Printed wiring board

Patent metadata

Field	Value
Publication number	US-9788426-B2
Application number	US-201515327476-A
Country	US
Kind code	B2
Filing date	Jul 10, 2015
Priority date	Jul 22, 2014
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A printed wiring board including: a first substrate on which a plurality of pads to be connected to a connector is arranged to form a front array and a rear array in two rows; a second substrate that is laminated on the first substrate and formed with first wirings connected to first pads of the front array and second wirings connected through vias to second pads of the rear array; engageable parts that are to be engaged with engagement parts of the connector; and one or more reinforcement layers that are provided at the frontward side in the connecting direction than the engageable parts of the first substrate and/or the second substrate. The wirings each have a part formed to have a constant width along the inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width in the inserting direction of the connector.

First claim

The invention claimed is:

1. A printed wiring board of a multilayer structure comprising:
a plurality of substrates including at least a first substrate and a second substrate, the first substrate being formed with a plurality of pads to be electrically connected to a connector, the second substrate being laminated directly on or indirectly via a substrate other than the first substrate on any one of main surfaces of the first substrate, the second substrate being formed with wirings on any one of main surfaces;
an engageable part formed at a connection end portion to be connected to the connector, the engageable part being to be engaged with an engagement part of the connector; and
one or more reinforcement layers provided on one or more main surfaces possessed by the plurality of substrates, the one or more reinforcement layers being provided at locations at a frontward side than a location at which the engageable part is provided, with reference to a connecting direction when the printed wiring board is connected to the connector,
the plurality of pads formed on the first substrate being disposed within the connection end portion at one main surface side of the first substrate, the plurality of pads formed on the first substrate being arranged to form a front array and a rear array in two rows when viewed in the connecting direction to the connector,
the wirings formed on the second substrate including first wirings and second wirings, the first wirings being connected through vias penetrating the one or more substrates to first pads of the front array among the plurality of pads arranged to form the front array and the rear array in two rows, the second wirings being connected through vias penetrating the one or more substrates to second pads of the rear array among the plurality of pads arranged to form the front array and the rear array in two rows,
the wirings each having a part formed to have a constant width along an inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width at a side of the connection end portion in the inserting direction to the connector, the expanded-width part being provided at a location corresponding to each of the pads,
the expanded-width parts including first expanded-width parts having approximately same shape as that of the first pads and second expanded-width parts having approximately same shape as that of the second pads.

2. The printed wiring board according to claim 1 , wherein the second substrate has wirings formed on other main surface opposite to the one main surface of the second substrate.

3. The printed wiring board according to claim 1 , further comprising
one or more third substrates,
wherein each of the third substrates has wirings formed on one main surface and/or other main surface of the third substrate,
wherein the one or more reinforcement layers are provided on one main surface and/or other main surface of any one or more of substrates among the plurality of substrates, wherein the one or more reinforcement layers are provided at locations at the frontward side than the location at which the engageable part is provided, with reference to the connecting direction to the connector.

4. The printed wiring board according to claim 1 , wherein the first substrate includes a substrate formed with the plurality of pads at one main surface side and a substrate formed with the plurality of pads at other main surface side opposite to the one main surface.

5. The printed wiring board according to claim 1 , wherein the one or more reinforcement layers are provided on one or more main surfaces among main surfaces formed with the wirings.

6. The printed wiring board according to claim 5 , wherein the one or more reinforcement layers are formed integrally with some of the wirings.

7. The printed wiring board according to claim 5 , wherein the one or more reinforcement layers are formed separately from the wirings.

8. The printed wiring board according to claim 1 , wherein the one or more reinforcement layers are provided on one or more main surfaces among main surfaces formed with the pads.

9. The printed wiring board according to claim 8 , wherein the one or more reinforcement layers are formed integrally with some of the pads.

10. The printed wiring board according to claim 8 , wherein the one or more reinforcement layers are formed separately from the pads.

11. The printed wiring board according to claim 1 , further comprising
an insulating layer covering surfaces of the one or more reinforcement layers.

Assignees

• Fujikura Ltd
• Ddk Ltd

Inventors

• Ishida Yuki
• Suzuki Masayuki
• Urai Harunori

Classifications

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2201/041

  Stacked PCBs, i.e. having neither an empty space nor mounted components in between · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H01R12/77

  for flexible printed circuits, flat or ribbon cables or like structures · CPC title