Metal foil and electronic device

Patent metadata

Field	Value
Publication number	US-9786404-B2
Application number	US-201314408709-A
Country	US
Kind code	B2
Filing date	Apr 24, 2013
Priority date	Jul 27, 2012
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

There is provided a metal foil suitable for an electrode substrate for an electronic element, which makes it possible to suppress oxidation of the ultra-smooth surface and also prevent roll scratches when wound in a roll. The metal foil of the present invention is made of copper or copper alloy. The front surface of the metal foil has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001. The back surface of the metal has a concave-dominant surface profile having a Pv/Pp ratio of 1.5 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 μm by 136 μm in accordance with JIS B 0601-2001.

First claim

The invention claimed is:

1. A metal foil comprising copper or copper alloy, the metal foil having a front surface and a back surface, wherein
the front surface has an ultra-smooth surface profile having an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001, and
the back surface has a concave-dominant surface profile having a Pv/Pp ratio of 2.0 or more, the Pv/Pp ratio being a ratio of a maximum profile valley depth Pv to a maximum profile peak height Pp of a profile curve as determined in a rectangular area of 181 μm by 136 μm in accordance with JIS B 0601-2001.

2. The metal foil according to claim 1 , wherein the ultra-smooth surface profile has an arithmetic mean roughness Ra of 10 nm or less.

3. The metal foil according to claim 1 , wherein the concave-dominant surface profile has a Pv/Pp ratio of 3.0 or more.

4. The metal foil according to claim 1 , wherein the concave-dominant surface profile has an arithmetic mean roughness Ra of 30 nm or less as determined in accordance with JIS B 0601-2001.

5. The metal foil according to claim 1 , wherein the metal foil has a thickness of 1 to 250 μm.

6. The metal foil according to claim 1 , wherein the metal foil is used as an electrode functioning as a supporting substrate for a flexible electronic device.

7. The metal foil according to claim 1 , wherein the metal foil is used as an electrode of a light-emitting element or a photoelectric element.

8. An electronic device comprising the metal foil according to claim 1 and a semiconductor functional layer having semiconductor characteristics provided on the ultra-smooth surface of the metal foil.

9. The electronic device according to claim 8 , further comprising a reflective layer and/or a buffer layer provided between the metal foil and the semiconductor functional layer.

10. The electronic device according to claim 8 , wherein the semiconductor functional layer has a function of excited luminescence or photoexcited power generation so that the electronic device functions as a light-emitting element or a photoelectric element.

11. The electronic device according to claim 8 , further comprising a transparent or translucent counter electrode on the semiconductor functional layer.

12. The metal foil according to claim 1 , wherein the metal foil is in a rolled state.

13. The metal foil according to claim 1 , wherein the metal foil is drawn from a roll.

Assignees

• Mitsui Mining & Smelting Co

Inventors

• Matsuura Yoshinori
• Kitajima Nozomu
• Nakamura Toshimi
• MYOI Masaharu

Classifications

• H01B1/026 Primary

  Alloys based on copper · CPC title

• Y10T428/12993

  Surface feature [e.g., rough, mirror] · CPC title

• C23F3/04

  Heavy metals · CPC title

• C23G1/20

  Other heavy metals · CPC title

• Y02E10/549

  Organic PV cells · CPC title