Electronic module and method for producing an electronic module

Patent metadata

Field	Value
Publication number	US-9768035-B2
Application number	US-201514880532-A
Country	US
Kind code	B2
Filing date	Oct 12, 2015
Priority date	Oct 13, 2014
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

One aspect of the invention relates to an electronic module comprising a module housing and an electrically conductive connection element. The connection element has a first portion and a second portion, and also a shaft between the first portion and the second portion. The connection element, which is provided with a non-metallic coating in the region of the shaft, is injected together with the coating in the region of the shaft into the module housing, such that the connection element is fixed in the module housing.

First claim

What is claimed is:

1. An electronic module, comprising:
a module housing;
an electrically conductive connection element, which has a first portion, a second portion and a shaft between the first portion and the second portion, the shaft being provided with a non-metallic coating; and the connection element being injected together with the coating in the region of the shaft into the module housing, such that the connection element is fixed in the module housing.

2. The electronic module as claimed in claim 1 , comprising a circuit carrier, which has a conductor track and which is fastened on the module housing.

3. The electronic module as claimed in claim 2 , in which the connection element is welded to the conductor track at a first connection site in the region of the first portion and is thereby connected to said conductor track in an electrically conductive manner.

4. The electronic module as claimed in claim 2 , comprising a bonding wire, which is arranged in the module housing and which is bonded directly to the connection element at a second connection site in the region of the first portion.

5. The electronic module as claimed in claim 4 , in which the bonding wire has a line cross section of at least 7853 μm 2 .

6. The electronic module as claimed in claim 4 , in which the bonding wire consists entirely or to an extent of at least 90 atom % of copper.

7. The electronic module as claimed in claim 1 , in which the connection element comprises at least 90 atom % of one of the following metals: copper; aluminum; gold; silver; and iron; or comprises at least 90 atom % of an alloy, the allow comprising at least two of the following metals: copper; aluminum; gold; silver; and iron.

8. The electronic module as claimed in claim 1 , in which the module housing is dielectric and comprises the following:
a glass fiber proportion of at least 10% by volume or of at least 20% by volume; and/or
a flame retardant.

9. The electronic module as claimed in claim 1 , in which the coating consists of a material which differs from the material of the module housing.

10. The electronic module as claimed in claim 1 , in which
the coating comprises one of the following materials: a thermoplastic material; a thermosetting plastic; an elastomer; a polymer alloy; a foam material; and a lacquer.

11. A method by which an electronic module is formed as claimed in claim 1 , the method comprising:
providing an electrically conductive connection element, which has a first portion, a second portion, a shaft between the first portion and the second portion, and also a non-metallic coating at least in the region of the shaft;
producing a module housing, the connection element provided with the coating being encapsulated by injection molding with a material which forms the module housing;
arranging a conductor element in an inner space of the module housing; and
producing an electrically conductive connection between the conductor element and the connection element in the region of the first portion.

12. The method as claimed in claim 11 , in which the electrically conductive connection is produced by connecting the conductor element and the connection element directly to one another by ultrasonic welding in the region of the first portion.

13. The method as claimed in claim 11 , in which the conductor element is in the form of a conductor track of a circuit carrier or is in the form of a bonding wire.

14. The method as claimed in claim 11 , in which the coating is applied by one of the following methods: plastic coating; powder coating; painting; printing; dipping; adhesive bonding.

15. The method as claimed in claim 11 , in which the coating comprises one of the following materials or consists of one of the following materials: plastic; a thermoplastic material; a thermosetting plastic; an elastomer; a polymer alloy; a foamed material; and a lacquer.

16. The method as claimed in claim 1 , in which providing the connection element comprises the following steps:
applying the coating to an individual planar or bent connection element; or
applying the coating to a primary product and subsequently separating the coated primary product to form a plurality of individual connection elements which are each coated and of which one forms the provided connection element.

17. The electronic module as claimed in claim 1 , wherein the non-metallic coating is provided such that an outer side of at least a portion of the shaft has a roughened surface before being injected.

Assignees

• Infineon Technologies Ag

Inventors

• Guth Karsten
• Strotmann Guido

Classifications

• H10W90/765

  between a chip and a laterally-adjacent insulating package substrate, interposer or RDL · CPC title

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title