EMI shielding structure to enable heat spreading and low cost assembly

Patent metadata

Field	Value
Publication number	US-9769966-B2
Application number	US-201514866275-A
Country	US
Kind code	B2
Filing date	Sep 25, 2015
Priority date	Sep 25, 2015
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

Methods and apparatus relating to EMI (Electromagnetic Interference) shielding structure to enable heat spreading and/or low cost assembly are described. In an embodiment, a metallic shield at least partially surrounds at least one logic component. The metallic shield includes a dome feature to provide thermal contact between the at least one logic component and the metallic shield. Other embodiments are also disclosed and claimed.

First claim

The invention claimed is:

1. An apparatus comprising:
a metallic shield to at least partially surround at least one logic component,
wherein the metallic shield is to comprise a dome feature to provide thermal contact between the at least one logic component and the metallic shield, wherein the dome feature is to have a continuous surface, wherein the dome feature is to at least partially protrude outward away from a surface of the at least one logic component prior to a mounting process, wherein the protruded dome feature is to provide the thermal contact between the at least one logic component and the metallic shield after the protruded dome feature is pushed towards the surface of the at least one logic component.

2. The apparatus of claim 1 , wherein the metallic shield is to provide Electromagnetic Interference protection for the at least one logic component.

3. The apparatus of claim 1 , wherein the surface of the at least one logic component is a top surface or a side surface of the at least one logic component.

4. The apparatus of claim 1 , wherein a gap to be provided between the protruded dome feature and the at least one logic component or between the metallic shield and the at least one logic component is to be 2 mm.

5. The apparatus of claim 1 , wherein the dome feature is to have a shape selected from a group consisting of: a circular shape, a square shape, an elliptical shape, a rectangular shape, a polygonal shape, or combinations thereof.

6. The apparatus of claim 1 , wherein the metallic shield is to be constructed of a sheet metal.

7. The apparatus of claim 6 , wherein the sheet metal is to have a thickness between 0.3 mm and 0.5 mm.

8. The apparatus of claim 1 , wherein the dome feature is to be provided during a same stamping process that provides the metallic shield.

9. The apparatus of claim 1 , further comprising a heat spreader to be provided between the at least one logic component and the dome feature.

10. The apparatus of claim 1 , wherein the dome feature is to be provided during a different stamping process than the metallic shield.

11. The apparatus of claim 1 , wherein the at least one logic component and the metallic shield are to be attached to a circuit board.

12. The apparatus of claim 1 , wherein the at least one logic component or the metallic shield are to be soldered to a circuit board.

13. The apparatus of claim 1 , wherein the at least one logic component and the metallic shield are to be provided on a printed circuit board.

14. The apparatus of claim 1 , wherein the at least one logic component is to comprise a Graphics Processing Unit (GPU) or a Central Processing Unit (CPU).

15. The apparatus of claim 14 , wherein the CPU or the GPU is to comprise one or more cores.

16. The apparatus of claim 14 , wherein one or more of the GPU, the CPU, or memory are on a single integrated circuit die.

17. The apparatus of claim 1 , wherein the mounting process is a surface mount process.

18. A system comprising:
a processor, coupled to memory, the memory to store one or more instructions to be executed by the processor;
a metallic shield to at least partially surround at least one logic component coupled to the processor or the memory,
wherein the metallic shield is to comprise a dome feature to provide thermal contact between the at least one logic component and the metallic shield, wherein the dome feature is to have a continuous surface, wherein the dome feature is to at least partially protrude outward away from a surface of the at least one logic component prior to a mounting process, wherein the protruded dome feature is to provide the thermal contact between the at least one logic component and the metallic shield after the protruded dome feature is pushed towards the surface of the at least one logic component.

19. The system of claim 18 , wherein the metallic shield is to provide Electromagnetic Interference protection for the at least one logic component.

20. The system of claim 18 , wherein the dome feature is to have a shape selected from a group consisting of: a circular shape, a square shape, an elliptical shape, a rectangular shape, a polygonal shape, or combinations thereof.

21. The system of claim 18 , wherein the mounting process is a surface mount process.

22. A method comprising:
providing a metallic shield to at least partially surround at least one logic component,
wherein the metallic shield comprises a dome feature to provide thermal contact between the at least one logic component and the metallic shield, wherein the dome feature has a continuous surface, wherein the dome feature at least partially protrudes outward away from a surface of the at least one logic component prior to a mounting process, wherein the protruded dome feature provides the thermal contact between the at least one logic component and the metallic shield after the protruded dome feature is pushed towards the surface of the at least one logic component.

23. The method of claim 22 , further comprising providing the dome feature during a same stamping process that provides the metallic shield.

24. The method of claim 22 , further comprising providing the dome feature during a different stamping process than the metallic shield.

25. The method of claim 22 , wherein the mounting process is a surface mount process.

Assignees

• Intel Corp

Inventors

• Nishi Yoshifumi

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/20436 Primary

  Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing · CPC title

• H05K9/0024 Primary

  Shield cases mounted on a PCB, e.g. cans or caps or conformal shields · CPC title

• H05K9/0032

  having multiple parts, e.g. frames mating with lids · CPC title

• H01L23/367

  Electricity · mapped topic