Method and System for Positioning Center of V-Type Notch of Wafer, and Computer Storage Medium
US-2024266198-A1 · Aug 8, 2024 · US
US9746321B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9746321-B2 |
| Application number | US-201615041466-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 11, 2016 |
| Priority date | Feb 11, 2015 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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Methods are provided for determining the position of a substrate. The edge diffraction model suitable for the proposed measurement apparatus was mathematically derived, and the effect of the parameters associated with the edge diffraction was investigated. In addition, the fundamental limits are discussed about the linearity and resolution of the sensor by estimating the effects of edge roughness and sharpness of the knife edge on the knife edge diffraction of an incident wave based on Kirchhoff approximation.
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What is claimed: 1. A method of determining the position of a substrate, the method comprising: attaching a first beam blocking component and a second beam blocking component onto the substrate; passing a first light laser beam incident to the first beam blocking component and into a first photodetector, wherein the first beam blocking component intersects the first laser beam to create a blocked portion of the first laser beam and a first diffracted light portion extending past the first beam blocking component and into the first photodetector; passing a second light laser beam incident to the second beam blocking component and into a second photodetector, wherein the second beam blocking component intersects the second laser beam to create a blocked portion of the second laser beam and a second diffracted light portion extending past the second beam blocking component and into the second photodetector; determining a position of the substrate using signals received by at the first photodetector and the second photodetector; and repositioning the substrate based on the position determined. 2. The method of claim 1 , wherein determining the position of the substrate using signals received by at the first photodetector and the second photodetector is performed real-time. 3. The method of claim 1 , wherein repositioning the substrate based on the position determined is performed real-time. 4. The method of claim 1 , wherein determining the position of the substrate using signals received by at the first photodetector and the second photodetector is performed real-time while the substrate is moving. 5. The method of claim 4 , wherein repositioning the substrate based on the position determined is performed real-time while the substrate is moving. 6. The method of claim 1 , wherein the first beam blocking component intersects the first laser beam to bisect the first laser beam into a first direct transverse portion and the first diffracted portion extending past the first beam blocking component and into the first photodetector. 7. The method of claim 6 , wherein the first direct transverse portion and the first diffracted portion are superposed to lead to interference at the first photodetector. 8. The method of claim 7 , wherein the second beam blocking component intersects the second laser beam to bisect the first laser beam into a second direct transverse portion and the second diffracted portion extending past the second beam blocking component and into the second photodetector. 9. The method of claim 8 , wherein the second direct transverse portion and the second diffracted portion are superposed to lead to interference second photodetector. 10. The method of claim 1 , wherein the first beam blocking component is a knife edge or a flange. 11. The method of claim 1 , wherein a first beam blocking component defines a knife edge extending in a first direction. 12. The method of claim 11 , wherein a second beam blocking component defines a knife edge extending in a second direction. 13. The method of claim 12 , wherein a second beam blocking component defines a knife edge extending in a second direction. 14. The method of claim 13 , wherein the first direction is 180° from the second direction. 15. The method of claim 14 , wherein the first direction is parallel to a direction of travel of the substrate. 16. The method of claim 1 , wherein the first beam blocking component is a substrate defining an aperture defining a pinhole or a slit. 17. The method of claim 1 , wherein the second beam blocking component is a substrate defining an aperture defining a pinhole or a slit.
using photoelectric detection means · CPC title
for measuring two or more coordinates · CPC title
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