Plastics bonding systems and methods

US9752059B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9752059-B2
Application numberUS-201514678126-A
CountryUS
Kind codeB2
Filing dateApr 3, 2015
Priority dateNov 16, 2012
Publication dateSep 5, 2017
Grant dateSep 5, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Reactive composition includes a reactive component able to form an adhesive bond between two substrates, at least one of which comprises a plastic material. The substrate may include an initiator on or near the surface thereof. The initiator may be present in the plastic material inherently, by blending in an additive package, through injection molding, or other process. The reactive component may comprise a methylene malonate, a reactive multifunctional methylene, a methylene beta ketoester, a methylene beta diketone. A carrier component for the reactive component may be selected to interact with the plastic substrate to soften and/or penetrate the surface to be bonded. The surface of the plastic may be abraded or otherwise treated to expose the initiator. The reactive component, upon contact with a suitable initiator, is able to polymerize to form an interpenetrating polymer weld.

First claim

Opening claim text (preview).

What is claimed is: 1. A system comprising: a reactive component curable after exposure to a reaction initiator, wherein the reactive component comprises one or more members selected from the group consisting of a methylene malonate component, a methylene beta-ketoester component, a methylene beta-diketone component, and an oligomer or resin thereof; a first substrate formed of a plastic material and comprising the reaction initiator, the reaction initiator incorporated into the first substrate; and wherein the reactive component further comprises a carrier component; and wherein the plastic material and the reaction initiator are different. 2. The system according to claim 1 , wherein the carrier component is partially soluble with the first substrate. 3. The system according to claim 2 , wherein the carrier component comprises an additional reactive component. 4. The system according to claim 1 , wherein the reactive component comprises one or more of a mono-functional and a multifunctional methylene malonate component. 5. The system according to claim 1 , wherein the carrier component comprises one or more members selected from the group consisting of cyanoacrylates, epoxies, urethanes, polyurethanes, acrylics, and silicones. 6. The system according to claim 1 , wherein the reactive component is cured. 7. A bonded article formed from the cured system of claim 1 , further comprising a second substrate, wherein the reactive component is disposed between the first substrate and the second substrate. 8. The bonded article according to claim 7 , wherein the second substrate is formed of a glass material, a metal material, a wood material, or another plastic material. 9. The bonded article according to claim 7 , wherein the first substrate and the second substrate are formed of different materials. 10. A method for bonding a first substrate formed of a plastic material to a second substrate, wherein the first substrate comprises a reaction initiator incorporated into the first substrate, the method comprising: a) providing a reactive component on the surface of the first substrate, the reactive component further comprising a carrier component; b) exposing the reactive component to the reaction initiator; and c) engaging at least a portion of the first substrate with the second substrate to create a bonding engagement; and wherein the reactive component comprises one or more members selected from the group consisting of a methylene malonate component, a methylene beta-ketoester component, a methylene beta-diketone component, and an oligomer or resin thereof; wherein the plastic material and the reaction initiator are different. 11. A kit comprising: a first substrate formed of a plastic material and comprising a reaction initiator, the reaction initiator incorporated into the first substrate; a second substrate; and a plastic bonding adhesive composition comprising a reactive component effective to bond the first substrate to the second substrate upon exposure to the reaction initiator and a carrier component, wherein the reactive component comprises one or more members selected from the group consisting of a methylene malonate component, a methylene beta-ketoester component, a methylene beta-diketone component, and an oligomer or resin thereof; and wherein the plastic material and the reaction initiator are different.

Assignees

Inventors

Classifications

  • Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

  • involving separate application of adhesive ingredients to the different surfaces to be joined · CPC title

  • in the substrate · CPC title

  • at least one layer having inter-reactive properties · CPC title

  • Paper or wood · CPC title

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Frequently asked questions

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What does patent US9752059B2 cover?
Reactive composition includes a reactive component able to form an adhesive bond between two substrates, at least one of which comprises a plastic material. The substrate may include an initiator on or near the surface thereof. The initiator may be present in the plastic material inherently, by blending in an additive package, through injection molding, or other process. The reactive component …
Who is the assignee on this patent?
Sirrus Inc
What technology area does this patent fall under?
Primary CPC classification C09J4/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).