Systems and methods for enhancing inspection sensitivity of an inspection tool

Patent metadata

Field	Value
Publication number	US-9747520-B2
Application number	US-201615068320-A
Country	US
Kind code	B2
Filing date	Mar 11, 2016
Priority date	Mar 16, 2015
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

Systems and methods for enhancing inspection sensitivity to detect defects in wafers using an inspection tool are disclosed. A plurality of light emitting diodes illuminate at least a portion of a wafer and capture a set of grayscale images. A residual signal is determined in each image of the grayscale image set and the residual signal is subtracted from each image of the grayscale image set. Defects are identified based on the subtracted grayscale image set. Models of the inspection tool and wafer may be built and refined in some embodiments of the disclosed systems and methods.

First claim

What is claimed is:

1. A method for identifying defects in a wafer with an inspection tool comprising:
capturing, using an electronic image capture device of the inspection tool, a grayscale image set of the wafer by:
illuminating at least a portion of the wafer with a blue wavelength light and capturing a first grayscale image;
illuminating at least a portion of the wafer with a red wavelength light and capturing a second grayscale image; and
illuminating at least a portion of the wafer with a green wavelength light and capturing a third grayscale image;

storing the grayscale image set into a computer-readable memory;
determining, using a processor in communication with the computer-readable memory, a residual signal in each of the images of the grayscale image set based on a combination of the images in the grayscale image set;
subtracting, using the processor, the residual signal of each image of the grayscale image set from each image of the grayscale image set; and
identifying, using the processor, a defect in the wafer based on the subtracted grayscale image set.

2. The method of claim 1 , wherein capturing the grayscale image set of the wafer further comprises illuminating at least a portion of the wafer with a combination of blue, red, or green wavelength light and capturing one or more additional grayscale images.

3. The method of claim 1 , further comprising converting the grayscale image set captured by the image capture device using an analog-to-digital converter.

4. The method of claim 1 , wherein the step of determining a residual signal in each of the images of the grayscale image set comprises:
building, using a processor, a rigorous mathematical model of defect detection using the inspection tool;
determining one or more model parameters, using the processor, based on a known standard grayscale image set;
building, using a processor, a model of the wafer using the one or more model parameters, the model based on design values or previously measured values;
predicting, using the model of the wafer, grayscale signals by using the model of the wafer and the rigorous mathematical model;
adjusting one or more parameters of the model of the wafer until a best match is found between the predicted grayscale signals and measured grayscale signals from the wafer;
reporting, using the processor, the one or more parameters corresponding to the best match models as the measured sample parameters;
calculating, using the processor, a residual signal based on differences between the predicted grayscale and measured grayscale on the wafer; and
storing, in computer-readable memory, the calculated residual signal for future defect detection.

5. The method of claim 4 , wherein the known standard grayscale image set is a VLSI thin film standard image set.

6. The method of claim 4 , wherein the variables to be measured are model parameters.

7. The method of claim 1 , further comprising importing wafer information into the computer-readable memory, wherein the step of calculating a residual signal in each of the images of the grayscale image set is further based on the imported wafer information.

8. The method of claim 7 , wherein the wafer information is in GDSII format.

9. The method of claim 7 , wherein the wafer information is automatically imported by the processor.

10. The method of claim 1 , further comprising:
capturing, using the electronic image capture device of the inspection tool, an additional grayscale image set of a wafer after the wafer has been modified;
determining, using the processor in communication with the computer-readable memory, a residual signal in each of the images of the additional grayscale image set based on a combination of the images in the additional grayscale image set;
subtracting, using the processor, the residual signal of each image in the additional grayscale image set from each image in the additional grayscale image set; and
identifying, using the processor, a defect in the wafer based on differences between the grayscale image sets.

11. An enhanced inspection tool system comprising:
a control processor;
an electronic image capture device in electronic communication with the control processor;
a plurality of light emitting diodes, each light emitting diode configured to emit a different wavelength of light, the plurality of light emitting diodes in electronic communication with the control processor;
a computer-readable memory in electronic communication with the image capture device;
an analysis processor in electronic communication with the computer-readable memory;
wherein the control processor is configured to:
instruct the plurality of light emitting diodes to illuminate at least a portion of a wafer with a blue wavelength light and capture a first grayscale image;
instruct the plurality of light emitting diodes to illuminate at least a portion of the wafer with a red wavelength light and capture a second grayscale image; and
instruct the plurality of light emitting diodes to illuminate at least a portion of the wafer with a green wavelength light and capture a third grayscale image;
instruct the electronic image capture device to capture a grayscale image set of a wafer, each image of the set captured while at least a portion of the wafer is illuminated by the plurality of light emitting diodes; and
store the grayscale image set into the computer-readable memory; and

wherein the analysis processor is configured to:
determine a residual signal in each of the images of the grayscale image set retrieved from the computer-readable memory based on a combination of the images in the grayscale image set;
subtract the residual signal of each image of the grayscale image set from each image of the grayscale image set; and
identify a defect in the wafer based on the subtracted grayscale image set.

12. The system of claim 11 , wherein the control processor is further configured to instruct the plurality of light emitting diodes to illuminate at least a portion of the wafer with a combination of blue, red, and green wavelength light and capture an additional grayscale image under the combined light.

13. The system of claim 11 , further comprising an analog-to-digital converter configured to convert the grayscale image set for storage in the computer-readable memory.

14. The system of claim 11 , wherein the analysis processor determines a residual signal in each of the images of the grayscale image set by:
building, using the analysis processor, a rigorous mathematical model of defect detection using the inspection tool;
determining one or more model parameters, using the analysis processor, based on a known standard grayscale image set;
building, using the analysis processor, a model of the wafer using the one or more model parameters, the model based on design values or previously measured values;
predicting, using the model of the wafer, grayscale signals by using the model of the wafer and the rigorous mathematical model;
adjusting one or more parameters of the model of the wafer until a best match is found between the predicted grayscale signals and measured grayscale signals from the wafer;
reporting, using the analysis processor, the one or more parameters corresponding to the best match models as the measured sample parameters;
calculating, using the analysis processor, a residual signal based on differences between the predicted grayscale and measured grayscale on the wafer; and
storing, in the computer-readable memory, the calculated residual signal for future defect detection.

15. The system of claim 11 , wherein

Assignees

• Kla Tencor Corp

Inventors

• Li Shifang
• Wen Youxian
• Schwitalla Sven
• Aji Prashant
• Nicolaides Lena

Classifications

• G06F18/22

  Matching criteria, e.g. proximity measures · CPC title

• G06T7/001 Primary

  using an image reference approach · CPC title

• H04N23/56

  provided with illuminating means · CPC title

• G06T2207/30148

  Semiconductor; IC; Wafer · CPC title

• G06T2207/10024

  Color image · CPC title