Microfabrication of tunnels

Patent metadata

Field	Value
Publication number	US-9777384-B2
Application number	US-201213420696-A
Country	US
Kind code	B2
Filing date	Mar 15, 2012
Priority date	Apr 5, 2011
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A system and method to form beam tunnels in interaction circuits. Forms, such as fibers or sheets can be located and secured above a substrate at a desired size and desired shape to form the final shape of the beam tunnels. Fiber holders can be utilized to position the forms above the substrate. A photoresist can then be applied over the substrate embedding the forms. A single exposure LIGA process can be performed on the photoresist, including the steps of ultraviolet photolithography, molding, and electroforming. After the process, the forms can be removed to leave the beam tunnels in the interaction circuits.

First claim

The invention claimed is:

1. A method of forming hollow bores, comprising the steps of:
positioning one or more forms at a desired height above a substrate, wherein the one or more forms comprise a polymer material,
applying a photoresist over the substrate above and below the one or more forms, thereby embedding the one or more forms;
exposing the one or more forms and the photoresist to ultraviolet light from a light source, wherein the polymer material is transparent to the ultraviolet light, such that the polymer material allows the ultraviolet light to pass through the one or more forms, wherein the ultraviolet light triggers a chemical reaction in the photoresist above and below the one or more forms, wherein the chemical reaction enables the photoresist to become hardened, and wherein the one or more forms are positioned such that the one or more forms, the photoresist, the substrate, and the light source remain stationary while the one or more forms are exposed to the ultraviolet light; and
removing the one or more forms to leave one or more hollow bores.

2. The method of claim 1 , wherein the one or more forms comprise fibers and sheets.

3. The method of claim 1 , wherein each of the one or more forms comprise a desired size and a desired shape to form a final shape and a final size of the one or more hollow bores.

4. The method of claim 3 , wherein the desired shape of each of the one or more forms comprise at least one of round, rectangular, square, elliptical, or dog bone.

5. The method of claim 1 , wherein the positioning step comprises locating and securing each of the one or more forms at the desired height and a desired position above the substrate.

6. The method of claim 5 , wherein the desired height and desired position is set by utilizing one or more form holders.

7. The method of claim 6 , wherein the one or more form holders comprise one or more height-setting rods, one or more wire guides, or one or more posts.

8. The method of claim 1 , further comprising:
chemo-electrically plating the substrate with a metal to form a three-dimensional molded structure.

9. The method of claim 1 , wherein the ultraviolet light passes through the one or more forms and triggers a second chemical reaction in a portion of the photoresist below the one or more forms.

10. The method of claim 1 , wherein the polymer material is a fluoropolymer.

11. The method of claim 1 , wherein the polymer material is a plastic.

12. The method of claim 1 , wherein the polymer material is ethylene tetrafluoroethylene.

13. A method of forming beam tunnels, comprising the steps of:
positioning one or more forms at a desired height above a substrate, wherein the one or more forms comprise a polymer material,
applying a photoresist over the substrate above and below the one or more forms, thereby embedding the one or more forms;
exposing the one or more forms and the photoresist to ultraviolet light, wherein the one or more forms are positioned such that the one or more forms remain stationary while the one or more forms are exposed to the ultraviolet light, and wherein the polymer material is transparent to the ultraviolet light such that the polymer material allows the ultraviolet light to, in a single ultraviolet exposure:
trigger a chemical reaction in a first portion of the photoresist above the one or more forms, wherein the chemical reaction enables the first portion to become hardened,
pass through the one or more forms, and

trigger the chemical reaction in a second portion of the photoresist below the one or more forms that enables the second portion to become hardened; and
removing the one or more forms to leave one or more beam tunnels.

14. The method of claim 13 , wherein the polymer material is a fluoropolymer.

15. A method of forming hollow bores, comprising the steps of:
securing a first form to a first form holder and a second form holder, wherein a first height of the first form holder and a second height of the second form holder are configured to position the first form at a desired height above a substrate;
securing a second form to the first form holder and the second form holder such that the first form and the second form are positioned a predetermined distance laterally with respect to each other, and wherein the predetermined distance is configured to allow multiple beam tunnels to be formed;
applying a photoresist to the substrate above and below the first form and the second form, such that the first form and the second form are embedded in the photoresist;
exposing the first form, the second form, and the photoresist to ultraviolet light, wherein the first form and the second form comprise a first polymer material that is transparent to the ultraviolet light such that the first polymer material allows the ultraviolet light to pass through the first form and the second form, wherein the chemical reaction enables the photoresist to become hardened, and wherein the first form, the second form, and the photoresist are positioned such that the first form, the second form, and the photoresist remain stationary while the first form, the second form, and the photoresist are exposed to the ultraviolet light;
plating the substrate with a second material such that a three dimensional mold is formed around the photoresist, the first form, and the second form, wherein the photoresist holds a first shape of an electromagnetic interaction circuit, wherein the first form holds a second shape of a first electron beam tunnel, and wherein the second form holds a third shape of a second electron beam tunnel; and
removing the first form and the second form to leave the hollow bores.

16. The method of claim 15 , wherein the first height and the second height are equal.

17. The method of claim 15 , wherein the first polymer material is a plastic.

18. The method of claim 15 , wherein the wherein the first polymer material is ethylene tetrafluoroethylene.

19. The method of claim 15 , wherein the first polymer material is polyvinylidene fluoride.

20. The method of claim 15 , wherein the first polymer material is a fluoropolymer.

Assignees

• Joye Colin D
• Us Navy

Inventors

• Joye Colin D

Classifications

• C25D1/003 Primary

  3D structures, e.g. superposed patterned layers · CPC title

• G03F7/00

  Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor (using photoresist structures for special production processes, see the relevant places, e.g. B44C, H10P76/00, H05K) · CPC title

• C25D1/02

  Tubes; Rings; Hollow bodies · CPC title