Double-sided adhesive tape

US9783704B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9783704-B2
Application numberUS-201214003746-A
CountryUS
Kind codeB2
Filing dateFeb 20, 2012
Priority dateMar 9, 2011
Publication dateOct 10, 2017
Grant dateOct 10, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A double-sided adhesive tape includes a substrate, and a thermosetting resin layer laminated on both sides of the substrate. The thermosetting resin layer contains a rubber-modified epoxy resin and a latent curing agent. The thermosetting resin layer has a flowtester viscosity at 40° C. and under a load of 20 Kg of 1000 Pa·s or more and 7000 Pa·s or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. A double-sided adhesive tape comprising: a substrate having two sides, and a thermosetting resin layer laminated on both sides of the substrate, wherein each thermosetting resin layer contains a rubber-modified epoxy resin and a latent curing agent, wherein each thermosetting resin layer has a flowtester viscosity at 40° C. and under a load of 20 Kg of 1000 Pa·s or more and 7000 Pa·s or less, wherein the rubber-modified epoxy resin contains a liquid rubber-modified epoxy resin and a solid rubber-modified epoxy resin, wherein the liquid rubber-modified epoxy resin and the solid rubber-modified epoxy resin are blended at a ratio of 85:15 to 45:55, wherein the liquid rubber-modified epoxy resin is a liquid carboxyl-terminated modified butadiene-acrylonitrile copolymer modified epoxy resin, and wherein the solid rubber-modified epoxy resin is a solid carboxyl-terminated modified butadiene-acrylonitrile copolymer modified epoxy resin. 2. The double-sided adhesive tape according to claim 1 , wherein the latent curing agent contains a urea compound. 3. The double-sided adhesive tape according to claim 1 , wherein the substrate has a thickness of 25 μm or more. 4. The double-sided adhesive tape according to claim 1 , wherein as the latent curing agent, a urea compound and an amide compound are used together. 5. The double-sided adhesive tape according to claim 1 , wherein at least one thermosetting resin layer further contains a bisphenol A epoxy resin that is semisolid under normal temperature.

Assignees

Inventors

Classifications

  • C09J7/021Primary

    Chemistry & Metallurgy · mapped topic

  • Chemistry & Metallurgy · mapped topic

  • C08L7/02Primary

    Latex · CPC title

  • Urea; Derivatives thereof, e.g. biuret · CPC title

  • Crosslinking or vulcanising agents; including accelerators · CPC title

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Frequently asked questions

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What does patent US9783704B2 cover?
A double-sided adhesive tape includes a substrate, and a thermosetting resin layer laminated on both sides of the substrate. The thermosetting resin layer contains a rubber-modified epoxy resin and a latent curing agent. The thermosetting resin layer has a flowtester viscosity at 40° C. and under a load of 20 Kg of 1000 Pa·s or more and 7000 Pa·s or less.
Who is the assignee on this patent?
Fujii Takahiro, Mitsuoka Yoshiaki, Nitto Denko Corp
What technology area does this patent fall under?
Primary CPC classification C09J7/021. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 10 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).