Systems and methods for plasma processing of microfeature workpieces

Patent metadata

Field	Value
Publication number	US-9786475-B2
Application number	US-201414218428-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Aug 11, 2005
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

Systems and methods for plasma processing of microfeature workpieces are disclosed herein. In one embodiment, a method includes generating a plasma in a chamber while a microfeature workpiece is positioned in the chamber, measuring optical emissions from the plasma, and determining a parameter of the plasma based on the measured optical emissions. The parameter can be an ion density or another parameter of the plasma.

First claim

We claim:

1. A system for processing a microfeature workpiece, comprising:
a plasma chamber coupleable to a source of gas;
a workpiece support positioned within the plasma chamber and configured to carry the microfeature workpiece;
a detector positioned external to the plasma chamber for measuring intensities of optical emissions from a plasma at discrete wavelengths, wherein the detector measures the intensities of optical emissions from a first region of the plasma spaced apart from the microfeature workpiece by a first distance and from a second region of the plasma spaced apart from the microfeature workpiece by a second distance; and
a controller operably coupled to the detector, the controller being configured to:
selectively add only a first subset of intensities of the optical emissions at discrete wavelengths from the first region,
selectively add only a second subset of intensities of the optical emissions at discrete wavelengths from the second region, and
estimate a plasma parameter by determining a distance from the microfeature workpiece at which selectively added first or second subsets of intensities are a predetermined percentage of a maximum of the selectively added intensities.

2. The system of claim 1 wherein the plasma parameter is a dimension of a sheath of the plasma.

3. The system of claim 2 wherein the controller is capable of changing parameters of the plasma based on the dimension of the sheath of the plasma.

4. The system of claim 1 wherein the detector comprises a sensor head that is movable relative to the plasma chamber.

5. The system of claim 4 wherein the detector comprises an optical emission spectrometer that is operably coupled to the sensor head.

6. The system of claim 1 wherein the detector comprises a collimator.

7. The system of claim 1 wherein selectively adding only the first subset of intensities of the optical emissions at discrete wavelengths from the first region and selectively adding only the second subset of intensities of the optical emissions at discrete wavelengths from the second region does not include adding a discrete wavelength corresponding to a radiation of an energy source.

8. The system of claim 1 wherein the intensities of optical emissions from the plasma depend on ion density or electron density of the plasma.

9. The system of claim 1 wherein the predetermined percentage of a maximum of the selectively added intensities is between 70% and 90%.

Assignees

• Micron Technology Inc

Inventors

• Qin Shu
• Mcteer Allen

Classifications

• C23C16/52

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• H01J37/32972

  Spectral analysis · CPC title

• C23C14/54

  Controlling or regulating the coating process · CPC title

• H01J37/32935

  Monitoring and controlling tubes by information coming from the object and/or discharge · CPC title

• G01N21/73

  using plasma burners or torches · CPC title