Scanning electron microscope and methods of inspecting and reviewing samples

Patent metadata

Field	Value
Publication number	US-9767986-B2
Application number	US-201514834991-A
Country	US
Kind code	B2
Filing date	Aug 25, 2015
Priority date	Aug 29, 2014
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.

First claim

The invention claimed is:

1. A scanning electron microscope (SEM) comprising:
an electron source configured to generate a primary electron beam;
an electron optical system configured to focus the primary electron beam, and to scan the primary electron beam over an area of a sample;
a first solid state detector configured to detect incident electrons emitted or scattered from the sample in response to the primary electron beam, and to generate a first image data signal in accordance with the detected incident electrons;
a computer configured to generate an image of the area of the sample according to the first image data signal received from the first solid state detector,
wherein the first solid state detector includes an electron sensor comprising:
a p-type electron-sensitive layer configured to generate multiple electrons in response to each said incident electron that enters said electron-sensitive layer through a first surface of said electron-sensitive layer;
an n-type buried channel layer disposed on a second surface of the electron-sensitive layer and configured to collect at least some of the multiple electrons generated by the electron-sensitive layer;
an n+ floating diffusion disposed in the buried channel layer and configured to accumulate at least some of the electrons collected by the buried channel layer such that a voltage of the floating diffusion changes in proportion to a number of said electrons accumulated on the floating diffusion; and
an amplifier configured to generate an output signal in accordance with the voltage of the floating diffusion,
wherein the electron-sensitive layer, the buried channel layer, the floating diffusion and the amplifier are disposed on a single integral semiconductor structure.

2. The SEM of claim 1 , wherein the electron sensor further comprises a pure boron layer disposed on the first surface of said electron-sensitive layer such that said incident electron passes through the pure boron layer before entering the electron-sensitive layer.

3. The SEM of claim 1 ,
wherein said first solid state detector is positioned such that said incident electron comprises a back-scattered electron, and said first solid state detector includes a first analog-to-digital converter for digitizing the output signal to generate said first image data signal,
wherein the SEM further comprises a second solid state detector including a second electron sensor configured to detect secondary electrons emitted from the sample in response to the primary beam, and a second analog-to-digital converter generating a second image data signal,
wherein the computer is further configured to receive the second image data signal from the second solid state detector, and to generate the image of the area of the sample from the first image data signal and the second image data signal.

4. The SEM of claim 3 , wherein the first solid state detector further comprises a signal processing circuit configured to generate the first image data signal having a digital data value corresponding to a voltage level of said output signal generated in response to said incident electron, whereby said first image data signal indicates approximately an energy of said incident electron.

5. The SEM of claim 4 ,
wherein the computer is further configured to determine at least one of the presence of a defect and a type of the defect located in the area of the sample based on energies of said incident electrons detected by the first solid state detector and the second image data signal generated by the second solid state detector.

6. The SEM of claim 4 ,
wherein at least one of the first solid state detector and the second solid state detector comprises multiple pixels disposed in an array on the single integral semiconductor structure, wherein each pixel of the multiple pixels includes an associated said p-type electron-sensitive layer, an associated said n-type buried channel layer, an associated said n+ floating diffusion and an associated said amplifier, and wherein said each pixel has a nominal lateral size dimension of approximately 250 μm or less.

7. The SEM of claim 5 , further comprising a stage that is configured to support the sample having a sample type including one of an unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle and a photomask, wherein the stage is further configured to position the sample during inspection.

8. A multi-pixel electron detector comprising:
an array of electron-sensitive pixels fabricated on at least one silicon structure, wherein each electron-sensitive pixel comprises:
a p-type electron-sensitive region configured to generate multiple electrons in response to incident electrons that enter said electron-sensitive region through an electron-sensitive surface;
a floating diffusion configured to collect at least some of the multiple electrons generated by the electron-sensitive region,
an n-type buried channel layer disposed on the electron-sensitive region and configured to transmit at least some of the multiple electrons generated by the electron-sensitive region to the floating diffusion, and
an amplifier disposed on said at least one silicon structure and configured to generate an output signal having a level determined by a number of said multiple electrons collected on the floating diffusion; and

multiple analog-to-digital converters fabricated on said at least one silicon structure, wherein each of the multiple analog-to-digital converters is operably coupled to receive an associated output signal generated by an associated pixel of said array of pixels.

9. The multi-pixel electron detector of claim 8 , further comprising a pure boron coating disposed on an electron-sensitive surface of said at least one silicon structure.

10. The multi-pixel electron detector of claim 8 ,
wherein the floating diffusion of each said pixel is located in a central region of said each pixel, and
wherein each said pixel has a nominal lateral size dimension of approximately 250 μm or less.

11. The multi-pixel electron detector of claim 8 ,
wherein the array of electron sensitive pixels is fabricated on a first silicon structure, and the multiple analog-to-digital converters are fabricated on a second silicon structure,
wherein each said pixel is electrically and mechanically connected to an associated said analog-to-digital converter by way of an associated solder ball.

12. The multi-pixel electron detector of claim 11 , further comprising a substrate electrically and mechanically connected to at least one of the first and the second silicon structures.

13. The multi-pixel electron detector of claim 8 , wherein the multi-pixel electron detector further comprises one of a processor configured to determine approximately an energy of an incident electron based on image data transmitted from said sensor circuit, a fiber-optic transmitter and a serial transmitter.

14. The multi-pixel electron detector of claim 8 ,
wherein the floating diffusion of each said pixel is located in a central region of said each pixel, and
wherein each said pixel further comprises a resistive gate including at least one polycrystalline silicon structure disposed over an upper surface of the n-type buried channel layer and configured such that an outer peripheral edge of said polycrystalline silicon structure substantially aligns with an outer peripheral edge of said n-type buried channel layer, said polycrystalline silicon structure defining a central opening such that an inner peripheral edge of the polycrystalline silicon structure substantially surrounds and is spaced from the central region C; and
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Assignees

• Kla Tencor Corp

Inventors

• Brown David L
• Chuang Yung-Ho Alex
• Fielden John
• Trimpl Marcel
• Zhang Jingjing
• Contarato Devis
• Iyer Venkatraman

Classifications

• G01T1/24 Primary

  with semiconductor detectors · CPC title

• G01N30/72 Primary

  Mass spectrometers {(mass spectrometers per se H01J49/00)} · CPC title

• H01J2237/24592

  Inspection and quality control of devices · CPC title

• H01J37/28

  with scanning beams {(H01J37/268, H01J37/292, H01J37/2955 take precedence)} · CPC title

• H01J37/244 Primary

  Detectors; Associated components or circuits therefor · CPC title