Resistance assembly for mobile device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9761355-B2
Application number	US-201514696246-A
Country	US
Kind code	B2
Filing date	Apr 24, 2015
Priority date	Apr 25, 2014
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.

First claim

What is claimed is:

1. A resistance assembly comprising:
a body portion having a first surface and a second surface opposing each other;
a first resistor and a second resistor disposed on the first surface of the body portion and formed integrally with each other;
a first terminal and a third terminal disposed on surfaces of the first resistor and the second resistor, respectively, and separated from each other; and
a second terminal spaced apart from each of the first and third terminals, and connected to the surfaces of the first and second resistors in common,
wherein the first resistor and the second resistor are formed of a same material,
wherein the first terminal and the third terminal are in direct contact with the first resistor and the second resistor, respectively,
wherein the second terming is in direct contact with the resistor and the second resistor in common, and
where the first resistor and the second resistor are forming in a single layer.

2. The resistance assembly of claim 1 , further comprising a protective layer configured to protect the first resistor between the first and second terminals, and protect the second resistor between the second and third terminals.

3. The resistance assembly of claim 1 , wherein the first and third terminals extend from respective surfaces of the first and second resistors to sides of the body portion.

4. A method of manufacturing a resistance assembly, the method comprising:
forming a first resistor and a second resistor integrally with each other on a first surface of a body portion comprising the first surface and a second surface opposing each other;
forming a first terminal and a third terminal on surfaces of the first and second resistors, respectively, and separated from each other; and
forming a second terminal spaced apart from each of the first and third terminals and connected to the surfaces of the first and second resistors in common,
wherein the first resistor and the second resistor are formed of a same material,
wherein the first terminal and the third terminal are in direct contact with the first resistor and the second resistor, respectively,
wherein the second terminal is in direct contact with the first resistor and the second resistor in common, and
wherein the first resistor and the second resistor are formed in a single layer.

5. The method of claim 4 , further comprising, forming a protective layer protecting the first resistor, provided between the first and second terminals, and protecting the second resistor, provided between the second and third terminals.

Assignees

• Samsung Electro Mech

Inventors

• Lee Jea-Hoon
• Choi Woo-Jin
• Kim Young-Key

Classifications

• H01C7/003

  Thick film resistors · CPC title

• H01C17/006

  adapted for manufacturing resistor chips · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H01C13/02

  Structural combinations of resistors · CPC title

• H01C1/01 Primary

  Mounting; Supporting · CPC title