RFID tag and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9740976-B2
Application number	US-201615012967-A
Country	US
Kind code	B2
Filing date	Feb 2, 2016
Priority date	Aug 15, 2013
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

An RFID tag includes a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface. The RFID tag further includes a metal layer provided on the first surface, a semiconductor chip provided on the second surface, and a dipole antenna provided on the second surface and electrically connected to the semiconductor chip. One of the metal layer and the dipole antenna is folded at folded parts at the pair of end parts, and the metal layer and the dipole antenna overlap at the folded parts.

First claim

What is claimed is:

1. An RFID tag comprising:
a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface;
a first metal layer provided on the first surface;
a semiconductor chip provided on the second surface and having a communication part;
an insulator layer provided on the second surface and covering the semiconductor chip, the insulator layer having a third surface opposing the second surface and a fourth surface on an opposite side from the third surface; and
a dipole antenna provided between the second surface and the third surface, the dipole antenna being electrically connected to the semiconductor chip, the dipole antenna includes folded parts that are folded with respect to the core at the pair of end parts, and the folded parts of the dipole antenna overlap the first metal layer.

2. The RFID tag as claimed in claim 1 , wherein the first metal layer is made of tin, zinc, lead, indium, or an alloy including at least one of these metals.

3. The RFID tag as claimed in claim 1 , wherein the folded parts of the dipole antenna are adhered to the first metal layer.

4. The RFID tag as claimed in claim 1 , wherein the dipole antenna is formed by a second metal layer made of a metal different from the first metal layer.

5. The RFID tag as claimed in claim 4 , wherein the second metal layer is made of copper, silver, gold, or aluminum.

6. The RFID tag as claimed in claim 4 ,
wherein the insulator layer has a pattern of the second metal layer formed on the third surface, and
wherein the semiconductor chip is provided on the third surface and is electrically connected to the pattern of the second metal layer.

7. The RFID tag as claimed in claim 6 , wherein the insulator layer includes folded parts that are folded with respect to the core at the pair of end parts, and the folded parts of the insulator overlap the first metal layer.

8. The RFID tag as claimed in claim 7 , wherein the first metal layer at the pair of end parts is interposed between the first surface and the folded parts of the insulator layer and the dipole antenna.

9. The RFID tag as claimed in claim 7 , wherein the folded parts of the insulator layer and the dipole antenna are interposed between the first surface and the first metal layer at the pair of end parts.

10. The RFID tag as claimed in claim 6 , further comprising:
a protection member covering the folded parts of the dipole antenna, the insulator layer, and the first metal layer.

11. The RFID tag as claimed in claim 10 , further comprising:
a filler material formed by a second elastic material and filling a space surrounded by the protection member.

12. The RFID tag as claimed in claim 10 , wherein the protection member encapsulates the core, the first metal layer, the semiconductor chip, the insulator layer, and the dipole antenna.

13. The RFID tag as claimed in claim 6 , further comprising:
an adhesive layer provided between the second layer and the third layer,
wherein the semiconductor chip is embedded in the adhesive layer.

14. The RFID tag as claimed in claim 1 , wherein the first elastic material is a dielectric.

15. A manufacturing method of an RFID tag, comprising:
forming the RFID tag comprising a metal layer provided on a first surface of a core, a semiconductor chip provided on a second surface of the core on an opposite side from the first surface, an insulator layer provided on the second surface and covering the semiconductor chip, the insulator layer having a third surface opposing the second surface and a fourth surface on an opposite side from the third surface, and a dipole antenna provided between the second surface and the third surface, the dipole antenna being electrically connected to the semiconductor chip, the dipole antenna is folded at folded parts at a pair of end parts of the core, and the dipole antenna at the folded parts overlaps the metal layer;
inserting the RFID tag into a first protection member; and
adhering a second protection member on the first protection member, to encapsulate the RFID tag in a space formed within the first and second protection members.

16. The manufacturing method of the RFID tag as claimed in claim 15 , further comprising:
filling a filler material in a gap between the RFID tag and the first and second protection members.

17. The manufacturing method of the RFID tag as claimed in claim 15 , wherein:
the core is formed by an elastic material;
the metal layer is formed by tin, zinc, lead, indium, or an alloy including at least one of these metals; and
the dipole antenna is formed by a metal pattern formed on an insulator layer and made of copper, silver, gold, or aluminum.

18. An RFID tag comprising:
a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface;
a first metal layer provided on the first surface;
a semiconductor chip provided on the second surface and having a communication part;
an insulator layer provided on the second surface and covering the semiconductor chip, the insulator layer having a third surface opposing the second surface and a fourth surface on an opposite side from the third surface; and
a dipole antenna provided between the second surface and the third surface, the dipole antenna being electrically connected to the semiconductor chip,
the insulator layer and the dipole antenna include folded parts that are folded with respect to the core at the pair of end parts, and the folded parts of the insulator layer and the dipole antenna overlap the first metal layer.

19. An RFID tag comprising:
a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface;
a first metal layer provided on the first surface;
a semiconductor chip provided on the second surface and having a communication part;
an insulator layer provided on the second surface and covering the semiconductor chip, the insulator layer having a third surface opposing the second surface and a flat and continuous fourth surface on an opposite side from the third surface; and
a dipole antenna provided between the second surface and the third surface, the dipole antenna being electrically connected to the semiconductor chip,
the first metal layer includes folded parts that are folded with respect to the core at the pair of end parts, and the folded parts of the first metal layer overlap the dipole antenna.

20. The RFID tag as claimed in claim 19 , wherein the folded parts of the first metal layer are provided on the fourth surface of the insulator layer or interposed between the second surface of the core and the third surface of the insulator layer.

21. The RFID tag as claimed in claim 20 , further comprising:
a protection member covering the folded parts of the first metal layer, and at least one of the insulator layer and the first metal layer.

22. The RFID tag as claimed in claim 21 , wherein the protection member is made of elastomer.

23. The RFID tag as claimed in claim 20 , wherein the insulator

Assignees

• Fujitsu Ltd

Inventors

• Ozaki Noritsugu
• Baba Shunji
• Matsumura Takayoshi

Classifications

• G06K19/0723 Primary

  the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs · CPC title

• H01Q1/2208 Primary

  associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems (methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00) · CPC title

• H01Q7/00

  Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title

• G06K19/07786

  the antenna being of the HF type, such as a dipole · CPC title

• G06K19/022

  Processes or apparatus therefor · CPC title