Solid state lighting apparatuses, systems, and related methods

Patent metadata

Field	Value
Publication number	US-9538590-B2
Application number	US-201514639743-A
Country	US
Kind code	B2
Filing date	Mar 5, 2015
Priority date	Mar 30, 2012
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

Solid state lighting apparatuses and related methods are described. In some aspects, a solid state lighting apparatus includes a substrate. The substrate includes a non-metallic body having a first surface and one or more electrical components supported on the first surface of the substrate. At least one electrical component is spaced from the non-metallic body by one or more non-metallic layers. The apparatus can also include an array of solid state light emitters supported by the first surface of the substrate and electrically coupled to the one or more electrical components thereof. The apparatus can further include a receiver supported by the first surface of the substrate, wherein the receiver is adapted to receive alternating current (AC) directly from an AC power source. Related systems and methods are also disclosed.

First claim

What is claimed is:

1. A solid state lighting apparatus, comprising:
a substrate comprising a non-metallic body having a first surface;
a plurality of electrical components supported by the first surface of the substrate, wherein at least a portion of one electrical component is spaced from the non-metallic body by one or more non-metallic layers of material;
an array of solid state light emitters supported by the first surface of the substrate and electrically connected to one or more of the plurality of electrical components, wherein the array of solid state light emitters comprises a first segment of solid state light emitters to emit a first peak wavelength of light and a second segment of solid state light emitters to emit a second peak wavelength of light; and
a receiver supported by the first surface of the substrate, wherein the receiver receives alternating current (AC) directly from an AC power source.

2. The apparatus of claim 1 , wherein the solid state light emitters comprise light emitting diode (LED) chips.

3. The apparatus of claim 1 , wherein at least one solid state light emitter is directly disposed on the non-metallic body of the substrate.

4. The apparatus of claim 1 , wherein at least one solid state light emitter is attached to the non-metallic body of the substrate using an adhesive agent.

5. The apparatus of claim 1 , wherein at least one solid state light emitter adheres to the non-metallic body of the substrate via paste, epoxy, or silicone.

6. The apparatus of claim 1 , wherein the one or more non-metallic layers attach to the non-metallic body via adhesive.

7. The apparatus of claim 2 , wherein at least two different solid state light emitter segments of the plurality of solid state light emitter segments are activated and/or deactivated at different times relative to one another during a portion of an AC cycle.

8. The apparatus of claim 1 , further comprising at least one driver component arranged on or over the substrate, wherein the driver component monitors a line voltage and activates the solid state light emitters during a portion of the AC cycle.

9. The apparatus of claim 8 , wherein the driver component is supported by the first surface and packaged.

10. The apparatus of claim 8 , wherein the driver component is soldered to at least one electrical component of the substrate.

11. The apparatus of claim 8 , wherein the driver component is wirebonded to at least one electrical component of the substrate.

12. The apparatus of claim 1 , wherein at least one electrical component is directly attached to the non-metallic body.

13. The apparatus of claim 1 , wherein a thermally conductive material is provided between at least one electrical component and the non-metallic body.

14. The apparatus of claim 1 , further comprising at least one optical element positioned over the one or more solid state light emitters of the array of solid state light emitters.

15. The apparatus of claim 14 , wherein the optical element comprises phosphor.

16. The apparatus of claim 1 , wherein at least one of the first and second light emitter segments targets a color temperature of approximately 2700K or below and another of the first and second light emitter segment targets a color temperature of approximately 2700K or above.

17. The apparatus of claim 1 , wherein at least one of the first and second solid state light emitter segment targets a color temperature of approximately 1800K.

18. The apparatus of claim 1 , wherein the receiver comprises a connector component comprising at least two openings for receiving portions of the AC power source for delivering AC current to the solid state light emitters.

19. The apparatus of claim 1 , wherein the receiver comprises a circuit or a circuit element.

20. The apparatus of claim 1 , further comprising electrically conductive vias provided within the substrate, wherein the vias are provided below either the solid state light emitters or a packaged driver component for dissipating heat therefrom.

21. The apparatus of claim 1 , wherein at least one of the non-metallic layers comprises FR-4, fiberglass reinforced epoxy, polyimide, or a PCB laminate material.

22. The apparatus of claim 1 , wherein non-metallic body comprises alumina (Al2O3), a ceramic, or a high reflectivity alumina.

23. The apparatus of claim 1 , further comprising a reflective structure that routes AC current from the AC power source into the solid state lighting apparatus.

24. The apparatus of claim 23 , wherein the structure comprises a top portion and a bottom portion encloses portions of the apparatus, such that only a light emission area of the apparatus is visible from an outside view.

25. The apparatus of claim 23 , wherein the reflective structure is white.

26. The apparatus of claim 23 , wherein the reflective structure comprises molded plastic.

27. The apparatus of claim 23 , wherein the reflective structure comprises a slotted opening that receives electrical connectors from the AC power source directly into the apparatus.

28. The apparatus of claim 23 , wherein the reflective structure comprises an inclined reflective surface extending between an opening of the structure and an uppermost surface of the structure.

29. The apparatus of claim 1 , wherein a driver component is mounted to the first surface of the substrate.

30. The apparatus of claim 29 , wherein the solid state light emitters comprise LED chips, and wherein a first LED chip is mounted to the first surface such that the first chip is planar with the driver component.

31. The apparatus of claim 30 , wherein the driver component is wirebonded to at least one electrical component.

32. The apparatus of claim 31 , wherein the driver component is wirebonded to the first LED chip.

33. The apparatus of claim 30 , wherein a reflective structure is disposed between the driver component and the first LED chip.

34. The apparatus of claim 1 , wherein the AC current received by the receiver is rectified.

35. A solid state lighting system, comprising:
a substrate comprising a non-metallic body and one or more non-metallic layers, the non-metallic body having a top surface;
one or more solid state light emitters disposed on the top surface;
a plurality of electrical components disposed over the top surface and electrically coupled to the one or more solid state light emitters, wherein at least a portion of one electrical component is spaced from the non-metallic body by the one or more non-metallic layers of material; and
a plurality of electrically conductive vias provided in at least one non-metallic layer disposed between the at least one electrical component and the non-metallic body of the substrate.

36. The system of claim 35 , wherein the vias are provided below the solid state light emitters and a packaged driver component for dissipating heat therefrom.

37. The system of claim 35 , wherein at least one electrical component is directly disposed on the non-metallic body.

38. The system of claim 35 , wherein a thermally conductive material is provided between at least one electrical component and the non-metallic body.

39. The system of claim 35 , wherein

Assignees

• Cree Inc

Inventors

• Hussell Christopher P
• Johnson Jeremy Allen
• Hardin Craig William

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/5366

  the bond wires having kinks · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title