Manufacturing method of semiconductor device

Patent metadata

Field	Value
Publication number	US-9793383-B2
Application number	US-201615063883-A
Country	US
Kind code	B2
Filing date	Mar 8, 2016
Priority date	Aug 16, 2010
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

A transistor with superior electric characteristics is manufactured. An oxide insulating film is formed over a substrate, an oxide semiconductor film is formed over the oxide insulating film, heat treatment is then conducted at a temperature at which hydrogen contained in the oxide semiconductor film is desorbed and part of oxygen contained in the oxide insulating film is desorbed, then the heated oxide semiconductor film is etched into a predetermined shape to form an island-shaped oxide semiconductor film, a pair of electrodes is formed over the island-shaped oxide semiconductor film, a gate insulating film is formed over the pair of electrodes and the island-shaped oxide semiconductor film, and a gate electrode is formed over the gate insulating film.

First claim

What is claimed is:

1. A method for manufacturing a semiconductor device comprising the steps of:
forming an oxide insulating film over a substrate by sputtering method;
forming an oxide semiconductor film over and in contact with an entire top surface of the oxide insulating film;
performing a heat treatment after forming the oxide semiconductor film;
forming an island-shaped oxide semiconductor film by etching parts of the oxide semiconductor film after performing the heat treatment;
forming a gate insulating film over the island-shaped oxide semiconductor film; and
forming a gate electrode overlapping with the island-shaped oxide semiconductor film with the gate insulating film provided therebetween,
wherein hydrogen concentration in the oxide semiconductor film is reduced by the heat treatment,
wherein the heat treatment is performed at a temperature higher than or equal to 150° C. and lower than or equal to 450° C., and
wherein an amount of oxygen desorbed from the oxide insulating film by the heat treatment is higher than or equal to 1.0×10 18 atoms/cm 3 .

2. The method for manufacturing a semiconductor device according to claim 1 , wherein the amount of oxygen desorbed from the oxide insulating film by the heat treatment is measured by thermal desorption spectroscopy analysis.

3. The method for manufacturing a semiconductor device according to claim 1 , wherein the oxide insulating film has a thickness from 200 nm to 500 nm.

4. The method for manufacturing a semiconductor device according to claim 1 , wherein the oxide insulating film comprises silicon oxide.

5. The method for manufacturing a semiconductor device according to claim 1 , wherein the gate insulating film comprises silicon oxide.

6. The method for manufacturing a semiconductor device according to claim 1 , wherein the oxide insulating film contains oxygen with a first proportion higher than a proportion of oxygen in a stoichiometric composition.

7. The method for manufacturing a semiconductor device according to claim 1 , wherein oxygen vacancies in the oxide semiconductor film is reduced by the heat treatment.

8. The method for manufacturing a semiconductor device according to claim 1 , wherein the heat treatment is performed in one of an inert gas atmosphere and an oxidative atmosphere.

9. A method for manufacturing a semiconductor device comprising the steps of:
forming an oxide insulating film on a substrate by sputtering method;
forming an oxide semiconductor film over and in contact with an entire top surface of the oxide insulating film;
performing a heat treatment after forming the oxide semiconductor film;
forming an island-shaped oxide semiconductor film by etching the oxide semiconductor film after performing the heat treatment;
forming source and drain electrodes on the island-shaped oxide semiconductor film,
wherein hydrogen concentration in the oxide semiconductor film is reduced by the heat treatment,
wherein the heat treatment is performed at a temperature higher than or equal to 150° C. and lower than or equal to 450° C., and
wherein an amount of oxygen desorbed from the oxide insulating film by the heat treatment is higher than or equal to 1.0×10 18 atoms/cm 3 .

10. The method for manufacturing a semiconductor device according to claim 9 , wherein the amount of oxygen desorbed from the oxide insulating film by the heat treatment is measured by thermal desorption spectroscopy analysis.

11. The method for manufacturing a semiconductor device according to claim 9 , wherein the oxide insulating film has a thickness from 200 nm to 500 nm.

12. The method for manufacturing a semiconductor device according to claim 9 , wherein the oxide insulating film comprises silicon oxide.

13. The method for manufacturing a semiconductor device according to claim 9 , wherein the oxide insulating film contains oxygen with a higher proportion than a proportion of oxygen in a stoichiometric composition.

14. The method for manufacturing a semiconductor device according to claim 9 , wherein oxygen vacancies in the oxide semiconductor film is reduced by the heat treatment.

15. The method for manufacturing a semiconductor device according to claim 9 , wherein the heat treatment is performed in one of an inert gas atmosphere and an oxidative atmosphere.

16. A method for manufacturing a semiconductor device comprising the steps of:
forming an oxide insulating film over a substrate by sputtering method;
forming an oxide semiconductor film covering an entire top surface of the oxide insulating film;
performing a heat treatment after the oxide insulating film is covered with the oxide semiconductor film;
forming an island-shaped oxide semiconductor film by etching parts of the oxide semiconductor film after performing the heat treatment;
forming source and drain electrodes over the island-shaped oxide semiconductor film;
forming a gate insulating film over the island-shaped oxide semiconductor film and the source and drain electrodes; and
forming a gate electrode overlapping with the island-shaped oxide semiconductor film with the gate insulating film provided therebetween,
wherein hydrogen concentration in the oxide semiconductor film is reduced by the heat treatment,
wherein the heat treatment is performed at a temperature higher than or equal to 150° C. and lower than or equal to 450° C., and
wherein an amount of oxygen desorbed from the oxide insulating film by the heat treatment is higher than or equal to 1.0×10 18 atoms/cm 3 .

17. The method for manufacturing a semiconductor device according to claim 16 , wherein the amount of oxygen desorbed from the oxide insulating film by the heat treatment is measured by thermal desorption spectroscopy analysis.

18. The method for manufacturing a semiconductor device according to claim 16 , wherein the oxide insulating film has a thickness from 200 nm to 500 nm.

19. The method for manufacturing a semiconductor device according to claim 16 , wherein the oxide insulating film comprises silicon oxide.

20. The method for manufacturing a semiconductor device according to claim 16 , wherein the gate insulating film comprises silicon oxide.

21. The method for manufacturing a semiconductor device according to claim 16 , wherein the oxide insulating film contains oxygen with a first proportion higher than a proportion of oxygen in a stoichiometric composition.

22. The method for manufacturing a semiconductor device according to claim 16 , wherein oxygen vacancies in the oxide semiconductor film is reduced by the heat treatment.

23. The method for manufacturing a semiconductor device according to claim 16 , wherein the heat treatment is performed in one of an inert gas atmosphere and an oxidative atmosphere.

Assignees

• Semiconductor Energy Lab

Inventors

• Noda Kosei
• Sasaki Toshinari

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P95/70

  Chemical treatments · CPC title

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P50/20

  Dry etching; Plasma etching; Reactive-ion etching · CPC title