Capacitor arrangement structure

US9793048B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9793048-B2
Application numberUS-201615367179-A
CountryUS
Kind codeB2
Filing dateDec 2, 2016
Priority dateJan 29, 2016
Publication dateOct 17, 2017
Grant dateOct 17, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A capacitor arrangement structure includes a casing, a housing, and a heat sink. The casing accommodates a capacitor. The casing includes a casing bottom. The housing includes a bottom wall. The housing has a height from the bottom wall which includes an inner surface and an outer surface opposite to the inner surface in a height direction. The casing is mounted on the inner surface so that the casing bottom opposes a mounting surface in the inner surface. The heat sink includes a heat sink top. The heat sink is provided on the outer surface of the bottom wall not to overlap the casing viewed along the height direction. The heat sink top opposes the outer surface. A distance between the casing bottom and the mounting surface in the height direction is smaller than a distance between the heat sink top and the mounting surface in the height direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A capacitor arrangement structure comprising: a casing to accommodate a capacitor, the casing including a casing bottom; a housing including a bottom wall and having a height from the bottom wall which includes an inner surface and an outer surface opposite to the inner surface in a height direction along the height, the casing being mounted on the inner surface so that the casing bottom opposes a mounting surface in the inner surface; a heat sink including a heat sink top and provided on the outer surface of the bottom wall not to overlap the casing viewed along the height direction, the heat sink top opposing the outer surface; and a distance between the casing bottom and the mounting surface in the height direction being smaller than a distance between the heat sink top and the mounting surface in the height direction. 2. The capacitor arrangement structure according to claim 1 , wherein the casing bottom surface is contacting with the inner surface via a heat radiation sheet. 3. The capacitor arrangement structure according to claim 1 , wherein a cooling passage through which a cooling medium flows is disposed inside the housing and the cooling passage is located at a position higher than the casing bottom surface of the casing. 4. The capacitor arrangement structure according to claim 3 , wherein the casing is surrounded by the cooling passage. 5. The capacitor arrangement structure according to claim 4 , wherein the cooling passage is formed in the housing.

Assignees

Inventors

Classifications

  • characterised by their shape, e.g. having conical or cylindrical projections · CPC title

  • Battery management systems including electronic circuits, e.g. control of current or voltage to keep battery in healthy state, cell balancing · CPC title

  • with capacitors · CPC title

  • Housing; Encapsulation · CPC title

  • Batteries in motive systems, e.g. vehicle, ship, plane · CPC title

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Frequently asked questions

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What does patent US9793048B2 cover?
A capacitor arrangement structure includes a casing, a housing, and a heat sink. The casing accommodates a capacitor. The casing includes a casing bottom. The housing includes a bottom wall. The housing has a height from the bottom wall which includes an inner surface and an outer surface opposite to the inner surface in a height direction. The casing is mounted on the inner surface so that the…
Who is the assignee on this patent?
Honda Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01G2/08. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).