Film deposition device

Patent metadata

Field	Value
Publication number	US-9752229-B2
Application number	US-201414905123-A
Country	US
Kind code	B2
Filing date	Jun 25, 2014
Priority date	Aug 6, 2013
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A film deposition device including a DMS target and a film-deposition power source, being capable of pre-sputtering the target by use of the film-deposition power source. The film deposition device includes: a film deposition chamber; first and second cathodes each having a target and disposed next to each other wherein surfaces of the target face a substrate; a magnetic-field formation unit forming a magnetic field in vicinity of the target surfaces; a film-deposition power source connected to both of the cathodes; and a shutter. The shutter makes an opening-closing action between a close portion at which the shutter is interposed between the substrate and the target surfaces of both cathodes to block the target surfaces collectively from the substrate and an open position to allow film deposition on the substrate through opening the space between the target surfaces and the substrate.

First claim

The invention claimed is:

1. A film deposition device, comprising:
a film deposition chamber that accommodates a substrate at a specific position;
a first cathode and a second cathode each having a target, the first cathode and the second cathode being disposed next to each other in such an attitude that respective surfaces of the targets face the substrate disposed at the specific position;
one or more magnets that form a magnetic field for magnetron sputtering in the vicinity of the surfaces of the respective targets of the first and second cathodes;
a film-deposition power source that is connected to the first and second cathodes to apply voltage to the first and second cathodes; and
a shutter capable of making an opening-closing action between a closed position at which the shutter is interposed between the substrate and the surfaces of the respective targets of the first and second cathodes to block the surfaces of the respective targets of the first cathode and the second cathode; collectively, from the substrate and an open position at which the shutter opens the space between the substrate and the surfaces of the respective targets of the first and second cathodes to allow film deposition on a surface of the substrate to be performed by the targets, said shutter making said opening and closing action through a rotational movement about a rotational axis located behind one of the first and second targets.

2. The film deposition device according to claim 1 , wherein the first and second cathodes are disposed so as to orient the surfaces of the respective targets of the first and second cathodes in the same direction.

3. The film deposition device according to claim 1 , wherein the shutter includes a pair of opening-closing plates juxtaposed in the same direction as a juxtaposition direction in which the targets of the first and second cathodes are juxtaposed, each of the opening-closing plates being supported by the film deposition chamber so as to be able to make a rotational movement about a rotational axis perpendicular to the juxtaposition direction to move between the open position and the closed position through the rotational movement.

4. The film deposition device according to claim 3 , wherein the rotational axes are set at respective positions on the side opposite to the opening-closing plates across the first and second cathodes.

5. The film deposition device according to claim 1 , wherein a set of the first cathode, the second cathode and the shutter is provided at each of opposite positions opposite to each other across the substrate, in the film deposition chamber.

6. The film deposition device according to claim 1 , further comprising, in addition to the first and second cathodes, a film deposition unit disposed in the film deposition chamber to execute film deposition different from sputtering performed by the first and second cathodes.

7. The film deposition device according to claim 6 , wherein a set of the first cathode, the second cathode and the shutter is provided at each of opposite positions opposite to each other across the substrate, in the film deposition chamber, and wherein the film deposition unit is disposed at a different position different from the opposite positions, the different position surrounding the substrate together with the first and second cathodes.

8. The film deposition device according to claim 1 , further comprising at least one pivot shaft located behind one of the first and second cathodes on a side of the first and second cathodes opposite to said specific position of the substrate, the shutter being connected to the at least one pivot shaft so as to make a rotational movement around the pivot shaft.

9. The film deposition device according to claim 8 , wherein the respective surfaces of the targets face the substrate disposed at the specific position in respective facing directions and the at least one pivot shaft extends perpendicularly to each of the facing directions.

10. The film deposition device according to claim 8 , wherein the film deposition chamber includes a top wall and a bottom wall, and wherein the at least one pivot shaft includes an upper pivot shaft held by the top wall and a lower pivot shaft held by the bottom wall.

11. The film deposition device according to claim 1 , wherein the respective surfaces of the targets face the substrate disposed at the specific position in respective facing directions and the rotational axis of the shutter extends perpendicularly to each of the facing directions.

12. The film deposition device according to claim 11 , wherein each of the facing direction is horizontal and the rotational axis of the shutter extends vertically.

13. The film deposition device according to claim 1 , further comprising a pair of opening-closing support mechanisms disposed in the film deposition chamber to support for the shutter a pair of opening-closing plates, respectively, so as to allow each of the opening-closing plates to make the rotational movement.

14. The film deposition device according to claim 13 , wherein each of the opening-closing support mechanisms includes a pivot shaft located behind one of the first and second cathodes on a side of the first and second cathodes opposite to said specific position of the substrate and a rotative arm linking the pivot shaft and the opening-closing plate so as to allow one of the opening-closing plates to make the rotational movement around the pivot shaft.

15. The film deposition device according to claim 14 , wherein the respective surfaces of the targets face the substrate disposed at the specific position in respective facing directions and the rotational axis of the shutter extends perpendicularly to each of the facing directions.

16. The film deposition device according to claim 15 , wherein each of the facing directions is horizontal and the pivot shaft extends vertically.

Assignees

• Kobe Steel Ltd

Inventors

• Hirota Satoshi

Classifications

• H01J37/3447

  Collimators, shutters, apertures · CPC title

• H01J37/345

  Magnet arrangements in particular for cathodic sputtering apparatus (material of magnets or magnets in general H01F1/00, H01F7/00) · CPC title

• C23C14/352 Primary

  using more than one target (C23C14/56 takes precedence) · CPC title

• H01J37/3405

  Magnetron sputtering · CPC title

• C23C14/35 Primary

  by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)} · CPC title