Solder material and bonded structure

Patent metadata

Field	Value
Publication number	US-9789569-B2
Application number	US-201514920772-A
Country	US
Kind code	B2
Filing date	Oct 22, 2015
Priority date	Nov 27, 2013
Publication date	Oct 17, 2017
Grant date	Oct 17, 2017

Abstract

Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0<[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0<[Cu]<0.5, In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]≦6.8 when [Cu] falls within a range of 0.5≦[Cu]≦1.0, In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2. A balance includes only not less than 87 mass % of Sn.

First claim

What is claimed is:

1. Solder material used in soldering a component electrode and a substrate electrode,
where the component electrode includes an Au electrode and a Cu electrode, or the substrate electrode includes an Au electrode and a Cu electrode, the solder material comprising:
Ag (silver) satisfying 0.3≦[Ag]<4.0;
where 0.5 mass % and 1.0 mass % of Ag are excluded,
Bi (bismuth) satisfying 0≦[Bi]≦1.0;
Cu (copper) satisfying 0.2≦[Cu]≦1.2;
In (indium) in a range of 6.0≦[In]6.8 when [Cu] falls within a range of 0.2≦[Cu]<0.5;
In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]6.8 when [Cu] falls within a range of 0.5[Cu]1.0; and
In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2,
with a balance including 87≦[Sn],
where contents (mass %) of Ag, Bi, Cu, In, and Sn (tin) in the solder material are denoted by [Ag], [Bi], [Cu], [In] and [Sn], respectively.

2. The solder material of claim 1 , wherein
Ag satisfies 0.5≦[Ag]≦3.8,
Bi satisfies 0.2≦[Bi]≦1.0,
In satisfies 6.0≦[In]≦6.8,
Cu satisfies 0.2≦[Cu]≦1.2, and
a balance includes only not less than 87.2 mass % of Sn.

3. The solder material of claim 1 , wherein
Ag satisfies 1.8≦[Ag]≦3.8,
Bi satisfies 0.2≦[Bi]≦1.0,
In satisfies 6.0≦[In]≦6.7,
Cu satisfies 0.8≦[Cu]≦1.2, and
a balance includes only not less than 87.3 mass % of Sn.

4. The solder material of claim 1 , wherein
Ag satisfies 3.5≦[Ag]≦3.8,
Bi satisfies 0.6≦[Bi]≦1.0,
In satisfies 6.0≦[In]≦6.1,
Cu satisfies 1.1≦[Cu]≦1.2, and
a balance includes only not less than 87.9 mass % of Sn.

5. The solder material of claim 1 , wherein
Bi satisfies [Bi]=0,
Ag satisfies 0.5[Ag]≦3.2,
In satisfies 6.0[In]≦6.8,
Cu satisfies 0.6[Cu]≦1.1, and
a balance includes only not less than 88.9 mass % of Sn.

6. The solder material of claim 1 , wherein
Bi satisfies [Bi]=0,
Ag satisfies 2.8[Ag]≦3.2,
In satisfies 6.0[In]≦6.2,
Cu satisfies 0.85[Cu]≦1.1, and
a balance includes only not less than 89.5 mass % of Sn.

7. A bonded structure comprising:
solder material defined in claim 1 ;
an electronic circuit board having a plurality of substrate electrodes; and
an electronic component having a plurality of component electrodes,
wherein any of the plurality of substrate electrodes and the plurality of component electrodes is the Au electrode including Ni plating containing P (phosphorous), and
the plurality of substrate electrodes and the plurality of component electrodes are bonded to each other with the solder material.

8. A bonded structure comprising:
solder material defined in claim 2 ;
an electronic circuit board having a plurality of substrate electrodes; and
an electronic component having a plurality of component electrodes,
wherein any of the plurality of substrate electrodes and the plurality of component electrodes is the Au electrode including Ni plating containing P (phosphorous), and
the plurality of substrate electrodes and the plurality of component electrodes are bonded to each other with the solder material.

9. A bonded structure comprising:
solder material defined in claim 3 ;
an electronic circuit board having a plurality of substrate electrodes; and
an electronic component having a plurality of component electrodes,
wherein any of the plurality of substrate electrodes and the plurality of component electrodes is the Au electrode including Ni plating containing P (phosphorous), and
the plurality of substrate electrodes and the plurality of component electrodes are bonded to each other with the solder material.

10. A bonded structure comprising:
solder material defined in claim 4 ;
an electronic circuit board having a plurality of substrate electrodes; and
an electronic component having a plurality of component electrodes,
wherein any of the plurality of substrate electrodes and the plurality of component electrodes is the Au electrode including Ni plating containing P (phosphorous), and
the plurality of substrate electrodes and the plurality of component electrodes are bonded to each other with the solder material.

11. A bonded structure comprising:
solder material defined in claim 5 ;
an electronic circuit board having a plurality of substrate electrodes; and
an electronic component having a plurality of component electrodes,
wherein any of the plurality of substrate electrodes and the plurality of component electrodes is the Au electrode including Ni plating containing P (phosphorous), and
the plurality of substrate electrodes and the plurality of component electrodes are bonded to each other with the solder material.

12. A bonded structure comprising:
solder material defined in claim 6 ;
an electronic circuit board having a plurality of substrate electrodes; and
an electronic component having a plurality of component electrodes,
wherein any of the plurality of substrate electrodes and the plurality of component electrodes is the Au electrode including Ni plating containing P (phosphorous), and
the plurality of substrate electrodes and the plurality of component electrodes are bonded to each other with the solder material.

Assignees

• Panasonic Ip Man Co Ltd
• Panasonic Intellectual Property Managment Co Ltd

Inventors

• Furusawa Akio
• Hine Kiyohiro
• Mori Masato
• Nakamura Taichi

Classifications

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• H05K2201/10909

  Materials of terminal, e.g. of leads or electrodes of components · CPC title

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title