Ceramic-based light emitting diode (LED) devices, components, and methods

Patent metadata

Field	Value
Publication number	US-9786825-B2
Application number	US-201313836940-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Feb 7, 2012
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a ceramic body having a top surface, one or more light emitter devices mounted directly or indirectly on the top surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the ceramic body by one or more non-metallic layers. Components disclosed herein can result in improved light extraction and thermal management.

First claim

What is claimed is:

1. A light emitter device component comprising:
a non-metallic body having a top surface and a bottom surface opposing the top surface;
at least one or more base layer coupled to the bottom surface and extending beyond at least a portion of a footprint of the non-metallic body, the one or more base layer comprising a substrate bonded to one of a reflective film or a reflective foil positioned against the bottom surface of the non-metallic body, the substrate comprising aluminum;
one or more light emitter devices mounted on the top surface, the non-metallic body having a width that is greater than a width of the one or more light emitter devices; and
one or more electrical components mounted on the top surface separate from the one or more light emitter devices but electrically coupled to the one or more light emitter devices;
wherein the non-metallic body has a porosity such that the non-metallic body is configured to reflect a portion of light emitted by the one or more light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and
wherein the reflective film or reflective foil is positioned to reflect the light transmitted to the bottom surface.

2. The light emitter device component according to claim 1 , wherein the non-metallic body comprises a ceramic material.

3. The light emitter device component according to claim 2 , wherein the non-metallic body comprises a thick-film ceramic substrate.

4. The light emitter device component according to claim 2 , wherein the non-metallic body comprises a thin-film ceramic substrate.

5. The light emitter device component according to claim 2 , wherein the non-metallic body has an open porosity of between approximately 0% and 15%.

6. The light emitter device component according to claim 1 , wherein the non-metallic body has a thickness of 2 mm or less, 1.5 mm or less, or 1 mm or less.

7. The light emitter device component according to claim 1 , wherein the one or more base layer is coupled to the non-metallic body by a layer of adhesive material.

8. The light emitter device component according to claim 7 , wherein the layer of adhesive material comprises a layer of an epoxy, a silicone adhesive, a silicone RTV and/or a pressure sensitive adhesive.

9. The light emitter device component according to claim 1 , wherein the reflective film or reflective foil comprises a reflective film having a thickness of between approximately 0.1 and 5 μm.

10. The light emitter device component according to claim 1 , wherein the reflective film or reflective foil comprises a reflective foil having a thickness of between approximately 25 and 200 μm.

11. The light emitter device component according to claim 1 , wherein the one or more base layer comprises a reflective material having a thickness of between approximately 0.25 and 1.5 mm.

12. The light emitter device component according to claim 1 , wherein the one or more electrical components are spaced from the non-metallic body by one or more non-metallic layers.

13. A method of forming a light emitter device component, the method comprising:
coupling a bottom surface of a non-metallic body to one or more base layer comprising a substrate bonded to one of a reflective film or a reflective foil positioned against the bottom surface of the non-metallic body, the substrate comprising aluminum, and the one or more base layer extending beyond at least a portion of a footprint of the non-metallic body;
mounting one or more light emitter devices on a top surface of the non-metallic body opposing the bottom surface without metal layers at a die attach interface, the non-metallic body having a width that is greater than a width of the one or more light emitter devices;
providing one or more non-metallic layer on the top surface of the non-metallic body; and
mounting one or more electrical components to the one or more non-metallic layer and electrically coupling the one or more electrical components to the one or more light emitter devices;
wherein the non-metallic body has a porosity such that the non-metallic body is configured to reflect a portion of light emitted by the one or more light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and
wherein the reflective film or reflective foil is positioned to reflect the light transmitted to the bottom surface.

14. The method of claim 13 , wherein coupling a bottom surface of a non-metallic body to one or more base layer comprises applying a layer of adhesive material between the non-metallic body and the one or more base layer.

15. The method of claim 14 , wherein applying a layer of adhesive material comprises applying a layer of an epoxy, a silicone adhesive, a silicone RTV, and/or a pressure sensitive adhesive.

16. The method of claim 13 , wherein the reflective film or reflective foil comprises a reflective film having a thickness of between approximately 0.1 and 5 μm.

17. The method of claim 13 , wherein the reflective film or reflective foil comprises a reflective foil having a thickness of between approximately 25 and 200 μm.

18. The method of claim 13 , wherein the one or more base layer comprises a reflective material having a thickness of between approximately 0.25 and 1.5 mm.

19. The method of claim 13 , wherein the non-metallic body comprises a ceramic body.

20. The method of claim 19 , wherein the ceramic body comprises thick-film ceramic substrate.

21. The method of claim 19 , wherein the ceramic body comprises thin-film ceramic substrate.

22. The method of claim 19 , wherein the ceramic body has an open porosity of between approximately 0% and 15%.

23. The method of claim 13 , wherein the non-metallic body has a thickness of 2 mm or less, 1.5 mm or less, or 1 mm or less.

24. The method of claim 13 , wherein the one or more electrical components are spaced from the non-metallic body by the one or more non-metallic layer.

25. A light emitter device component comprising:
a non-metallic body having a top surface and a bottom surface opposing the top surface;
at least one base layer coupled against the bottom surface of the body, the base layer comprising a substrate bonded to one of a reflective film or a reflective foil, the substrate comprising aluminum;
the base layer being adapted for attachment to another structure;
one or more light emitter devices mounted over the top surface of the body, the non-metallic body having a width that is greater than a width of the one or more light emitter devices; and
one or more electrical components mounted on the top surface separate from the one or more light emitter devices but electrically coupled to the one or more light emitter devices;
wherein the non-metallic body has a porosity such that the non-metallic body is configured to reflect a portion of light emitted by the one or more light emitter devices but allow some of the light emitted to be transmitted to the bottom surface; and
wherein the at least one base layer is positioned to reflect the light transmitted to the bottom surface.

26. The light emitter device component according to claim 25 , wherein the non-metallic body comprises ceramic.

27. The light emitter device component according to claim 26 , wherein the non-metallic body has an open porosity of between approximately 0% and 15%.

28. The light emitter devic

Assignees

• Cree Inc

Inventors

• Hussell Christopher P

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title