Optical transmission module and imaging device

Patent metadata

Field	Value
Publication number	US-9762329-B2
Application number	US-201514796424-A
Country	US
Kind code	B2
Filing date	Jul 10, 2015
Priority date	Jan 18, 2013
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

An optical transmission module includes: a photoelectric conversion element that converts an electrical signal to an optical signal; a photoelectric conversion element-driving IC that drives the photoelectric conversion element; an optical fiber that transmits the optical signal; a guide holding member that holds the optical fiber; a cable that supplies power to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC; and a substrate on which the photoelectric conversion element and the photoelectric conversion element-driving IC are mounted. The substrate has first and second planes which are perpendicular to each other. The photoelectric conversion element is mounted on the first plane. The optical fiber is connected to a back side of the first plane. An optical axis of the optical fiber is perpendicular to the first plane. The cable is connected to the second plane in parallel with the optical axis of the optical fiber.

First claim

What is claimed is:

1. An optical transmission module comprising:
a photoelectric conversion element configured to convert an electrical signal to an optical signal;
a photoelectric conversion element-driving IC configured to drive the photoelectric conversion element;
an optical fiber configured to transmit the optical signal emitted from the photoelectric conversion element;
a guide holding member configured to position and hold the optical fiber;
a cable configured to supply power or a signal to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC; and
a single flexible printed circuit substrate on which the photoelectric conversion element and the photoelectric conversion element-driving IC are directly mounted, wherein
the single flexible printed circuit substrate has at least a first plane and a second plane,
the first plane and the second plane are perpendicular to each other,
the single flexible printed circuit substrate has a bent portion,
the single flexible printed circuit substrate is bent at the bent portion to form the first plane and the second plane,
the photoelectric conversion element is mounted on the first plane,
the optical fiber is connected to a back side of the first plane through the guide holding member such that an optical axis of the optical fiber is perpendicular to the first plane, and
the cable is directly connected to a back side of the second plane, the photoelectric conversion element, the photoelectric conversion element-driving IC and the guide holding member are not mounted on the backside of the second plane, and the back side of the second plane is perpendicular to the back side of the first plane such that the cable is in parallel with the optical axis of the optical fiber.

2. The optical transmission module according to claim 1 , wherein
the single flexible printed circuit substrate includes a first substrate disposed perpendicular to the optical axis of the optical fiber, and a second substrate disposed parallel to the optical axis of the optical fiber, and
the first and second substrates are connected to each other.

3. The optical transmission module according to claim 1 , wherein the photoelectric conversion element-driving IC is mounted such that an upper surface of the photoelectric conversion element-driving IC is parallel to the optical axis of the optical fiber.

4. The optical transmission module according to claim 1 , wherein the photoelectric conversion element-driving IC is mounted such that an upper surface of the photoelectric conversion element-driving IC is perpendicular to the optical axis of the optical fiber.

5. The optical transmission module according to claim 3 , wherein the photoelectric conversion element and the photoelectric conversion element-driving IC are mounted to overlap each other in a direction of the optical axis of the optical fiber.

6. An imaging device comprising:
a photoelectric conversion element configured to convert an electrical signal to an optical signal;
a photoelectric conversion element-driving IC configured to drive the photoelectric conversion element;
an optical fiber configured to transmit the optical signal emitted from the photoelectric conversion element;
a guide holding member configured to position and hold the optical fiber;
a cable configured to supply power or a signal to at least one of the photoelectric conversion element and the photoelectric conversion element-driving IC;
an image sensor configured to acquire an image signal upon imaging; and
a single flexible printed circuit substrate on which the photoelectric conversion element, the photoelectric conversion element-driving IC, and the image sensor are directly mounted, wherein
the single flexible printed circuit substrate has a first plane, a second plane, and a third plane,
the first plane and the second plane are perpendicular to each other, and the second plane and the third plane are perpendicular to each other,
the first plane and the third plane are parallel to each other,
the single flexible printed circuit substrate has a first bent portion and a second bent portion,
the single flexible printed circuit substrate is bent at the first bent portion to form the first plane and the second plane, and is bent at the second bent portion to form the second plane and the third plane,
the photoelectric conversion element is mounted on the first plane,
the image sensor is mounted on the third plane,
the optical fiber is connected to a back side of the first plane through the guide holding member such that an optical axis of the optical fiber is perpendicular to the first plane, and
the cable is directly connected to a back side of the second plane, the photoelectric conversion element, the photoelectric conversion element-driving IC and the guide holding member are not mounted on the backside of the second plane, and the back side of the second plane is perpendicular to the back side of the first plane such that the cable is in parallel with the optical axis of the optical fiber.

7. The imaging device according to claim 6 , wherein
the single flexible printed circuit substrate includes a first substrate having at least the first plane on which the photoelectric conversion element is mounted, and a second substrate having at least the third plane on which the image sensor is mounted, and
the first and second substrates are connected to each other.

8. The imaging device according to claim 7 , wherein
the single flexible printed circuit substrate includes: the first substrate having the first plane on which the photoelectric conversion element is mounted, and having a plane perpendicular to the first plane; and the second substrate having the third plane on which the image sensor is mounted, and having a plane perpendicular to the third plane,
the first substrate and the second substrate are connected to each other, and
the cable is connected to the second substrate in parallel with the optical axis of the optical fiber.

Assignees

• Olympus Corp

Inventors

• Motohara Hiroyuki

Classifications

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H01S5/02284

  Electricity · mapped topic

• H01S5/02272

  Electricity · mapped topic

• H01S5/183

  having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] · CPC title