Multilayer rigid flexible printed circuit board and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9743529-B2
Application number	US-201314024115-A
Country	US
Kind code	B2
Filing date	Sep 11, 2013
Priority date	Oct 28, 2009
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A multilayer rigid flexible printed circuit board including a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

First claim

What is claimed is:

1. A method for manufacturing a multilayer rigid flexible printed circuit board comprising:
providing a base substrate including a flexible film having a first circuit pattern formed on one or both surfaces thereof, the flexible film having an area corresponding to an area of the multilayer rigid flexible printed circuit board;
forming a laser blocking layer on the first circuit pattern of a flexible region of the base substrate, the laser blocking layer including a copper foil layer;
disposing a plurality of pattern layers on at least one surface of the base substrate having the laser blocking layer formed thereon, each of the pattern layers having an insulator and a second circuit pattern formed on the insulator layer;
disposing an outer pattern layer having a via hole or a through hole formed therein;
performing laser processing to form a window by removing portions of the plurality of pattern layers and the out pattern layers, which are disposed on the flexible region; and
forming an outer circuit pattern by performing copper plating on the laser-processed outer pattern layer and etching portions of the copper plating layer,
wherein the first circuit pattern of the flexible region of the base substrate is protected by the laser blocking layer during the performing laser processing and the flexible region of the base substrate remains in the window after the performing laser processing,
wherein the etching portions of the copper plating layer includes removing a portion of the copper foil layer of the laser blocking layer disposed in the window, and, after the laser processing, a portion of the copper foil layer of the laser blocking layer remains in the rigid region adjacent to the window.

2. The method according to claim 1 , wherein the providing the base substrate including the flexible film having the first circuit pattern formed on the one or both surfaces thereof includes:
providing the flexible film having a copper foil layer disposed on one or both surfaces thereof; and
forming the first circuit pattern by etching the copper foil layer.

3. The method according to claim 1 , wherein the forming the laser blocking layer on the first circuit pattern of the flexible region of the base substrate includes:
coating an adhesive in the flexible region of the base substrate;
forming a polyimide layer on the adhesive; and
forming the copper foil layer on the polyimide layer.

4. The method according to claim 1 , wherein the forming the laser blocking layer on the first circuit pattern of the flexible region of the base substrate includes:
coating an adhesive in the flexible region of the base substrate;
forming a polyimide layer on the adhesive;
disposing an adhesive on the polyimide layer; and
forming the copper foil on the adhesive.

5. The method according to claim 1 , wherein in the disposing the plurality of pattern layers on the at least one surface of the base substrate having the laser blocking layer formed thereon, the plurality of pattern layers are formed by repeating steps of:
forming the insulator;
forming a copper foil layer on the insulator;
forming at least one of a via hole or a through hole in the insulator having the copper foil layer formed thereon; and
forming the second circuit pattern by forming a copper plating layer on an upper surface of the insulator having the via hole or the through hole formed therein and etching portions of the copper plating layer.

6. A method for manufacturing a multilayer rigid flexible printed circuit board comprising:
providing a base substrate including a flexible film having a circuit pattern formed on one or both surfaces thereof, the flexible film having an area corresponding to an area of the multilayer rigid flexible printed circuit board;
forming an electromagnetic shielding layer on the one or both surfaces of the flexible film having the circuit pattern formed thereon to protect the circuit pattern and shield electromagnetic waves;
forming a laser blocking layer on the electromagnetic shielding layer or on the flexible film on which the electromagnetic shielding layer is not formed;
disposing a plurality of pattern layers on one or both surfaces of the base substrate having the laser blocking layer formed thereon;
forming copper foil layers on upper surfaces of the plurality of pattern layers while interposing insulators therebetween and disposing an outer pattern layer having a via hole or a through hole formed therein;
performing laser processing to form a window in the flexible region and a via hole or a through hole of the outer pattern layer; and
forming an outer circuit pattern by performing copper plating on the laser-processed outer pattern layer and etching portions of the copper plating layer.

7. The method according to claim 6 , wherein in the forming the laser blocking layer on the electromagnetic shielding layer or on the flexible film on which the electromagnetic shielding layer is not formed, the laser blocking layer is formed on one or both surfaces of the base substrate.

8. The method according to claim 6 , wherein in the forming the electromagnetic shielding layer on the one or both surfaces of the flexible film having the circuit pattern formed thereon to protect the circuit pattern and shield electromagnetic waves, the electromagnetic shielding layer is formed on one or both surfaces with respect to the base substrate.

9. The method according to claim 6 , wherein the providing the base substrate including the flexible film having the circuit pattern formed on one or both surfaces thereof includes:
providing the flexible film having a copper foil layer disposed on one or both surfaces thereof; and
forming the circuit pattern by etching portions of the copper foil layer.

10. The method according to claim 6 , wherein the forming the laser blocking layer or the electromagnetic shielding layer includes:
disposing an adhesive in the flexible region of the base substrate;
forming a polyimide layer on the adhesive;
disposing an adhesive on the polyimide layer; and
forming a copper foil layer on the adhesive.

11. The method according to claim 6 , wherein the forming the laser blocking layer or the electromagnetic shielding layer includes:
disposing an adhesive in the flexible region of the base substrate;
forming a polyimide layer on the adhesive; and
forming a copper foil layer on the polyimide layer.

12. The method according to claim 11 , wherein the etching portions of the copper plating layer includes removing the copper foil layer of the laser blocking layer disposed in the window, and, after the laser processing, a portion of the copper foil layer of the laser blocking layer remains in the rigid region adjacent to the window.

13. The method according to claim 6 , wherein the laser blocking layer or the electromagnetic shielding layer is extended to a region where at least one of a via hole and a through hole of the pattern layer is formed.

14. The method according to claim 13 , wherein a via hole formed in the electromagnetic shielding layer is formed to an upper portion of the copper foil layer of the electromagnetic shielding layer, and a through hole formed in the laser blocking layer and the electromagnetic shielding layer is formed through the electromagnetic shielding layer, the laser blocking layer, and the base substrate.

15. A method for manufacturing a multilayer rigid flexible printed circuit board comprising:
providing a base substrate including a flexible film having a first circuit pattern formed on one or both surfaces thereof, the flexible film having an a

Assignees

• Samsung Electro Mech

Inventors

• Lee Yang Je
• Yang Dek Gin
• An Dong Gi
• Shin Jae Ho

Classifications

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K2203/1152

  Replicating the surface structure of a sacrificial layer, e.g. for roughening · CPC title

• H05K3/4691

  Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers · CPC title

• Y10T29/49165

  by forming conductive walled aperture in base · CPC title

• Y10T29/49128

  Assembling formed circuit to base · CPC title