Hermetically sealed electronic device using solder bonding
US-9205505-B2 · Dec 8, 2015 · US
US9748434B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9748434-B1 |
| Application number | US-201615163543-A |
| Country | US |
| Kind code | B1 |
| Filing date | May 24, 2016 |
| Priority date | May 24, 2016 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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One embodiment can provide a system for curing conductive paste applied on photovoltaic structures. The system can include a wafer carrier for carrying a plurality of photovoltaic structures and a heater. The wafer carrier can include a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating. The heater can be positioned above the wafer carrier. The heater can include a heated radiation surface that does not directly contact the photovoltaic structures.
Opening claim text (preview).
What is claimed is: 1. A method for curing conductive paste applied to two adjacent photovoltaic structures, the method comprising: placing the two adjacent photovoltaic structures on a wafer carrier, wherein the two photovoltaic structures are coupled in a cascaded manner by a conductive paste, where two adjacent edges of the two photovoltaic structures overlap, wherein the wafer carrier includes a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating, and wherein the wafer carrier is placed on a conveyor; and controlling movement of the conveyor to position the wafer carrier to a vicinity of a heating block such that a heated radiation surface of the heating block radiates heat to the photovoltaic structures for a predetermined duration to cure the conductive paste. 2. The method of claim 1 , wherein the surface element of the wafer carrier is made of polybenzimidazole (PBI) plastic. 3. The method of claim 1 , wherein the surface element includes a number of components separated by air gaps to allow an individual component to expand when heated. 4. The method of claim 1 , wherein the heated radiation surface is maintained at a predetermined temperature between 200 and 600° C., and wherein the predetermined duration is between 25 and 60 seconds. 5. The method of claim 1 , wherein the heated radiation surface of the heating block is coated with a substantially dark colored coating. 6. The method of claim 5 , wherein the substantially dark colored coating includes an anodizing coating or a high-emissivity coating, and wherein a thickness of the dark colored coating is between 1 and 100 microns. 7. The method of claim 5 , wherein other surfaces of the heating block are polished or covered with a layer of thermal insulation material. 8. The method of claim 1 , wherein the heating block is made of a material having a thermal conductivity of at least 50 W/(m·k).
Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers · CPC title
mainly by radiation · CPC title
Package configurations · CPC title
Electricity · mapped topic
Electricity · mapped topic
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