Electronic device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9748116-B2
Application number	US-201615200120-A
Country	US
Kind code	B2
Filing date	Jul 1, 2016
Priority date	Jul 2, 2015
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

Various embodiments provide an electronic device, wherein the electronic device comprises a mounting surface configured to mount the electronic device to an external structure and having a first size; a backside electrode having a second size and having arranged thereon a die electrically connected to the backside electrode; wherein the first size is at least three times the second size.

First claim

What is claimed is:

1. An electronic device comprising:
a mounting surface configured to mount the electronic device to an external structure and having a first size;
a backside electrode having a second size and having arranged thereon a die electrically connected to the backside electrode;

wherein the first size is at least three times the second size; and
the electronic device further comprising:
an encapsulation encapsulating at least partially the electronic device wherein the encapsulation is formed by an encapsulation material at least partially forming the backside of the electronic device and
wherein a first encapsulation material covers the backside of the backside electrode and a second encapsulation material covers a frontside of the electronic device.

2. The electronic device according to claim 1 , wherein the first size is at least five times the second size.

3. The electronic device according to claim 1 , wherein the first encapsulation material has a different dielectric constant than the second encapsulation material.

4. The electronic device according to claim 1 , wherein the first encapsulation material has a different specific heat conductivity than the second encapsulation material.

5. The electronic device according to claim 1 , wherein the mounting surface and the backside surface partially overlap in area.

6. An electronic module comprising
an electronic device according to claim 1 , and a heat sink, wherein the mounting surface is mounted on the heat sink.

7. A method of manufacturing an electronic device, the method comprising:
providing a carrier comprising an electrically conductive area, wherein the electrically conductive area has a second size;
mounting a die onto the electrically conductive area; and
at least partially encapsulating the carrier and the die by an encapsulating material forming a mounting surface on a backside of the encapsulated electronic module,
wherein a first encapsulating material forms the mounting surface on the backside of the electronic module and a second encapsulating material forms a frontside of the electronic module
wherein the mounting surface has a first size,
wherein the first size is at least three times the second size.

Assignees

• Infineon Technologies Austria Ag

Inventors

• Otremba Ralf
• Froehler Ulrich
• Grawert Felix
• Katzmaier Ernst
• Kirchner Uwe
• Mente Rene
• Schloegl Andreas
• Wahl Uwe

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W70/481

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title