first pad, the second pad, and the material; determining the thickness of the material based on the resonate frequency. 12. The method of claim 11 , wherein the first pad and the second pad are disposed proximate to each other on a same side relative to the material. 13. The method of claim 12 , wherein the first pad and the second pad are disposed substantially parallel to each other. 14. The method of claim 11 , wherein the plurality of frequencies are all sub-microwave frequencies. 15. The method of claim 11 , wherein the first pad and the second pad are both disposed in spaced relation to the material. 16. The method of claim 11 , wherein the transmitting comprises sweeping a frequency band with the signal. 17. The method of claim 11 , wherein the material comprises metal embedded in a dielectric material. 18. The method of claim 17 , wherein the material comprises a portion of a vehicle tire. 19. The method of claim 18 , wherein the metal comprises a steel reinforcing mesh for the vehicle tire. 20. An tire assembly, comprising: a tire comprising a dielectric material and a metal material embedded therein; the tire having an inner surface and an exterior surface disposed generally opposite to the inner surface; a first electrically conductive pad configured to transmit an oscillating signal at a plurality of frequencies during corresponding time intervals; a second electrically conductive pad configured to reflect the signal after the signal has passed through the tire; the second pad disposed in spaced relation to the first pad and electrically isolated therefrom; wherein the first pad is further configured to receive the reflected signal; a processing circuit communicatively connected to the first pad and configured to: determine a resonate frequency of a system based on the received signal; the system comprising the first pad, the second pad, and the tire; determining a local thickness of the tire based on the resonate frequency. 21. The tire assembly of claim 20 , wherein the exterior surface of the tire comprises a plurality of recesses. 22. The tire assembly of claim 20 , wherein the first and second pads are disposed closer to the inner surface than the exterior surface of the tire. 23. The tire assembly of claim 20 , wherein the first and second pads are disposed substantially parallel to each other. 24. The tire assembly of claim 20 , wherein the first pad is disposed in spaced relation to the tire. 25. The tire assembly of claim 20 , wherein the processing circuit is configured to determine the local thickness based on the resonate frequency by consulting a lookup table of reference values. 26. The tire assembly of claim 20 , wherein the processing circuit is mounted to the tire. 27. The tire assembly of claim 20 : wherein the first pad and the second pad comprise a first sensor assembly; further comprising a second sensor assembly disposed in spaced relation to the first sensor assembly; the second sensor assembly configured to determining a local thickness of the tire at a location spaced from the first sensor assembly.

Assignees

Inventors

Classifications

  • G01B7/06Primary

    for measuring thickness {(measuring during the manufacture of coatings C23C14/54)} · CPC title

  • using infrasonic, sonic or ultrasonic vibrations · CPC title

  • Tyre parts or constructions not otherwise provided for · CPC title

  • Tyre sensors other than for detecting tyre pressure · CPC title

  • Thickness of the tread · CPC title

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What does patent US9797703B2 cover?
A method of measuring thickness of a material generally includes transmitting an oscillating signal from a first pad, through the material, to a second pad, and measuring the signal reflected back to the first pad. The material may be homogenous or heterogeneous, and has dielectric properties. The signal has its frequency varied over time so that the frequency response of the system (the first …
Who is the assignee on this patent?
Univ Duke
What technology area does this patent fall under?
Primary CPC classification G01B7/06. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 24 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).