Flex-rigid wiring board and method for manufacturing flex-rigid wiring board

US2015114690A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2015114690-A1
Application numberUS-201414522768-A
CountryUS
Kind codeA1
Filing dateOct 24, 2014
Priority dateOct 24, 2013
Publication dateApr 30, 2015
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates.

First claim

Opening claim text (preview).

What is claimed is: 1 . A flex-rigid wiring board, comprising: a flexible substrate; a non-flexible substrate positioned such that the non-flexible substrate is extending in a horizontal direction of the flexible substrate; a first wiring layer formed on first surface sides of the flexible substrate and non-flexible substrate; a second wiring layer formed on second surface sides of the flexible substrate and non-flexible substrate; a first insulating layer covering the f…

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What does patent US2015114690A1 cover?
A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating laye…
Who is the assignee on this patent?
Ibiden Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/028. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).