Transponder label resistant to high temperatures

Patent metadata

Field	Value
Publication number	US-9317801-B2
Application number	US-201414566925-A
Country	US
Kind code	B2
Filing date	Dec 11, 2014
Priority date	Dec 19, 2013
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A transponder label resistant to high temperatures includes a transponder arrangement, an adhesive layer for adhesively attaching the transponder label to an electrically conductive substrate, and a spacer layer on which the transponder arrangement is disposed, to space it apart from the conductive substrate. The adhesive layer and the spacer layer each have a material that is temperature-resistant, in such a manner that the size of a surface area of the transponder label, which area covers the conductive substrate after the transponder label is adhesively attached to the conductive substrate, remains unchanged when the transponder label, after having been adhesively attached to the conductive substrate, is heated from a starting temperature below 125° C. to a higher temperature between 125° C. and 400° C., and, after having been heated, is cooled down to the starting temperature.

First claim

What is claimed is:

1. A temperature-resistant transponder label comprising:
(a) a transponder arrangement having a chip and an antenna structure connected to the chip;
(b) a first adhesive layer for adhesively attaching the transponder label to an electronically conductive subsurface; and
(c) a spacer layer for spacing the transponder arrangement apart from the conductive subsurface, wherein the spacer layer has an underside, the first adhesive layer is disposed on the underside, and the transponder arrangement is disposed on the spacer layer; wherein the spacer layer has a spacer layer material that is temperature-resistant so that a surface area of the transponder label covering the conductive subsurface after the transponder label has been adhesively attached to the conductive subsurface has a size that remains unchanged following heating of the transponder label from a starting temperature of from 5° to a temperature less than 125° C. to a higher temperature between 125° C. and 400° C. and, after heating, cooling of the transponder label to the starting temperature; and wherein the first adhesive layer has a first adhesive layer material that is temperature-resistant so that loosening of the first adhesive layer from the conductive subsurface is prevented when the transponder label has been adhesively attached to the conductive subsurface and the transponder label, after having been adhesively attached to the conductive subsurface, is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature.

2. The transponder according to claim 1 , wherein the first adhesive layer material is temperature-resistant so that melting of the first adhesive layer is prevented when the transponder label has been adhesively attached to the conductive subsurface, and, after having been adhesively attached to the conductive subsurface, is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature.

3. The transponder label according to claim 1 , wherein the first adhesive layer material has an adhesive layer material expansion coefficient and the spacer layer material has a spacer layer material expansion coefficient and the adhesive layer material expansion coefficient and the spacer layer material expansion coefficient are coordinated with one another so that a tension between the first adhesive layer and the spacer layer is prevented, when the transponder label has been adhesively attached to the conductive subsurface, and, after having been adhesively attached to the conductive subsurface, is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature.

4. The transponder label according to one of claim 1 , wherein the spacer layer material is configured so that a crack within the spacer layer is prevented when the transponder label has been adhesively attached to the conductive subsurface, and, after having been adhesively attached to the conductive subsurface, is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature.

5. The transponder label according to claim 1 , wherein the spacer layer material contains at least one of a polyamide, a polytetrafluoroethylene, a polyurethane, and an acrylate.

6. The transponder label according to claim 1 , wherein the spacer layer is configured as a panel that contains polyurethane.

7. The transponder label according to claim 1 , wherein the first adhesive layer material contains at least one of an acrylate and a natural rubber.

8. The transponder layer according to claim 7 , wherein the acrylate is a modified acrylate.

9. The transponder label according to claim 1 , wherein the first adhesive layer has a thickness between 5 μm and 200 μm.

10. The transponder label according to claim 1 , further comprising:
a transponder protection layer disposed above the transponder arrangement for protecting the transponder arrangement; and
a second adhesive layer that is disposed between the spacer layer and the transponder protection layer;
wherein the transponder protection layer contains a material that prevents a crack from occurring within the transponder protection layer when the transponder label has been adhesively attached to the conductive subsurface and, after being adhesively attached to the conductive subsurface, is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature; and
wherein the second adhesive layer contains a second adhesive layer material that is temperature-resistant so that loosening of the transponder protection layer from the spacer layer and the transponder arrangement is prevented when the transponder label has been adhesively attached to the conductive subsurface, and, after having been adhesively attached to the conductive subsurface, is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature.

11. The transponder label according to claim 10 , further comprising:
a paint protection layer disposed above the transponder protection layer for protecting the transponder protection layer during painting over the transponder label; and
a third adhesive layer that is disposed between the paint protection layer and the transponder protection layer;
wherein the third adhesive layer contains a third adhesive layer material that is temperature-resistant so that loosening of the paint protection layer from the transponder protection layer is prevented when the transponder label has been adhesively attached to the conductive subsurface, and the conductive subsurface is heated from the starting temperature to the higher temperature, and, after heating, is cooled down to the starting temperature.

12. The transponder label according to claim 11 , wherein the transponder protection layer is imprintable or inscribable by a laser.

13. The transponder label according to claim 11 , wherein the first adhesive layer has a first adhesive strength, the second adhesive layer has a second adhesive strength and the third adhesive layer has a third adhesive strength;
wherein the third adhesive strength is lower than the second adhesion strength; and
wherein the third adhesion strength is lower than the first adhesion strength.

14. The transponder label according to claim 1 , wherein the antenna structure has a first part that is disposed on a top side of the spacer layer, and a second part, electrically or mechanically connected with the first part, and is disposed on the underside.

15. A method for marking an electrically conductive subsurface to be painted with a transponder label, said method comprising the following steps:
(a) providing a temperature-resistant transponder label comprising a transponder arrangement having a chip and an antenna structure connected to the chip, a first adhesive layer for adhesively attaching the transponder label to an electrically conductive subsurface, and a spacer layer for spacing the transponder arrangement apart from the conductive subsurface, wherein the spacer layer has an underside, the first adhesive layer is disposed on the underside, and the transponder arrangement is disposed on the spacer layer, wherein the spacer layer has a spacer layer material that is temperature-resistant so that a surface area of the transponder label covering the conductive subsurface after the transponder label has been adhesively attached to the conductive subsurface has a siz

Assignees

• Schreiner Group Gmbh & Co Kg

Inventors

• Hoelzl Gerhard
• Becker Johannes

Classifications

• B32B38/10

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• G06K19/07771

  the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object · CPC title

• B32B37/12

  characterised by using adhesives · CPC title

• B32B2307/306

  Resistant to heat · CPC title

• G06K19/02 Primary

  characterised by the selection of materials, e.g. to avoid wear during transport through the machine · CPC title