Titanium-containing film forming compositions for vapor deposition of titanium-containing films

US9790591B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9790591-B2
Application numberUS-201514954319-A
CountryUS
Kind codeB2
Filing dateNov 30, 2015
Priority dateNov 30, 2015
Publication dateOct 17, 2017
Grant dateOct 17, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Titanium-containing film forming compositions are disclosed as well as methods of synthesizing the same and methods of forming Titanium-containing films on substrates via vapor deposition processes using the Titanium-containing film forming compositions. The Titanium-containing film forming compositions comprise a precursor having the formula Ti(R 5 Cp) 2 (L), wherein each R is independently H, an alkyl group, or R′ 3 Si, with each R′ independently being H or an alkyl group; L is selected from the group consisting of formamidinates (N R,R′ -fmd) or amidinates (N R,R′ R″-amd).

First claim

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We claim: 1. A Titanium-containing film forming composition comprising a liquid precursor having the formula Ti(R 5 Cp) 2 (L) wherein Cp is cyclopentadienyl, each R is independently H, an alkyl group, or R′ 3 Si, with each R′ independently being H or an alkyl group; and L is a formamidinate ligand having the chemical formula R—N—C(H)═N—R′, shown as: (N R′,R′ -fmd or N R -fmd when R═R′) or am idinate ligand having the chemical formula R—N—C(R″)═N—R′, shown as: (N R′,R′ R″-amd or N R R″-amd when R═R′), wherein R and R′ are alkyl groups or SiMe 3 and R″ is an alkyl group. 2. The Titanium-containing film forming composition of claim 1 , wherein the liquid precursor has the formula Ti(R 5 Cp) 2 (N R′,R′ -fmd) or Ti(R 5 Cp) 2 (N R -fmd) when R═R′. 3. The Titanium-containing film forming composition of claim 2 , wherein the liquid precursor is selected from the group consisting Ti(Cp) 2 (N Me -fmd), Ti(Cp) 2 (N Et -fmd), Ti(Cp) 2 (N iPr -fmd), Ti(Cp) 2 (N nPr -fmd), Ti(Cp) 2 (N iBu -fmd), Ti(Cp) 2 (N nBu -fmd), Ti(Cp) 2 (N tBu -fmd), Ti(Cp) 2 (N sBu -fmd), Ti(Cp) 2 (N tAm -fmd), Ti(Cp) 2 (N TMS -fmd), Ti(MeCp) 2 (N Me -fmd), Ti(MeCp) 2 (N Et -fmd), Ti(MeCp) 2 (N iPr -fmd), Ti(MeCp) 2 (N nPr -fmd), Ti(MeCp) 2 (N iBu -fmd), Ti(MeCp) 2 (N nBu -fmd), Ti(MeCp) 2 (N tBu -fmd), Ti(MeCp) 2 (N sBu -fmd), Ti(MeCp) 2 (N tAm -fmd), Ti(MeCp) 2 (N TMS -fmd), Ti(EtCp) 2 (N Me -fmd), Ti(EtCp) 2 (N Et -fmd), Ti(EtCp) 2 (N iPr -fmd), Ti(EtCp) 2 (N nPr -fmd), Ti(EtCp) 2 (N iBu -fmd), Ti(EtCp) 2 (N nBu -fmd), Ti(EtCp) 2 (N tBu -fmd), Ti(EtCp) 2 (N sBu -fmd), Ti(EtCp) 2 (N tAm -fmd), Ti(EtCp) 2 (N TMS -fmd), Ti(iPrCp) 2 (N Me -fmd), Ti(iPrCp) 2 (N Et -fmd), Ti(iPrCp) 2 (N iPr -fmd), Ti(iPrCp) 2 (N nPr -fmd), Ti(iPrCp) 2 (N iBu -fmd), Ti(iPrCp) 2 (N nBu -fmd), Ti(iPrCp) 2 (N tBu -fmd), Ti(iPrCp) 2 (N sBu -fmd), Ti(iPrCp) 2 (N tAm -fmd), Ti(iPrCp) 2 (N TMS -fmd), Ti(tBuCp) 2 (N Me -fmd), Ti(tBuCp) 2 (N Et -fmd), Ti(tBuCp) 2 (N iPr -fmd), Ti(tBuCp) 2 (N nPr -fmd), Ti(tBuCp) 2 (N nBu -fmd), Ti(tBuCp) 2 (N nBu -fmd), Ti(tBuCp) 2 (N tBu -fmd), Ti(tBuCp) 2 (N sBu -fmd), Ti(tBuCp) 2 (N tAm -fmd), Ti(tBuCp) 2 (N TMS -fmd), Ti(iPr 3 Cp) 2 (N Me -fmd), Ti(iPr 3 Cp) 2 (N Et -fmd), Ti(iPr 3 Cp) 2 (N iPr -fmd), Ti(iPr 3 Cp) 2 (N nPr -fmd), Ti(iPr 3 Cp) 2 (N iBu -fmd), Ti(iPr 3 Cp) 2 (N nBu -fmd), Ti(iPr 3 Cp) 2 (N tBu -fmd), Ti(iPr 3 Cp) 2 (N sBu -fmd), Ti(iPr 3 Cp) 2 (N tAm -fmd), Ti(iPr 3 Cp) 2 (N TMS -fmd), Ti(Cp*) 2 (N Me -fmd), Ti(Cp*) 2 (N Et -fmd), Ti(Cp*) 2 (N iPr -fmd), Ti(Cp*) 2 (N nPr -fmd), Ti(Cp*) 2 (N iBu -fmd), Ti(Cp*) 2 (N nBu -fmd), Ti(Cp*) 2 (N tBu -fmd), Ti(Cp*) 2 (N sBu -fmd), Ti(Cp*) 2 (N tAm -fmd), Ti(Cp*) 2 (N TMS -fmd), Ti(Me 3 SiCp) 2 (N Me -fmd), Ti(Me 3 SiCp) 2 (N Et -fmd), Ti(Me 3 SiCp) 2 (N iPr -fmd), Ti(Me 3 SiCp) 2 (N nPr -fmd), Ti(Me 3 SiCp) 2 (N iBu -fmd), Ti(Me 3 SiCp) 2 (N nBu -fmd), Ti(Me 3 SiCp) 2 (N tBu -fmd), Ti(Me 3 SiCp) 2 (N sBu -fmd), Ti(Me 3 SiCp) 2 (N tAm -fmd), Ti(Me 3 SiCp) 2 (N TMS -fmd), Ti(Cp)(Cp*)(N Me -fmd), Ti(Cp)(iPr 3 Cp)(N Me -fmd), Ti(Cp)(MeCp)(N Et -fmd), Ti(Cp)(EtCp)(N iPr -fmd), Ti(Cp)(iPrCp)(N nPr -fmd), Ti(Cp)(nPrCp)(N iBu -fmd), Ti(Cp)(iBuCp)(N nBu -fmd), Ti(Cp)(tBuCp)(N tBu -fmd), Ti(Cp)(tAmCp)(N sBu -fmd), Ti(Cp) 2 (N Et, tBu -fmd), Ti(MeCp) 2 (N Et, tBu -fmd) or Ti(EtCp) 2 (N Et, tBu -fmd). 4. The Titanium-containing film forming composition of claim 3 , wherein the liquid precursor is Ti(EtCp) 2 (N iPr -fmd). 5. The Titanium-containing film forming composition of claim 1 , wherein the liquid precursor has the formula Ti(R 5 Cp) 2 (N R′,R′ R″-amd) or Ti(R 5 Cp) 2 (N R R″-amd) when R═R′. 6. The Titanium-containing film forming composition of claim 5 , wherein the liquid precursor is selected from the group consisting of Ti(Cp) 2 (N Me Me-amd), Ti(Cp) 2 (N Et Me-amd), Ti(Cp) 2 (N nPr Me-amd), Ti(Cp) 2 (N iBu Me-amd), Ti(Cp) 2 (N nBu Me-amd), Ti(Cp) 2 (N sBu Me-amd), Ti(Cp) 2 (N tAm Me-amd), Ti(Cp) 2 (N TMS Me-amd), Ti(MeCp) 2 (N Me Me-amd), Ti(MeCp) 2 (N Et Me-amd), Ti(MeCp) 2 (N nPr Me-amd), Ti(MeCp) 2 (N iBu Me-amd), Ti(MeCp) 2 (N nBu Me-amd), Ti(MeCp) 2 (N tBu Me-amd), Ti(MeCp) 2 (N sBu Me-amd), Ti(MeCp) 2 (N tAm Me-amd), Ti(MeCp) 2 (N TMS Me-amd), Ti(EtCp) 2 (N Me Me-amd), Ti(EtCp) 2 (N Et Me-amd), Ti(EtCp) 2 (N iPr Me-amd), Ti(EtCp) 2 (N nPr Me-amd), Ti(EtCp) 2 (N iBu Me-amd), Ti(EtCp) 2 (N nBu Me-amd), Ti(EtCp) 2 (N tBu Me-amd), Ti(EtCp) 2 (N sBu Me-amd), Ti(EtCp) 2 (N tAm Me-amd), Ti(EtCp) 2 (N TMS Me-amd), Ti(iPrCp) 2 (N Me Me-amd), Ti(iPrCp) 2 (N Et Me-amd), Ti(iPrCp) 2 (N iPr Me-amd), Ti(iPrCp) 2 (N nPr Me-amd), Ti(iPrCp) 2 (N iBu Me-amd), Ti(iPrCp) 2 (N nBu Me-amd), Ti(iPrCp) 2 (N tBu Me-amd), Ti(iPrCp) 2 (N sBu Me-amd), Ti(iPrCp) 2 (N tAm Me-amd), Ti(iPrCp) 2 (N TMS Me-amd), Ti(tBuCp) 2 (N Me Me-amd), Ti(tBuCp) 2 (N Et Me-amd), Ti(tBuCp) 2 (N iPr Me-amd), Ti(tBuCp) 2 (N nPr Me-amd), Ti(tBuCp) 2 (N iBu Me-amd), Ti(tBuCp) 2 (N nBu Me-amd), Ti(tBuCp) 2 (N tBu Me-amd), Ti(tBuCp) 2 (N sBu Me-amd), Ti(tBuCp) 2 (N tAm Me-amd), Ti(tBuCp) 2 (N TMS Me-amd), Ti(iPr 3 Cp) 2 (N Me Me-amd), Ti(iPr 3 Cp) 2 (N Et Me-amd), Ti(iPr 3 Cp) 2 (N iPr Me-amd), Ti(iPr 3 Cp) 2 (N nPr Me-amd), Ti(iPr 3 Cp) 2 (N iBu Me-amd), Ti(iPr 3 Cp) 2 (N nBu Me-amd), Ti(iPr 3 Cp) 2 (N tBu Me-amd), Ti(iPr 3 Cp) 2 (N sBu Me-amd), Ti(iPr 3 CO 2 (N tAm Me-amd), Ti(iPr 3 Cp) 2 (N TMS Me-amd), Ti(Cp*) 2 (N Me Me-amd), Ti(Cp*) 2 (N Et Me-amd), Ti(Cp*) 2 (N iPr Me-amd), Ti(Cp*) 2 (N nPr Me-amd), Ti(Cp*) 2 (N iBu Me-amd), Ti(Cp*) 2 (N nBu Me-amd), Ti(Cp*) 2 (N tBu Me-amd), Ti(Cp*) 2 (N sBu Me-amd), Ti(Cp*) 2 (N tAm Me-amd), Ti(Cp*) 2 (N TMS Me-amd), Ti(Me 3 SiCp) 2 (N Me Me-amd), Ti(Me 3 SiCp) 2 (N Et Me-amd), Ti(Me 3 SiCp) 2 (N iPr Me-amd), Ti(Me 3 SiCp) 2 (N nPr Me-amd), Ti(Me 3 SiCp) 2 (N iBu Me-amd), Ti(Me 3 SiCp) 2 (N nBu Me-amd), Ti(Me 3 SiCp) 2 (N tBu Me-amd), Ti(Me 3 SiCp) 2 (N sBu Me-amd), Ti(Me 3 SiCp) 2 (N tAm Me-amd), Ti(Me 3 SiCp) 2 (N TMS Me-amd), Ti(Cp)(Cp*)(N Me Me-amd), Ti(Cp)(iPr 3 Cp)(N Me Me-amd), Ti(Cp)(MeCp)(N Et Me-amd), Ti(Cp)(EtCp)(N iPr Me-amd), Ti(Cp)(iPrCp)(N nPr Me-amd), Ti(Cp)(nPrCp)(N iBu Me-amd), Ti(Cp)(iBuCp)(N nBu Me-amd), Ti(Cp)(tBuCp)(N tBu Me-amd), Ti(Cp)(tAmCp)(N sBu Me-amd), Ti(Cp) 2 (N iPr Et-amd), Ti(Cp) 2 (N iPr nPr-amd), Ti(Cp) 2 (N iPr iPr-amd), Ti(Cp) 2 (N iPr tBu-amd), Ti(Cp) 2 (N iPr iBu-amd), Ti(Cp) 2 (N iPr sBu-amd), Ti(MeCp) 2 (N iPr Et-amd), Ti(MeCp) 2 (N iPr nPr-amd), Ti(MeCp) 2 (N iPr iPr-amd), Ti(MeCp) 2 (N iPr tBu-amd), Ti(MeCp) 2 (N iPr nBu-amd), Ti(MeCp) 2 (N iPr iBu-amd), Ti(MeCp) 2 (N iPr sBu-amd), Ti(EtCp) 2 (N iPr Et-amd), Ti(EtCp) 2 (N iPr nPr-amd), Ti(EtCp) 2 (N iPr iPr-amd), Ti(EtCp) 2 (N iPr tBu-amd), Ti(EtCp) 2 (N iPr nBu-amd), Ti(EtCp) 2 (N iPr iBu-amd), and Ti(EtCp) 2 (N iPr sBu-amd). 7. The Titanium-containing film forming composition of claim 6 , wherein the liquid precursor is Ti(EtCp) 2 (N iPr Me-amd). 8. The Titanium-containing film forming composition of claim 1 , the composition comprising between approximately 95.0% w/w and approximately 100.0% w/w of the liquid precursor. 9. The Titanium-containing film forming composition of claim 1 , the composition comprising between approximately 0.0% w/w and approximately 5.0% w/w impurities. 10. A method of forming a Titanium-containing film, the method comprising introducing into a reactor having a substrate therein a vapor of a Titanium-containing film forming composition comprising a liquid precursor having the formula Ti(R 5 Cp) 2 (L) wherein Cp is cyclopentadienyl, each R is independently H, an

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Classifications

  • Reduction of impurities in the source gas · CPC title

  • of refractory metals or yttrium · CPC title

  • Nitrides {(C23C16/303 takes precedence)} · CPC title

  • C23C16/18Primary

    from metallo-organic compounds · CPC title

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What does patent US9790591B2 cover?
Titanium-containing film forming compositions are disclosed as well as methods of synthesizing the same and methods of forming Titanium-containing films on substrates via vapor deposition processes using the Titanium-containing film forming compositions. The Titanium-containing film forming compositions comprise a precursor having the formula Ti(R 5 Cp) 2 (L), wherein each R is independently H,…
Who is the assignee on this patent?
L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
What technology area does this patent fall under?
Primary CPC classification C23C16/18. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 17 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).