Module board

Patent metadata

Field	Value
Publication number	US-9756718-B2
Application number	US-201414160962-A
Country	US
Kind code	B2
Filing date	Jan 22, 2014
Priority date	Jan 22, 2013
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A module board includes a base substrate. Electronic components are mounted on a first principal surface of the base substrate. The mounted electronic components are sealed by a sealing resin containing an SiO 2 filler. A top surface and side surfaces of the sealing resin are covered with a shield layer containing a carbon filler, which is flat powder, as a conductive component. A terminal electrode is formed on a second principal surface of the base substrate that is disposed opposite to the first principal surface of the base substrate.

First claim

What is claimed is:

1. A module board comprising:
a base substrate;
first and second electronic components each mounted on one of principal surfaces of the base substrate;
a sealing resin formed so as to seal the electronic component mounted on the one of the principal surfaces of the base substrate;
a shield layer covering the sealing resin; and
a shield section containing a metal and provided so as to contact with a portion of the shield layer,
wherein the shield layer is a resin film containing carbon as a conductive component,
wherein the shield section is provided between the sealing resin and the shield layer, and
wherein the shield section is disposed only above the first electronic component, and does not extend to an area above the second electronic component.

2. The module board according to claim 1 , wherein the sealing resin contains an SiO 2 filler.

3. The module board according to claim 2 , wherein a coefficient of linear expansion of the shield layer is about 1 to 15 ppm/° C., and
wherein a coefficient of linear expansion of the sealing resin is about 5 to 20 ppm/° C.

4. The module board according to claim 1 , wherein the carbon is flat powder.

5. The module board according to claim 2 , wherein the carbon is flat powder.

6. The module board according to claim 3 , wherein the carbon is flat powder.

Assignees

• Murata Manufacturing Co

Inventors

• Kataoka Yuji
• Kanryo Koichi

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/0198

  batch processes · CPC title

• H05K1/0218 Primary

  by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence) · CPC title

• H01L2924/00

  Electricity · mapped topic

• H05K2201/0245

  Flakes, flat particles or lamellar particles · CPC title