Radio frequency module

Patent metadata

Field	Value
Publication number	US-9743507-B2
Application number	US-201514698983-A
Country	US
Kind code	B2
Filing date	Apr 29, 2015
Priority date	Nov 29, 2012
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an IC chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies.

First claim

What is claimed is:

1. A radio frequency module comprising:
a stack of a plurality of insulating base material layers defining a multilayer circuit board including a cavity inside thereof;
a component disposed in the cavity and including a noise generation source; and
a ground conductive body having a planar or linear shape and disposed inside the multilayer circuit board; wherein
the insulating base material layer is a layer made of a thermoplastic resin having flowability during heating and pressurizing;
the ground conductive body is disposed on a layer not exposed to an inner surface of the cavity;
the radio frequency module includes an inter-layer connection conductive body electrically connected to the ground conductive body but not electrically connected to a conductive body portion provided in the component and disposed at a position opposite to a local portion of the component, the inter-layer connection conductive body protruding in a direction of the cavity from the ground conductive body, and all portions of the inter-layer connection conductive body being covered by the component in a planar view in a stacking direction of the multilayer circuit board; and
no conductive body having a planar or linear shape, being connected to the inter-layer connection conductive body, and being nearer to the component than the inter-layer connection conductive body is provided.

2. The radio frequency module according to claim 1 , wherein the ground conductive body is a planar ground conductive body extending in a planar manner in a layer direction of the insulating base material layers.

3. The radio frequency module according to claim 2 , wherein
the planar ground conductive body includes at least two planar ground conductive bodies sandwiching the cavity in the layer direction;
the inter-layer connection conductive body includes at least two inter-layer connection conductive bodies; and
the inter-layer connection conductive bodies protrude in a direction of the cavity from the two planar ground conductive bodies.

4. The radio frequency module according to claim 1 , wherein the local portion of the component is located at a position of the noise generation source in the component.

5. The radio frequency module according to claim 1 , wherein the noise generation source is an oscillation circuit.

6. The radio frequency module according to claim 1 , wherein a thickness of the inter-layer connection conductive body increases from the ground conductive body towards the cavity.

7. The radio frequency module according to claim 1 , wherein the component is an IC chip.

8. The radio frequency module according to claim 1 , wherein the inter-layer connection conductive body is a conductive via hole.

9. The radio frequency module according to claim 1 , wherein the ground conductive body includes first and second ground conductive bodies, the inter-layer connection conductive body protrudes in a direction of the component from the first ground conductive body, and no inter-layer connection conductive body protrudes in a direction of the component from the second ground conductive body.

10. The radio frequency module according to claim 1 , wherein the inter-layer connection conductive body includes a hole extending only partially through the base material layers and including a conductive paste in the hole.

11. The radio frequency module according to claim 1 , wherein the inter-layer connection conductive body is one of a plated through hole, a metal rivet, and a conductive bump.

Assignees

• Murata Manufacturing Co

Inventors

• Tago Shigeru

Classifications

• H10W72/9413

  on encapsulations · CPC title

• H10W44/209

  Vertical interconnections, e.g. vias · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title