Electronic device

Patent metadata

Field	Value
Publication number	US-9762836-B2
Application number	US-201414510935-A
Country	US
Kind code	B2
Filing date	Oct 9, 2014
Priority date	Dec 26, 2013
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

An electronic device comprising a laminated structure including a first semiconductor chip and a second semiconductor chip is disclosed. In one example, the first semiconductor chip includes a sensor portion in which sensors are arranged, and the second semiconductor chip includes a signal processing portion in which signals obtained by the sensors are processed. The signal processing portion includes a high breakdown voltage transistor circuit and a low breakdown voltage transistor circuit. The low breakdown voltage transistor circuit includes a depletion-type field effect transistor.

First claim

What is claimed is:

1. An electronic device comprising:
a laminated structure including a first semiconductor chip and a second semiconductor chip,
the first semiconductor chip including a sensor portion in which sensors are arranged, and
the second semiconductor chip including a signal processing portion in which signals obtained by the sensor are processed,
wherein respective ones of the sensors include a plurality of transistors, and
wherein the signal processing portion includes a depletion-type field effect transistor.

2. An electronic device comprising:
a laminated structure including a first semiconductor chip and a second semiconductor chip,
the first semiconductor chip including a sensor portion in which sensors are arranged, and
the second semiconductor chip including a signal processing portion in which signals obtained by the sensors are processed,
wherein respective ones of the sensors include a plurality of transistors,
wherein the signal processing portion includes a high breakdown voltage transistor circuit and a low breakdown voltage transistor circuit, and
wherein the low breakdown voltage transistor circuit includes a depletion-type field effect transistor.

3. The electronic device according to claim 2 ,
wherein the high breakdown voltage transistor circuit and the sensor portion overlap each other in a plan view perspective, and
wherein in the second semiconductor chip, a light blocking region is formed between the high breakdown voltage transistor circuit and the sensor portion.

4. The electronic device according to claim 2 ,
wherein the high breakdown voltage transistor circuit and the sensor portion do not overlap each other in a plan view perspective.

5. The electronic device according to claim 2 ,
wherein the sensors are image sensors, and
wherein the electronic device is a solid-state imaging device.

6. The electronic device according to claim 5 ,
wherein the image sensors are CMOS image sensors.

7. The electronic device according to claim 2 ,
wherein the depletion-type field effect transistor includes a complete depletion-type SOI structure.

8. The electronic device according to claim 2 ,
wherein the depletion-type field effect transistor includes a partial depletion-type SOI structure.

9. The electronic device according to claim 2 ,
wherein the depletion-type field effect transistor includes a fin structure.

10. The electronic device according to claim 2 ,
wherein the depletion-type field effect transistor includes a deeply depleted channel structure.

11. The electronic device according to claim 2 ,
wherein at least one of the signal processing portion and the low breakdown voltage transistor circuit includes an analog-digital converter, and
wherein the analog-digital converter includes the depletion-type field effect transistor.

12. The electronic device according to claim 11 ,
wherein the analog-digital converter includes at least one of a single slope-type analog-digital converter, a successive approximation-type analog-digital converter, and a delta-sigma modulation-type analog-digital converter.

13. The electronic device according to claim 11 ,
wherein the analog-digital converter includes a gray code counter.

14. The electronic device according to claim 11 ,
wherein the analog-digital converter is provided with respect to a plurality of the sensors,
wherein the analog-digital converter is a single slope-type analog-digital converter and includes a ramp voltage generator,
a comparator to which an analog signal obtained by the sensor and a ramp voltage from the ramp voltage generator are input, and
a counter portion to which a clock is supplied from a clock supply portion and which operates based on an output signal of the comparator, and
wherein the counter portion includes the depletion-type field effect transistor.

15. The electronic device according to claim 14 ,
wherein the clock supply portion includes the depletion-type field effect transistor.

16. The electronic device according to claim 11 ,
wherein the signal processing portion or the low breakdown voltage transistor circuit includes a clock supply portion which is connected to the analog-digital converter, and
wherein the clock supply portion has the depletion-type field effect transistor.

17. The electronic device according to claim 16 ,
wherein the clock supply portion includes a PLL circuit.

18. The electronic device according to claim 2 ,
wherein the second semiconductor chip includes a memory portion.

19. The electronic device according to claim 2 , further comprising:
a third semiconductor chip that is provided with a memory portion,
wherein the first, second and third semiconductor chips are laminated in the order of the first semiconductor chip, the second semiconductor chip, and the third semiconductor chip.

20. The electronic device according to claim 13 , wherein the gray code counter includes the depletion-type field effect transistor.

Assignees

• Sony Corp

Inventors

• Kurose Yoshikazu

Classifications

• H10W90/00

  Package configurations · CPC title

• H04N25/79 Primary

  Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors · CPC title

• H01L27/14634

  Electricity · mapped topic

• H01L2924/0002

  Electricity · mapped topic

• H01L25/18

  Electricity · mapped topic