In-vehicle electronic module

Patent metadata

Field	Value
Publication number	US-9743539-B2
Application number	US-201415100852-A
Country	US
Kind code	B2
Filing date	Nov 17, 2014
Priority date	Dec 27, 2013
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

First claim

The invention claimed is:

1. An in-vehicle electronic module, comprising:
a circuit board on which an electronic component is mounted;
a box type case or a protective member made of mold resin that accommodates and protects the circuit board from surrounding environment; and
a connector accommodating member that is integrally formed with the protective member and has an opening space for accommodating a mating connector,
wherein the in-vehicle electronic module has a connection structure in which an end portion of the circuit board on which the electronic component is not mounted is protruded from the protective member to the opening space of the connector accommodating member and the end portion of the board is inserted into the mating connector to obtain electrical continuity, and
a connection terminal of the board has a structure of Cu wiring/Cu—Sn reaction layer/Sn-based alloy layer containing an Ag—Sn intermetallic compound.

2. The in-vehicle electronic module according to claim 1 , wherein an Sn-based solder layer containing an Ag—Sn intermetallic compound is formed to have a thickness of two times or more a thickness of an underlying Cu wiring of the connection terminal and a reaction layer of Sn.

3. The in-vehicle electronic module according to claim 2 , wherein the connection terminal includes a Cu wiring member formed on an organic insulating substrate, and the reaction layer is a Cu—Sn intermetallic compound.

4. The in-vehicle electronic module according to claim 2 , wherein chemically stable oil that maintains a liquid state under use environment over a long period of time and prevents Sn-based alloy and Cu from being corroded is applied on a surface of the connection terminal.

5. A connector connection structure of an in-vehicle electronic module, which is a contact connection structure that connects the connection terminal of the in-vehicle electronic module according to claim 1 and a connector terminal of a mating connector connected to an external wiring,
wherein an outermost surface of the connector terminal includes a Sn or Sn-based solder layer to cover a contact connecting portion between the connection terminal and the connector terminal, and
chemically stable oil that maintains a liquid state under use environment over a long period of time and prevents Sn-based alloy and Cu from being corroded is applied.

6. A connector connection structure of an in-vehicle electronic module, which is a contact connection structure that connects the connection terminal of the in-vehicle electronic module according to claim 1 and a connector terminal of a mating connector connected to an external wiring,
wherein a surface of the connector terminal includes an Sn-based solder layer containing an Ag—Sn intermetallic compound, and
the Ag—Sn intermetallic compound is formed at a contact interface between the connection terminal and the connector terminal and makes contact connection.

7. The connector connection structure of the in-vehicle electronic module according to claim 6 , wherein a contact connecting portion between the connection terminal of the in-vehicle electronic module and the connector terminal of the mating connector is covered with chemically stable oil that maintains a liquid state under use environment over a long period of time and prevents Sn-based alloy and Cu from being corroded.

8. A method of forming the connection terminal of the in-vehicle electronic module according to claim 1 , comprising:
immersing, in a melting bath filled with Sn-based solder containing Ag of 2 to 10 wt %, and supplying Sn-based solder containing an Ag—Sn intermetallic compound formed on a surface of the connection terminal; and
removing excessive molten solder physically to be adjusted to a predetermined thickness.

9. An in-vehicle electronic module, wherein an outermost surface of a connection terminal inserted into a mating connector to obtain electrical continuity includes a Sn-based solder layer containing an Ag—Sn intermetallic compound.

10. The in-vehicle electronic module according to claim 9 , wherein the Sn-based solder layer containing an Ag—Sn intermetallic compound is formed to have a thickness of two times or more a thickness of a reaction layer of a underlying conductive material member and an Sn of the connection terminal.

11. The in-vehicle electronic module according to claim 9 , wherein the Sn-based solder has an average thickness of 4 μm or more.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Kajiwara Ryouichi
• Kamoshida Masaru
• Ishii Toshiaki

Classifications

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• H05K5/0034

  having an overmolded housing covering the PCB · CPC title

• H05K5/003

  having an integrally preformed housing · CPC title

• B23K1/08

  Soldering by means of dipping in molten solder · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title