Relieved component pad for 0201 use between vias

Patent metadata

Field	Value
Publication number	US-9769925-B2
Application number	US-201514941327-A
Country	US
Kind code	B2
Filing date	Nov 13, 2015
Priority date	Nov 13, 2015
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A relieved component pad for 0201 component use between vias on a tight-pitch Ball Grid Array is disclosed herein. The relieved component pad for 0201 component use between vias provides substantially rectangular component pads having a relieved section at a point of closest approach to a via pad. The relieved component pad for 0201 component use is particularly useful for overcoming the problem of 0201 component placement on tight-pitch arrays known in the art.

First claim

What is claimed is:

1. A through-hole printed circuit board (PCB) comprising:
a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a 2×2 tight-pitch grid pattern including first, second, third, and fourth BGA pads;
through-hole vias, including respective via pads, arranged in said 2×2 tight-pitch grid pattern including first, second, third, and fourth through-hole vias, and at least one of said through-hole vias electrically connected to said BGA pads;
substantially rectangular component pads on the opposite side of the PCB from said BGA pads including first, second, third, and fourth component pads, said component pads located between pairs of said through-hole vias;
each substantially rectangular component pad having a relieved section at a point of closest approach to a via pad;
a solder mask covering the component pad with an opening;
a solder pad within said opening electrically connected to said component pad; and

a first two-lead component attached to said solder pads associated with the first and second component pads; and
a second two-lead component attached to said solder pads associated with the third and fourth component pads.

2. The PCB of claim 1 , wherein the tight-pitch grid pattern is square.

3. The PCB of claim 2 , wherein the tight-pitch grid pattern has 0.8 mm pitch.

4. The PCB of claim 3 , wherein the Imperial 0201 component is a discrete component.

5. The PCB of claim 1 , wherein the tight-pitch grid pattern is rectangular.

6. The PCB of claim 1 , wherein the two-lead component is an Imperial 0201 component.

7. The PCB of claim 6 , wherein the Imperial 0201 component is a capacitor.

Assignees

• Alcatel-Lucent Canada Inc
• Alcatel Lucent

Inventors

• Chan Alex L
• Brown Paul J

Classifications

• H05K3/0005

  for designing circuits by computer · CPC title

• H05K3/3452

  Solder masks · CPC title

• H05K1/113 Primary

  Via provided in pad; Pad over filled via · CPC title

• H05K1/023

  using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16) · CPC title

• H05K2201/10674

  Flip chip · CPC title