Method of inspecting a surface of a substrate and apparatus for performing the same

Patent metadata

Field	Value
Publication number	US-9772296-B2
Application number	US-201414460814-A
Country	US
Kind code	B2
Filing date	Aug 15, 2014
Priority date	Oct 31, 2013
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

First claim

What is claimed is:

1. A method of inspecting a surface of a substrate as the substrate is loaded and unloaded from a front region of a process chamber, the method comprising:
continually photographically monitoring an identification pattern adjacent to the front region of the process chamber, the identification pattern having a structure different from the surface of the substrate;
sensing that the substrate is being loaded into the process chamber based on whether the identification pattern is occluded by the substrate;
obtaining a first surface image of the substrate as the substrate is loaded into the process chamber based on the sensing; and
processing, by an image processor, the first surface image to detect defects on the surface of the substrate before the substrate undergoes processing in the process chamber.

2. The method of claim 1 , wherein processing the first surface image comprises:
removing noises from the first surface image.

3. The method of claim 1 , further comprising:
obtaining a second surface image of the substrate after the substrate is unloaded from the process chamber; and
processing, by the image processor, the second surface image to detect the defects on the surface of the substrate after the substrate undergoes the processing in the process chamber.

4. The method of claim 3 , wherein the processing the second surface image comprises:
removing noises from the second surface image using the image processor.

5. The method of claim 3 , wherein the obtaining the second surface image comprises:
sensing that the substrate is being unloaded from the process chamber based on whether the identification pattern is occluded by the substrate.

6. The method of claim 1 , wherein the substrate comprises:
a semiconductor substrate.

7. An apparatus for inspecting a surface of a substrate as the substrate is loaded and unloaded from a front region of a process chamber, the apparatus comprising:
an image sensor configured to continually photographically monitor an identification pattern adjacent to the front region of the process chamber, the identification pattern having a structure different from the surface of the substrate; and
a processor configured to,
sense that the substrate is being loaded into the process chamber and is being unloaded from the process chamber based on whether the identification pattern is occluded by the substrate,
obtain surface images of the surface of the substrate, if the processor senses that the substrate is being loaded and unloaded, and
process the surface images to detect defects on the surface of the substrate.

8. The apparatus of claim 7 , wherein the identification pattern comprises:
a shaded pattern.

9. The apparatus of claim 8 , wherein the shaded pattern comprises:
an optical machine-readable code.

10. The apparatus of claim 7 , wherein the processor is configured to filter the surface images to remove noises from the surface images.

11. The apparatus of claim 7 , wherein the processor is configured to trigger an alarm when the defects on the surface of the substrate are detected.

12. A method of inspecting a substrate as the substrate is loaded and unloaded from a front region of a process chamber, the method comprising:
continually sensing, by an image sensor, an area adjacent to the front region of the process chamber, the area adjacent to the process chamber including a distinct pattern identifiable by an image processor;
determining, by the image processor, that a robot is one of loading and unloading the substrate based on whether the distinct pattern is occluded by the substrate;
first capturing, via the image sensor, a first image of a surface of the substrate as the robot is loading the substrate into a process chamber;
first detecting, by the image processor, defects on the surface of the substrate based on the first image, the first detecting being performed before the substrate undergoes processing in the process chamber; and
first determining, by the image processor, whether to instruct the process chamber to process the substrate based on the first detecting.

13. The method of claim 12 , further comprising:
second capturing, via the image sensor, a second image of the surface of the substrate as the robot is unloading the substrate from the process chamber;
second detecting, by the image processor, defects on the surface of the substrate based on the second image, the second detecting being performed after the substrate undergoes processing in the process chamber; and
second determining, by the image processor, whether to one or more of trigger an alarm, discard the substrate, and reload the substrate into the process chamber for further processing based on the second detecting.

14. The method of claim 12 , wherein the substrate is a semiconductor substrate, and the first detecting is performed inline with the loading of the substrate into the process chamber.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kang Byung-Bok
• Kang Seok-Min
• Koo Bon-Ok
• Kim Kyoung-Hwan
• Kim Myung-Woo
• Kim In-Gi
• Kim Hyun-Chul
• Roh Sung-Ki
• Min Gyung-Jin
• Lee Eun-Seok
• Hong Jin-Suk

Classifications

• H10P74/00

  Testing or measuring during manufacture or treatment of wafers, substrates or devices · CPC title

• G01N21/9501 Primary

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• G01N2021/8887

  based on image processing techniques · CPC title

• G01N21/8851

  Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges (G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002) · CPC title

• G01N21/956 Primary

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title