Smart card comprising a protruding component and method for making same

Patent metadata

Field	Value
Publication number	US-9792541-B2
Application number	US-53286203-A
Country	US
Kind code	B2
Filing date	Oct 23, 2003
Priority date	Oct 28, 2002
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

The invention concerns a smart card comprising a microcircuit, at least one other component including a protruding component and external contacts in a card-holder. The invention is characterized in that the microcircuit ( 1 ), the protruding component ( 2 ) and the external contacts ( 12 ) form part of a subassembly (S 1 ) fixed in a housing (C 1 +C 2 +C 3 ) provided in part of the thickness of the card-holder, said subassembly including a support film ( 10 ) bearing on one inner surface the microcircuit ( 1 ) and at least the protruding component ( 2 ) and on one outer surface the external contacts ( 12 ), a window ( 11 ) being arranged in said film opposite part of the projecting component.

First claim

The invention claimed is:

1. A smart card comprising:
a card support with a housing formed in a portion of the thickness of said card support, the card support having first and second surfaces opposite one another, the housing being defined at the first surface of the card support; and
a subassembly fixed in the housing at a portion of the first surface of the card support, the subassembly comprising a support film having an internal face and an external face and provided with a window, the subassembly further comprising
a plurality of external contacts provided on the external face of the support film, and
a microcircuit and at least one other component both mounted on the internal face of the support film,

the window being located facing the other component, the other component being an accessible component which is accessible on the surface of the smart card through the window,
wherein an external face of the subassembly and the first surface constitute a first external face of the smart card, and the second surface of the card support constitutes an opposite external face of the smart card.

2. The smart card according to claim 1 , wherein the subassembly further includes an interface component connected between the microcircuit and the accessible component.

3. The smart card according to claim 2 , wherein the interface component is a controller for the accessible component.

4. The smart card according to claim 1 , wherein the connections within the subassembly are made by connecting wires.

5. The smart card according to claim 4 , wherein each connecting wire is first connected to the microcircuit or to a component, and secondly connected to a connecting track carried by the support film.

6. The smart card according to claim 1 , wherein the housing includes at least one cavity in which the microcircuit is fixed and one cavity in which the accessible component is fixed, at least one rib being provided between the cavities.

7. The smart card according to claim 6 , wherein the support film includes an area mechanically weakened in bending between at least the microcircuit and a component and configured to bear against a rib.

8. The smart card according to claim 7 , wherein a mechanically weakened area is formed on either side of the microcircuit and of each component.

9. The smart card according to claim 6 , wherein connecting tracks are formed between the microcircuit and each component, each track facing a rib and being crossed by at least one mechanically weakened area.

10. The smart card according to claim 7 , wherein each mechanically weakened area includes at least one slot.

11. The smart card according to claim 10 , wherein each cavity is provided at the periphery of its bottom with at least one depression.

12. The smart card according to claim 6 , wherein each cavity is filled with a rigid material containing the microcircuit or a component and extending as far as the support film.

13. The smart card according to claim 1 , wherein the housing comprises at least one cavity where at least a portion of the subassembly is fixed by a resin.

14. A method for fabricating a smart card comprising:
providing a card support having first and second surfaces opposite one another and forming a housing in the card support in a portion of the thickness of the card support at the first surface of the card support;
assembling a subassembly by providing a support film having an internal face and an external face and provided with a window, providing a plurality of external contacts on the external face of the support film, and mounting a microcircuit and at least one other component on the internal face of the support film, the window being located facing the other component; and
after forming the card support and the housing, fixing the subassembly in the housing at a portion of the first surface of the card support,
wherein the other component is an accessible component which is accessible on the surface of the smart card through the window, and
wherein an external face of the subassembly and the first surface constitute a first external face of the smart card, and the second surface of the card support constitutes an opposite external face of the smart card.

15. The method according to claim 14 , wherein a cavity for the microcircuit and a cavity for the accessible component are formed in the housing.

16. The method according to claim 15 , wherein areas mechanically weakened in bending are formed in the support film at least between the microcircuit and the accessible component.

17. The method according to claim 16 , wherein areas mechanically weakened in bending are formed in the support film on either side of the microcircuit and of each component.

18. The method according to claim 15 , wherein at least one area mechanically weakened in bending is disposed facing a rib formed in the housing between two cavities.

19. The method according to claim 16 , wherein the areas mechanically weakened in bending are formed by slots.

20. The method according to claim 15 , wherein connecting tracks connected by wires to the microcircuit or to a component are crossed by the areas mechanically weakened in bending.

21. The method according to claim 15 , wherein at least one depression is formed at the periphery of the bottom of at least one cavity.

22. The method according to claim 14 , wherein the forming of a housing in the card body comprises forming at least one cavity for at least a portion of the subassembly, and
wherein the fixing of the at least a portion of the subassembly in the at least one cavity is made with a resin.

Assignees

• Launay François
• Venambre Jacques
• Oberthur Technologies

Inventors

• Launay François
• Venambre Jacques

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• G06K19/07745

  Mounting details of integrated circuit chips · CPC title

• H01L2924/00014

  Electricity · mapped topic

• H01L2224/48091

  Electricity · mapped topic

• G06K19/0718 Primary

  the sensor being of the biometric kind, e.g. fingerprint sensors (fingerprint sensors in general G06V40/13; biometric access-control systems in general, see G07C9/00) · CPC title