Pipe forming part of a heat exchanger and heat exchanger comprising such a pipe
US-2015362261-A1 · Dec 17, 2015 · US
Thermal stand-off with tortuous solid-wall thermal conduction path
US9788459B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9788459-B2 |
| Application number | US-201414219041-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2014 |
| Priority date | Mar 19, 2014 |
| Publication date | Oct 10, 2017 |
| Grant date | Oct 10, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distance of the spatial region. The tortuous solid-wall thermal conduction path can include a tensile spring constant that is greater than a maximum tensile spring constant of a coil spring that fits in the same spatial region and is formed of the same material composition. The tortuous solid-wall thermal conduction path can include an antegrade section and, relative the antegrade section, a retrograde section.
First claim
Opening claim text (preview).
What is claimed is: 1. A thermal stand-off comprising: a rigid thermal stand-off section within a spatial region extending along a distance between a first location and second, opposed location, the rigid thermal stand-off section including a tortuous solid-wall thermal conduction path extending from the first location to the second location, the tortuous solid-wall thermal conduction path being longer than the distance of the spatial region, wherein the tortuous solid-wall thermal conduction path includes an antegrade section and, relative the antegrade section, a retrograde section, wherein the antegrade section and the retrograde section provide a back turn with respect to a reference start location at the first location and a reference end location at the second location a sleeve extending around the rigid thermal stand-off section, the sleeve extending from one side of the rigid thermal stand-off section at least partially over the length. 2. A thermal stand-off comprising: a rigid thermal stand-off section within a spatial region extending along a distance between a first location and second, opposed location, the rigid thermal stand-off section including a tortuous solid-wall thermal conduction path extending from the first location to the second location, the tortuous solid-wall thermal conduction path being longer than the distance of the spatial region, wherein the tortuous solid-wall thermal conduction path includes an antegrade section and, relative the antegrade section, a retrograde section, wherein the antegrade section and the retrograde section provide a back turn with respect to a reference start location at the first location and a reference end location at the second location a sleeve extending around the rigid thermal stand-off section and partially over the length, the sleeve extending from a connected base at the one side of the rigid thermal stand-off section to a free end distal from the one side of the rigid thermal stand-off section.
Assignees
Inventors
Classifications
Thermal insulation; Thermal decoupling · CPC title
Heat conductive materials · CPC title
- F28F13/00Primary
Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence) · CPC title
- H05K7/20436Primary
Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title
- F16L59/02Primary
Shape or form of insulating materials, with or without coverings integral with the insulating materials · CPC title
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- What does patent US9788459B2 cover?
- A thermal stand-off includes a rigid thermal stand-off section within a spatial region that extends along a distance between a first location and second, opposed location. The rigid thermal stand-off section includes a tortuous solid-wall thermal conduction path that extends from the first location to the second location. The tortuous solid-wall thermal conduction path is longer than the distan…
- Who is the assignee on this patent?
- Aerojet Rocketdyne Inc
- What technology area does this patent fall under?
- Primary CPC classification F28F13/00. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Oct 10 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).