Fingerprint sensor module

Patent metadata

Field	Value
Publication number	US-9773153-B1
Application number	US-201615371527-A
Country	US
Kind code	B1
Filing date	Dec 7, 2016
Priority date	Mar 24, 2016
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

It is provided a fingerprint sensor module comprising: a substrate; a fingerprint sensing device mounted on a first side of the substrate; at least one connection pad arranged on the substrate and configured to electrically connect the fingerprint sensor module to an external component; and an electrically conductive layer arranged on a second side of the substrate, opposing the first side, forming a back surface of the fingerprint sensing module, wherein the electrically conductive layer is connected to control circuitry of the fingerprint sensor module for controlling a potential of a finger in contact with the electrically conductive layer. There is also provided a smart card comprising a fingerprint sensor module.

First claim

The invention claimed is:

1. A fingerprint sensor module comprising:
a substrate;
a fingerprint sensing device mounted on a first side of the substrate;
at least one connection pad arranged on the substrate and configured to electrically connect the fingerprint sensor module to an external component; and
an electrically conductive layer arranged on a second side of the substrate, opposing the first side, forming a back surface of the fingerprint sensing module, wherein the electrically conductive layer controls a potential of a finger in contact with the electrically conductive layer using control circuitry of the fingerprint sensor module.

2. The sensor module according to claim 1 , further comprising a cover layer arranged on the substrate covering a portion of the substrate to encapsulate at least a portion of the fingerprint sensing device.

3. The sensor module according to claim 2 , wherein the at least one connection pad is arranged on the first side of the substrate, and wherein the cover layer does not cover the at least one connection pad.

4. The sensor module according to claim 3 , wherein the at least one connection pad is arranged adjacent to an edge of the substrate.

5. The sensor module according to claim 2 , wherein a shape of the cover layer is the same as a shape of the substrate, and wherein an area of the cover layer is smaller than an area of the substrate.

6. The sensor module according to claim 2 , wherein a center of the cover layer is aligned with a center of the substrate.

7. The sensor module according to claim 1 , wherein the at least one connection pad is arranged on the second side of the substrate, and galvanically isolated from the conductive layer.

8. The sensor module according to claim 1 , wherein the control circuitry is configured to provide a drive signal or ground potential to the electrically conductive layer.

9. The sensor module according to claim 1 , wherein the electrically conductive layer is connected to the control circuitry by means of a via connection through the substrate.

10. The sensor module according to claim 1 , wherein the electrically conductive layer is a metal layer.

11. The sensor module according to claim 1 , wherein the electrically conductive layer is patterned.

12. The sensor module according to claim 1 , further comprising a coating layer arranged on the fingerprint sensing device.

13. The sensor module according to claim 12 , wherein the coating layer is colored.

14. The sensor module according to claim 12 , wherein the coating layer comprises a pattern.

15. A smart card comprising smart card circuitry and a sensor module according to claim 1 , wherein the smart card comprises an opening in which the sensor module is arranged and wherein the fingerprint sensor module is electrically connected to the smart card circuitry via a connection point arranged in contact with the connection pad of the sensor module.

16. The smart card according to claim 15 , comprising:
a first layer comprising a first opening having a size and shape corresponding to the cover layer of the sensor module;
a second layer comprising a second opening, larger than the first opening and having a size and shape corresponding the substrate of the sensor module; and
a conductive layer comprising the connection point, arranged between the first layer and the second layer, wherein the sensor module is arranged such that a connection pad of the sensor module makes contact with the connection point of the smart card.

17. The smart card according to claim 16 , wherein an outer surface of the first layer of the smart card is in the same plane as a sensing surface of the sensor module; and
an outer surface of the second layer of the smart card is in the same plane as the electrically conductive layer of the sensor module.

18. A smart card comprising smart card circuitry and a sensor module according to claim 1 , wherein the smart card comprises a recess in which the sensor module is arranged such that the fingerprint sensing device is covered by a first layer of said smart card; and wherein the fingerprint sensor module is electrically connected to the smart card circuitry via a connection point arranged in contact with the connection pad of the sensor module.

Assignees

• Fingerprint Cards Ab

Inventors

• Slottner Mats

Classifications

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

• G06K19/0718

  the sensor being of the biometric kind, e.g. fingerprint sensors (fingerprint sensors in general G06V40/13; biometric access-control systems in general, see G07C9/00) · CPC title

• G06K9/00087

  Physics · mapped topic

• G06K9/00053 Primary

  Physics · mapped topic

• G06V40/1306 Primary

  non-optical, e.g. ultrasonic or capacitive sensing · CPC title