Apparatus and methods related to ground paths implemented with surface mount devices

Patent metadata

Field	Value
Publication number	US-9788466-B2
Application number	US-201414252717-A
Country	US
Kind code	B2
Filing date	Apr 14, 2014
Priority date	Apr 16, 2013
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a module can include a packaging substrate configured to receive a plurality of components. The module can further include an RF component mounted on the packaging substrate and configured to facilitate processing of an RF signal. The module can further include an RF shield disposed relative to the RF component, with the RF shield being configured to provide shielding for the RF component. The RF shield can include at least one shielding-component configured to provide one or more electrical paths between a conductive layer on an upper surface of the module and a ground plane of the packaging substrate. The shielding-component can include a surface-mount device such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD).

First claim

What is claimed is:

1. A radio-frequency (RF) module comprising:
a packaging substrate configured to receive a plurality of components, the packaging substrate including a ground plane;
a conductive layer implemented over the packaging substrate;
a surface mount device (SMD) mounted on the packaging substrate, the surface mount device configured to electrically connect the conductive layer with the ground plane, the surface mount device providing RF shielding between first and second regions about the surface mount device, the first and second regions being within the radio-frequency module, and the first and second regions being on opposite sides of the surface mount device;
an overmold formed over the packaging substrate, the overmold encapsulating the surface mount device; and
an opening defined in the overmold at a region over the surface mount device, the opening having sufficient depth to expose a region of the surface mount device and the opening having a chamfer profile.

2. The radio-frequency module of claim 1 wherein the first region is on the packaging substrate, and the second region is outside of the module.

3. The radio-frequency module of claim 1 wherein each of the first and second regions is on the packaging substrate.

4. The radio-frequency module of claim 1 wherein the surface mount device includes a functional component.

5. The radio-frequency module of claim 4 wherein the functional component includes an upper connection feature in electrical contact with the conductive layer, a lower connection feature in electrical contact with the ground plane, and at least one interconnection feature configured to electrically connect the conductive layer with the ground plane.

6. The radio-frequency module of claim 5 wherein the functional component includes a functional die such that the upper connection feature includes a metal layer formed on one side of the die.

7. The radio-frequency module of claim 6 wherein the at least one interconnection feature includes at least one through-die conductive via.

8. The radio-frequency module of claim 7 wherein the lower connection feature includes a contact feature that electrically connects the through-die conductive via with the ground plane.

9. The radio-frequency module of claim 8 wherein the die includes a radio-frequency (RF) filter.

10. The RF module of claim 9 wherein the RF filter is a chip size surface acoustic wave (SAW) device (CSSD).

11. The radio-frequency module of claim 9 wherein the die is mounted on the surface of the packaging substrate in an orientation that is inverted relative to its designed usage orientation.

12. The radio-frequency module of claim 1 wherein the module is substantially free of shielding-wirebonds.

13. The radio-frequency module of claim 1 further comprising a plurality of shielding-wirebonds implemented relative to the surface mount device, the plurality of wirebonds configured to provide the RF shielding in combination with the surface mount device.

14. The radio-frequency module of claim 13 wherein the surface mount device is positioned on the packaging substrate to provide shielding along a segment that would otherwise be shielded by one or more shielding-wirebonds.

15. The radio-frequency module of claim 14 further comprising a conductive racetrack implemented under the plurality of shielding-wirebonds, the conductive racetrack electrically connected to the shielding-wirebonds and a ground plane within the packaging substrate.

16. The radio-frequency module of claim 15 wherein the surface mount device is positioned along an edge of the packaging substrate.

17. The radio-frequency module of claim 16 wherein a portion of the edge occupied by the surface mount device is substantially free of the conductive racetrack.

Assignees

• Skyworks Solutions Inc

Inventors

• Chen Howard E

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/5453

  connecting between multiple bond pads on a chip, e.g. daisy chain · CPC title