Single component, low temperature curable polymeric composition and related method

Patent metadata

Field	Value
Publication number	US-9773579-B2
Application number	US-201113877713-A
Country	US
Kind code	B2
Filing date	Sep 28, 2011
Priority date	Oct 5, 2010
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

Electrically conductive polymeric compositions curable at temperatures below 250° C. are disclosed. The compositions are particularly well suited for forming electrodes used in association with certain solar cells.

First claim

What is claimed is:

1. A single component, low temperature curable, electrically conductive polymeric composition comprising:
from about 5% to about 25% of at least one alicyclic epoxy resin;
from about 0.05% to about 1% of a primary catalyst, wherein the primary catalyst is an antimony hexafluoride-based catalyst;
from about 0.5% to about 10% of a blocked isocyanate;
from about 0% to about 0.5% of a secondary catalyst;
from about 0% to about 4% of at least one low viscosity diluent;
from about 0% to about 15% of a toughening agent; and
from about 40% to about 90% of conductive filler comprising silver.

2. The single component, low temperature curable, electrically conductive polymeric composition of claim 1 wherein the conductive filler is silver flake.

3. The single component, low temperature curable, electrically conductive polymeric composition of claim 2 wherein the optional low viscosity diluent comprises glycidyl ether and neopentyl glycol diglycidyl ether, and the optional toughening agent comprises an aliphatic polyester diol, the polymeric composition comprising:
from about 12% to about 18% of the at least one alicyclic epoxy resin;
from about 0.05% to about 0.4% of the primary catalyst;
from about 1% to about 3% of the blocked isocyanate;
from about 0% to about 0.2% of the secondary catalyst;
from about 0% to about 1% of glycidyl ether;
from about 0% to about 0.5% of neopentyl glycol diglycidyl ether;
from about 0% to about 6% of an aliphatic polyester diol; and
from about 50% to about 80% of silver flake as the conductive filler.

4. The single component, low temperature curable, electrically conductive polymeric composition of claim 2 wherein the alicyclic epoxy resin is a cycloaliphatic epoxy resin having an epoxy equivalent weight of from about 100 to about 150.

5. The single component, low temperature curable, electrically conductive polymeric composition of claim 2 wherein the blocked isocyanate has an isocyanate equivalent weight of from about 450 to about 500.

6. The single component, low temperature curable, electrically conductive polymeric composition of claim 2 wherein the secondary catalyst is dibutyltin dilaurate.

7. The single component, low temperature curable, electrically conductive polymeric composition of claim 3 wherein the glycidyl ether is a C 12 to C 14 glycidyl ether having an epoxy equivalent weight of from about 250 to about 325.

8. The single component, low temperature curable, electrically conductive polymeric composition of claim 3 wherein the neopentyl glycol diglycidyl ether has an epoxy equivalent weight of from about 100 to about 150.

9. The single component, low temperature curable, electrically conductive polymeric composition of claim 2 wherein the at least one low viscosity diluent is selected from the group consisting of glycidyl ethers, glycol ether, glycol ether esters, glycol ether ketones, and combinations thereof.

10. The single component, low temperature curable, electrically conductive polymeric composition of claim 2 wherein the toughening agent is selected from the group consisting of aliphatic polyester diols, modified butadiene polymers, modified butadiene-acrylonitrile polymers, modified carboxy terminated butadiene acrylonitrile copolymers, adducts of epoxy resins and dimer acids, and combinations thereof.

11. The single component, low temperature curable, electrically conductive polymeric composition of claim 1 wherein the conductive filler includes electrically conductive composite particles.

12. The single component, low temperature curable, electrically conductive polymeric composition of claim 11 wherein the electrically conductive composite particles include an outer layer of silver.

13. The single component, low temperature curable, electrically conductive polymeric composition of claim 11 wherein the composite particles are selected from the group consisting of silver coated glass particles, silver coated copper particles, silver coated nickel particles, silver coated graphite particles, nickel coated graphite particles, gold coated glass particles and combinations thereof.

14. A method of forming an electrical contact for a solar cell, the method comprising:
providing a single component, low temperature curable, electrically conductive polymeric composition comprising from about 5% to about 25% of at least one alicyclic epoxy resin, from about 0.05% to about 1% of a primary, wherein the primary catalyst is an antimony hexafluoride-based catalyst, from about 0.5% to about 10% of a blocked isocyanate, from about 0% to about 0.5% of a secondary catalyst, from about 0% to about 4% of at least one low viscosity diluent, from about 15% of a toughening agent, and from about 40% to about 90% of conductive filler comprising silver;
depositing an effective amount of the composition on a substrate; and
heating the composition to a temperature of from about 70° C. to about 250° C. for a time period of from about 1 minute to about 10 minutes, to thereby form the electrical contact.

15. The method of claim 14 wherein the conductive filler is silver flake.

16. An electrode formed from a single component, low temperature curable, electrically conductive polymeric composition comprising, prior to firing:
from about 5% to about 25% of at least one alicyclic epoxy resin;
from about 0.05% to about 1% of a primary catalyst, where in the primary catalyst is an antimony hexafluoride-based catalyst;
from about 0.5% to about 10% of a blocked isocyanate;
from about 0% to about 0.5% of a secondary catalyst;
from about 0% to about 4% of at least one low viscosity diluent;
from about 0% to about 15% of a toughening agent; and
from about 40% to about 90% of conductive filler comprising silver.

17. The electrode of claim 16 wherein the conductive filler is silver flake.

18. The electrode of claim 16 , wherein the optional low viscosity diluent comprises glycidyl ether and neopentyl glycol diglycidyl ether and the optional toughening agent comprises an aliphatic polyester diol; the composition comprising, prior to firing:
from about 12% to about 18% of the at least one alicyclic epoxy resin;
from about 0.01% to about 0.4% of the primary catalyst;
from about 1% to about 3% of the blocked isocyanate;
from about 0% to about 0.2% of the secondary catalyst;
from about 0% to about 1% of glycidyl ether;
from about 0% to about 0.5% of neopentyl glycol diglycidyl ether;
from about 0% to about 6% of an aliphatic polyester diol; and
from about 50% to about 80% of silver flake as the conductive filler.

19. The single component, low temperature curable, electrically conductive polymeric composition of claim 1 , wherein the composition is a paste.

Assignees

• Jiang Hong
• Shaikh Aziz S
• Heraeus Precious Metals North America Conshohocken Llc

Inventors

• Jiang Hong
• Shaikh Aziz S

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H01L21/64

  Electricity · mapped topic

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• H01L2924/0665

  Electricity · mapped topic

• H01B1/02 Primary

  mainly consisting of metals or alloys · CPC title