High density solid state light source array

Patent metadata

Field	Value
Publication number	US-9754807-B2
Application number	US-201414182879-A
Country	US
Kind code	B2
Filing date	Feb 18, 2014
Priority date	Mar 12, 2013
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include: a process chamber body of the semiconductor process chamber; one or more solid state source arrays providing pulsed or continuous energy to the process chamber, wherein each of the one or more solid state source arrays include a substrate having a plurality of solid state light sources disposed on a first surface of the substrate, wherein the plurality of solid state light sources are connected in series and in a recursive pattern on the first surface of the substrate, and a heat sink coupled to a second surface of the substrate configured to remove heat from the substrate; and a power source coupled to the one or more solid state source arrays to electrically power the plurality of solid state sources.

First claim

The invention claimed is:

1. An apparatus for providing pulsed or continuous energy in a semiconductor process chamber, the apparatus comprising:
a process chamber body of the semiconductor process chamber;
one or more solid state source arrays providing pulsed or continuous energy to the semiconductor process chamber, wherein each of the one or more solid state source arrays includes:
a substrate having at least one plurality of solid state light sources disposed on a first surface of the substrate,

wherein each of solid state light sources within the at least one plurality of solid state light sources is connected in series and in a recursive pattern on the first surface of the substrate,
wherein a packing efficiency is greater than 65% of a total surface area of the first surface of the substrate, and wherein a distance between each row of solid state light sources of the at least one plurality of solid state light sources is selected to minimize a current leakage between each row of solid state light sources of the at least one plurality of solid state light sources; and
a heat sink coupled to a second surface of the substrate configured to remove heat from the substrate; and
a power source coupled to one or more solid state source arrays to electrically power the at least one plurality of solid state light sources.

2. The apparatus of claim 1 , further comprising:
a set of electrical connectors electrically coupling the one or more solid state source arrays to the power source, wherein the set of electrical connectors pass through a central opening formed in the heat sink.

3. The apparatus of claim 2 , wherein the at least one plurality of solid state light sources is grouped into groups of solid state light sources.

4. The apparatus of claim 3 , wherein each group of solid state light sources is separately controllable by a controller.

5. The apparatus of claim 1 , wherein the recursive pattern is a serpentine structure including a plurality of rows of solid state light sources, and wherein each row of solid state light sources is electrically coupled to at least one other row of solid state light sources.

6. The apparatus of claim 5 , wherein each row of solid state light sources is spaced from about 0.1 mm and about 0.5 mm apart from each other.

7. The apparatus of claim 1 , further comprising a second plurality of solid state light sources disposed on the first surface of the substrate, wherein the second plurality of solid state light sources are connected in series and in a recursive pattern on the first surface of the substrate.

8. The apparatus of claim 7 , wherein the recursive pattern of second plurality of solid state light sources mirrors the recursive pattern of the at least one plurality of solid state light sources.

9. The apparatus of claim 1 , wherein the at least one plurality of solid state light sources are light emitting diodes (LEDs).

10. The apparatus of claim 9 , wherein each of the LEDs is a wire-bond-free direct attach LED directly attached to the substrate without the use of wire-bonds.

11. The apparatus of claim 9 , wherein each of the LEDs are wire-bonded to the substrate and to at least one other LED.

12. The apparatus of claim 9 , wherein each of the LEDs include a light emitting diode portion, an electrical contact pad, and one or more wire bonds.

13. The apparatus of claim 1 , wherein the at least one plurality of solid state light sources have a switch-on time from about 0.5 nanoseconds to about 10 nanoseconds and a switch-off time from about 0.5 nanoseconds to about 10 nanoseconds.

14. The apparatus of claim 1 , wherein a first end of the at least one plurality of solid state light sources connected in series is a power source wire contact pad configured to receive power from a power source to power the at least one plurality of solid state light sources, and a second end of the at least one plurality of solid state light sources is ground wire contact pad.

15. The apparatus of claim 1 , wherein the substrate has a circular cross section and is configured to connect to lamp sockets used by lamps that are not solid state light sources.

Assignees

• Applied Materials Inc

Inventors

• Gerling John
• Ranish Joseph M
• Serebryanov Oleg V
• Johnson Joseph

Classifications

• H10P72/0436 Primary

  mainly by radiation · CPC title

• C23C16/46

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title

• C23C14/541

  Heating or cooling of the substrates · CPC title

• H01L21/67115 Primary

  Electricity · mapped topic