Object processing state sensing using rf radiation
US-2018372656-A1 · Dec 27, 2018 · US
US9750091B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9750091-B2 |
| Application number | US-201213573947-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 15, 2012 |
| Priority date | Oct 15, 2012 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An apparatus for thermal treatment of coatings on substrates includes a microwave applicator cavity; a microwave power supply to deliver power to the cavity; a thermally insulated microwave-transparent compartment within the cavity, large enough to contain the coated substrate while occupying no more than 50% of the total volume of the cavity; a means of supporting the coated substrate within the compartment; an adjustable IR heating source in the compartment and facing the substrate so that a selected amount of IR heating may be applied to the substrate; and, a non-contacting temperature measurement device to measure the temperature of the coating. Related methods for using the apparatus to process different kinds of films are also disclosed.
Opening claim text (preview).
We claim: 1. An apparatus for thermal treatment of coatings on substrates for electronics applications, comprising: a microwave applicator cavity; a microwave power supply to deliver power to said microwave applicator cavity; a thermally insulated microwave-transparent compartment within said microwave applicator cavity, said compartment being large enough to contain said coated substrate while occupying no more than 50% of the total volume of said microwave applicator cavity, wherein said microwave applicator cavity further comprises slots on opposite sides to allow said coated substrate to pass through said microwave applicator cavity; a means of supporting said coated substrate within said compartment; an adjustable IR heating source contained within said compartment and facing said coated substrate so that a selected amount of IR heating may be applied to said coated substrate; wherein the adjustable IR heating source operates independently of said microwave power supply and further comprises a means of adjusting the distance between said coated substrate and said IR heating source according to at least one of a process recipe or a feedback system; and, a non-contacting temperature measurement device to measure the temperature of said coating on said coated substrate. 2. The apparatus of claim 1 wherein said microwave cavity is selected from the group consisting of: multimode cavities and single mode cavities. 3. The apparatus of claim 1 wherein said microwave power supply comprises at least one device selected from the following group: magnetrons, klystrons, gyrotrons, and TWT amplifiers. 4. The apparatus of claim 1 wherein said means of supporting said coated substrate comprises a ceramic supporting structure located within said compartment. 5. The apparatus of claim 1 wherein said non-contacting temperature measurement device comprises at least one device selected from the group consisting of: one-color pyrometers and two-color pyrometers. 6. The apparatus of claim 5 wherein said non-contacting temperature measurement device comprises two pyrometers having different sensitivities to surface emissivity, so that emissivity changes may be detected and used as a process control parameter. 7. The apparatus of claim 1 wherein said coated substrate comprises a continuous film. 8. The apparatus of claim 1 further comprising microwave chokes to reduce the leakage of microwaves from said slots. 9. A method for microwave treatment of a coating on a flexible substrate for use in electronics applications, comprising: a) disposing a flexible substrate having a coating disposed thereon in a thermally insulated, microwave transparent compartment within a microwave applicator cavity, said compartment occupying no more than about 50% of the overall volume of said cavity, said compartment further comprising an adjustable IR heat source; b) supporting said coating on said flexible substrate within said compartment at a selected distance from said IR heat source; c) providing power to said IR heat source to heat said flexible substrate to a first selected temperature, wherein said distance between said substrate and said IR heat source is adjustable; and d) introducing microwave power into said cavity to heat treat said coating on said flexible substrate to a second selected temperature for a selected time, wherein said second selected temperature is higher than said first selected temperature, wherein said flexible substrate comprises a continuous film and said microwave applicator cavity further comprises slots on opposite sides of said cavity to allow said film to pass through said cavity for processing and wherein said power to said IR heat source and said microwave power are independently adjustable. 10. The method of claim 9 wherein said microwave applicator cavity is a multimode cavity. 11. The method of claim 9 wherein said microwave applicator cavity is a single mode cavity and said microwave power is characterized by a single frequency. 12. The method of claim 9 further comprising the step of: e) measuring the temperature of said coating on said substrate using a non-contacting temperature measurement system. 13. The method of claim 12 wherein said temperature measurement system comprises two pyrometers having different sensitivities to surface emissivity, so that emissivity changes may be detected and used as a process control parameter. 14. The method of claim 9 , wherein said coating on said substrate comprises one or more semiconductor materials or thin film coatings used for electronics applications. 15. An apparatus for thermal treatment of coatings on substrates, comprising: a microwave applicator cavity; a microwave power supply to deliver power to the microwave applicator cavity; a thermally insulated microwave-transparent compartment within the microwave applicator cavity, the compartment being large enough to contain a coated substrate while occupying no more than 50% of the total volume of the microwave applicator cavity; a means of supporting the coated substrate within the compartment; an adjustable IR heating source contained within the compartment and facing the coated substrate so that a selected amount of IR heating may be applied to the coated substrate, wherein the adjustable IR heating source is independently controllable from the microwave power supply, and wherein the distance between the coated substrate and the adjustable IR heating source is adjustable; thermal insulation disposed around the adjustable IR heating source to retain heat generated by the adjustable IR heating source; and a non-contacting temperature measurement device to measure the temperature of the coating on the coated substrate.
Microwave drying of wood, ink, food, ceramic, sintering of ceramic, clothes, hair · CPC title
combined with radiant heating, e.g. infrared heating · CPC title
for laboratory use · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.