Metallization of the wafer edge for optimized electroplating performance on resistive substrates

Patent metadata

Field	Value
Publication number	US-9761524-B2
Application number	US-201615148496-A
Country	US
Kind code	B2
Filing date	May 6, 2016
Priority date	Jun 2, 2014
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

A system for electroless deposition on a substrate is provided, including the following: a chamber; a substrate support configured to receive a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region and a process region, wherein the substrate support is configured to rotate the substrate; a solution container configured to hold an electroless deposition solution; a dispenser configured to provide a flow of the electroless deposition solution; a controller, the controller configured to direct the flow of the electroless deposition solution toward the edge exclusion region while the substrate is rotated, the flow being directed away from the process region, the electroless deposition solution plates metallic material over the conductive layer at the edge exclusion region, to produce an increased thickness of the metallic material that reduces electrical resistance.

First claim

What is claimed is:

1. A system for electroless deposition on a substrate, comprising:
a chamber;
a substrate support disposed in the chamber, the substrate support configured to receive a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region defined as an annular area that extends to an edge of the substrate, the top surface of the substrate further having a process region defined as a central area of the substrate that extends to about the annular area, wherein the substrate support is configured to rotate the substrate;
a solution container configured to hold an electroless deposition solution;
a dispenser coupled to the solution container, the dispenser configured to provide a flow of the electroless deposition solution;
a controller, the controller configured to direct the flow of the electroless deposition solution toward the edge exclusion region while the substrate is rotated, the flow being directed away from the process region, such that the electroless deposition solution is substantially directed over the annular area of the edge exclusion region, the electroless deposition solution plates metallic material over the conductive layer at the edge exclusion region, wherein the flow of the electroless deposition solution is continued for a period of time, the period of time being predefined to produce an increased thickness of the metallic material at the edge exclusion region, wherein the increased thickness of the metallic material reduces electrical resistance of the metallic material at the edge exclusion region;
an electroplating module, the electroplating module including,
electrical contacts for contacting the metallic material,
a power source configured to apply electrical current to the metallic material via the electrical contacts while an electroplating solution is applied over the process region of the substrate.

2. The system of claim 1 ,
wherein the electrical contacts being distributed around the annular area of the edge exclusion region when contacting the metallic material,
wherein the electroplating module further comprises a solution tank configured to hold the electroplating solution,
wherein the increased thickness and resulting reduced electrical resistance for the electrical current facilitates increasing a rate at which the process region is plated as a result of the applied electrical current and the applied electroplating solution.

3. The system of claim 2 , wherein the electrical contacts are arranged in a circular array, each electrical contact being independently movable.

4. The system of claim 2 , further comprising,
an annular seal configured to contact the metallic material and prevent the electroplating solution from contacting the electrical contacts.

5. The system of claim 2 ,
wherein the conductive layer defines a metallic seed layer; and
wherein applying electrical current to the metallic material via the electrical contacts effects plating of a metallic bulk layer over the process region of the substrate.

6. The system of claim 2 , wherein increasing the rate at which the process region is plated is defined by increasing the applied electrical current while the electroplating solution is applied over the process region of the substrate, the increased thickness of the metallic material and resulting reduced electrical resistance facilitating increasing the applied electrical current.

7. The system of claim 2 , wherein the rate at which the process region is plated increases from an initial rate to an increased rate that is approximately linearly correlated to the increased thickness of the metallic material.

8. The system of claim 2 ,
wherein the conductive layer defines a liner layer or a barrier layer; and
wherein applying electrical current to the metallic material via the electrical contacts effects plating of a metallic seed layer or a metallic bulk layer over the process region of the substrate.

9. The system of claim 1 , wherein the dispenser includes,
a nozzle configured to deliver the flow of the electroless deposition solution to the surface of the substrate as a stream or a spray having a predefined width and a predefined flow velocity;
a dispense arm, the dispense arm being adjustable by the controller to maneuver the nozzle to direct the stream or spray of the electroless deposition solution over the edge exclusion region, the nozzle being maneuvered by the dispense arm so that a central axis of the stream or spray forms an incident angle relative to the top surface of the substrate and exhibits a horizontal direction parallel to the top surface of the substrate, the horizontal direction being between a radial direction of the substrate and a tangential direction of the substrate that are defined substantially at a location at which the central axis of the stream or spray contacts the surface of the substrate.

10. The system of claim 9 , further comprising,
a motor for rotating the substrate support, the motor being operable by the controller to rotate the substrate support at a predefined rotational speed in the range of about 6 to 200 rotations per minute (RPM);
wherein the rotation of the substrate provides a centrifugal acceleration to the electroless deposition solution that is over the edge exclusion region, so that electroless deposition solution that is provided to an inner region of the annular area of the edge exclusion region is accelerated towards an outer region of the annular area of the edge exclusion region, to provide a substantially even distribution of the electroless deposition solution over the edge exclusion region as the electroless deposition solution over the edge exclusion region is impelled by the stream or spray in combination with the centrifugal acceleration.

11. The system of claim 10 , further comprising,
a drain defined at a bottom portion of the chamber;
wherein an inner surface of the chamber is contoured to deflect electroless deposition solution escaping from top surface of the substrate and direct the deflected electroless deposition solution away from the substrate surface and towards the drain.

12. The system of claim 1 , further comprising, a sensor for detecting the thickness of the metallic material, wherein the controller is configured to terminate the flow of the electroless deposition solution over the edge exclusion region when the detected thickness of the metallic material reaches a predefined thickness level.

13. A system for electroless deposition on a substrate, comprising:
a chamber;
a substrate support disposed in the chamber, the substrate support configured to receive a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region defined as an annular area that extends to an edge of the substrate, the top surface of the substrate further having a process region defined as a central area of the substrate that extends to about the annular area, wherein the substrate support is configured to rotate the substrate;
a solution container configured to hold an electroless deposition solution;
a dispenser coupled to the solution container, the dispenser configured to provide a flow of the electroless deposition solution, wherein the dispenser includes,
a nozzle configured to deliver the flow of the electroless deposition solution to the surface of the substrate as a stream or a spray having a predefined width and a predefined flow velocity, and
a dispense arm, the dispense arm being adjustable by the controller to maneuver the nozzle to direct the stre

Assignees

• Lam Res Corp

Inventors

• Kolics Artur

Classifications

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• H10P90/128

  by edge treatment, e.g. chamfering · CPC title

• H10P72/0476

  comprising at least one plating chamber · CPC title

• H10P52/403

  of conductive or resistive materials · CPC title