Electric power semiconductor device
US-9433075-B2 · Aug 30, 2016 · US
Power conversion device
US2016190034A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016190034-A1 |
| Application number | US-201615066545-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 10, 2016 |
| Priority date | Mar 31, 2014 |
| Publication date | Jun 30, 2016 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A power conversion device includes a heat releasing heatsink, a printed circuit board provided on the heatsink and having a through hole and wires, a metal case having a depressed portion fitted in the through hole and mounted on a top of the heatsink, and a heat releasable insulating layer made of a ceramic material and disposed between a bottom of the depressed portion and a top portion of the heat sink. A power semiconductor element is mounted in the depressed portion and electrically connected to the wires of the printed circuit board.
First claim
Opening claim text (preview).
What is claimed is: 1 . A power conversion device comprising: a heat releasing heatsink, a printed circuit board provided on the heatsink, and having a through hole and wires; a metal case having a depressed portion fitted in the through hole and mounted on a top of the heatsink; a heat releasable insulating layer made of a ceramic material, and disposed between a bottom of the depressed portion and a top portion of the heat sink; and a power semiconductor element mounted in the depressed portion and electrically connected to the wires of the printed circuit board. 2 . The power conversion device according to claim 1 , wherein the metal case includes a bottom portion and a sidewall portion enclosing the depressed portion, and a flange portion provided on an upper end of the sidewall portion and extending outwardly from the sidewall portion. 3 . The power conversion device according to claim 2 , wherein the printed circuit board further includes a metal foil pattern provided on an upper surface thereof to face the flange portion, and the flange portion and the metal foil pattern being soldered together. 4 . The power conversion device according to claim 1 , wherein the heat releasable insulating layer has a heat conductivity of 1 to 300 W/m·K and a thickness of 10 to 500 μm. 5 . The power conversion device according to claim 1 , wherein the heat releasable insulating layer is formed of at least one kind of filler selected from the group consisting of silicon oxide, aluminum oxide, silicon nitride, aluminum nitride, or boron nitride fillers. 6 . The power conversion device according to claim 1 , wherein the heat releasable insulating layer is formed of at least one kind of deposited ceramic particles by a plasma spraying method. 7 . The power conversion device according to claim 1 , wherein the insulating layer is formed of at least one kind of deposited ceramic particles formed by an aerosol deposition method.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
Ultrasonic bonding, e.g. thermosonic bonding · CPC title
comprising aluminium [Al] · CPC title
Die-attach connectors and bond wires · CPC title
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Frequently asked questions
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- What does patent US2016190034A1 cover?
- A power conversion device includes a heat releasing heatsink, a printed circuit board provided on the heatsink and having a through hole and wires, a metal case having a depressed portion fitted in the through hole and mounted on a top of the heatsink, and a heat releasable insulating layer made of a ceramic material and disposed between a bottom of the depressed portion and a top portion of th…
- Who is the assignee on this patent?
- Fuji Electric Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W72/071. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jun 30 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).